Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2009Design study of the bump on flexible lead by FEA for wafer level packaging
Eidner, I.; Wunderle, B.; Pan, K.L.; Wolf, M.J.; Ehrmann, O.; Reichl, H.
Conference Paper
2009Electrical modeling and analysis of the impact of slits on microstrip lines in thin film polymer layers
Ndip, I.; Töpper, M.; Becker, K.-F.; Hirte, M.; Eidner, I.; Fischer, T.; Curran, B.; Bauer, J.; Scheel, W.; Guttowski, S.; Reichl, H.
Conference Paper
2008Bump on flexible lead for wafer level packaging
Eidner, I.; Buschick, K.; Dietrich, L.; Pan, K.L.; Minkus, M.; Wolf, M.J.; Ehrmann, O.; Reichl, H.
Conference Paper