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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
20163D TSV based high frequency components for RF IC and RF MEMS applications
Fernandez-Bolanos, M.; Vitale, W.A.; López, M.M.; Ionescu, A.M.; Klumpp, A.; Merkel, R.; Weber, J.; Ramm, P.; Ocket, I.; Raedt, W. de; Enayati, A.
Conference Paper
2015Fine pitch 3D-TSV based high frequency components of RF MEMS applications
Vitale, W.A.; Fernandez-Bolanos, M.; Merkel, R.; Enayati, A.; Ocker, I.; Raedt, W. de; Weber, J.; Ramm, P.; Ionescu, A.M.
Conference Paper