Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Advanced through silicon vias for hybrid pixel detector modules
Hügging, F.; Owtscharenko, N.; Pohl, D.-L.; Wermes, N.; Ehrmann, O.; Fritzsch, T.; Mackowiak, P.; Oppermann, H.; Rothermund, M.; Zoschke, K.
Journal Article
20183D wire - a novel approach for 3D chips interconnection for harsh environment applications
Bickel, Jan; Pohl, Olaf; Ngo, Ha-Duong; Hu, Xiaodong; Weiland, Thomas; Mackowiak, Piotr; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Conference Paper
2018Design and application of a high-g piezoresistive acceleration sensor for high-impact application
Hu, Xiaodong; Mackowiak, Piotr; Bäuscher, Manuel; Ehrmann, Oswin; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Linke, Stefan; Ngo, Ha-Duong
Journal Article
2018Full wafer redistribution and wafer embedding as key technologies for a multi-scale neuromorphic hardware cluster
Zoschke, Kai; Güttler, M.; Böttcher, L.; Grübl, A.; Husmann, D.; Schemmel, J.; Meier, K.-H.; Ehrmann, O.
Conference Paper
2018A Novel Low Cost Wireless Incontinence Sensor System (Screen- Printed Flexible Sensor System) For Wireless Urine Detection In Incontinence Materials
Ngo, Ha-Duong; Hoang, Thanh Hai; Bäuscher, Manuel; Mackowiak, Piotr; Grabbert, Nils; Weiland, Thomas; Ehrmann, Oswin; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Grudno, Jens
Conference Paper, Journal Article
2018Piezoresistive pressure sensors for applications in harsh environments - a roadmap
Ngo, Ha Duong; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Book Article
2018Silicon micro piezoresistive pressure sensors
Ngo, Ha Duong; Mackowiak, Piotr; Ehrmann, Oswin; Lang, Klaus-Dieter
Book Article
2018Stress-free bonding technology with bondable thin glass layer for MEMS based pressure sensor
Hu, Xiaodong; MacKowiak, P.; Zhang, Y.; Ehrmann, O.; Lang, K.-D.; Schneider-Ramelow, M.; Hansen, U.; Maus, S.; Gyenge, O.; Meng, M.; Ngo, H.-D.
Conference Paper
2017A novel wafer-level packaging method for a direct-backside-exposure pressure sensor anodically bonded to a silicon-interposer with a thin-film glass layer
Hu, X.; Bäuscher, M.; Mukhopadhyay, B.; Mackowiak, P.; Ehrmann, O.; Lang, K.-D.; Fritz, M.; Hansen, U.; Maus, S.; Gyenge, O.; Ngo, H.-D.
Conference Paper
2017The roadmap of development of piezoresistive micro mechanical sensors for harsh environment applications
Ngo, Ha-Duong; Mackowiak, Piotr; Grabbert, Niels; Weiland, Thomas; Hu, Xiaodong; Schneider-Ramelow, Martin; Ehrmann, Oswin; Lang, Klaus-Dieter
Conference Paper
2016Characterization of anodic bondable LTCC for wafer-level packaging
Hu, Xiaodong; Bäuscher, Manuel; MacKowiak, Piotr; Zhang, Yucheng; Hoelck, Ole; Walter, Hans; Ihle, Martin; Ziesche, Steffen; Hansen, Ulli; Maus, Simon; Gyenge, Oliver; Mukhopadhyay, Biswajit; Ehrmann, Oswin; Lang, Klausdieter; Ngo, Haduong
Conference Paper
2016Development and fabrication of a very high-g sensor for very high impact applications
Mackowiak, P.; Mukhopadhyay, B.; Hu, X.; Ehrmann, O.; Lang, K.-D.; Linke, S.; Chu, A.; Ngo, H.-D.
Conference Paper
2016Development of a novel high reliable Si-based trace humidity sensor array for aerospace and process industry
Zhou, Shuyao; Dao, Q.C.; Mukhopadhyay, Biswajit; Mackowiak, Piotr; Ehrmann, Oswin; Lang, Klaus-Dieter; Woratz, Michael; Herrmann, Peter; Weiland, T.; Pohl, Olaf; Noack, Volker; Ngo, Ha Duong
Journal Article
2016Embedding of wearable electronics into smart sensor insole
Hubl, M.; Pohl, O.; Noack, V.; Hahlweg, P.; Ehm, C.; Derleh, M.; Weiland, T.; Schick, E.; Müller, H.-H.; Hampicke, D.; Gregorius, P.; Schwartzinger, T.; Jablonski, T.; Maurer, J.-P.; Hahn, R.; Ehrmann, O.; Lang, K.-D.; Shin, E.; Ngo, H.-D.
Conference Paper
2016Energy-autarkic smart sensor insole for telemedical patient monitoring
Hubl, M.; Weiland, T.; Pohl, O.; Noack, V.; Schlegel, J.; Müller, H.-H.; Hampicke, D.; Gregorius, P.; Hahn, R.; Ehrmann, O.; Lang, K.-D.; Shin, E.; Ngo, H.-D.
Conference Paper
2016Gold TSVs (Through Silicon Vias) for High-Frequency III-V Semiconductor Applications
Kroehnert, K.; Glaw, V.; Engelmann, G.; Jordan, R.; Samulewicz, K.; Hauck, K.; Cronin, R.; Robertson, M.; Ehrmann, O.; Lang, K.-D.
Conference Paper
2016Investigation of residual stress effect during the anodic bonding process with different bondable materials for wafer level packaging design
Hu, X.; Meng, M.; Baeuscher, M.; Hansen, U.; Maus, S.; Gyenge, O.; Mackowiak, P.; Mukhopadhyay, B.; Vokmer, N.; Ehrmann, O.; Dieter Lang, K.; Ngo, H.-D.
Conference Paper
2016Packaging solution for a novel silicon-based trace humidity sensor using coulometric method
Mackowiak, Piotr; Mukhopadhyay, Biswajit; Ehrmann, Oswin; Lang, Klaus-Dieter; Woratz, Michael; Herrmann, Peter; Pohl, Olaf; Noack, Volker; Zhou, Suyao; Dao, Quoc Cuong; Hoang, Thanh Hai; Ngo, Ha-Duong
Conference Paper
2016A thermally enhanced bond interface for pixelated LEDs in adaptive front lighting systems
Oppermann, H.; Brink, M.; Ehrmann, O.; Groetsch, S.; Plößl, A.; Pfeuffer, A.; Malm, N. von; Groß, T.; Fiederling, R.; Kürschner, R.; Lang, K.-D.
Conference Paper
2016A WSi-WSiN-Pt metallization scheme for silicon carbide-based high temperature microsystems
Ngo, H.-D.; Mukhopadhyay, B.; Mackowiak, P.; Kröhnert, K.; Ehrmann, O.; Lang, K.-D.
Journal Article
2015Advanced liquid-free, piezoresistive, SOI-based pressure sensors for measurements in harsh environments
Ngo, H.D.; Mukhopadhyay, B.; Ehrmann, O.; Lang, K.D.
Journal Article
2015HIPIMS in full face erosion circular cathode for semiconductor applications
Bellido-Gonzalez, V.; Papa, F.; Azzopardi, A.; Brindley, J.; Li, H.; Vetushka, A.; Kroehnert, K.; Ehrmann, O.; Lang, K.-D.; Mackowiak, P.; Fernandez, I.; Wennberg, A.; Ngo, H.D.
Conference Paper
2015Investigation of DRIE etching performance on signal quality of a SOI based pressure sensors for harsh environments
Mackowiak, Piotr; Meinecke, Fabian; Mukhopadhyay, Biswajit; Hoang, Thanh Hai; Dao, Quoc-Cuong; Ehrmann, Oswin; Lang, Klaus-Dieter; Ngo, Ha-Duong
Conference Paper
2015Plasma enhanced atomic layer deposition by means of an Anode Layer Ion Source for electronics packaging applications
Bellido-Gonzalez, V.; Monaghan, D.; Daniel, B.; Li, Heqing; Papa, Frank; Kröhnert, Kevin; Ehrmann, Oswin; Lang, Klaus-Dieter; Mackowiak, Piotr; Ngo, Ha-Duong
Conference Paper
2014Evaluation and signal conditioning of piezoresistive silicon pressure sensor
Gao, X.; Mackowiak, P.; Mukhopadhyay, B.; Ehrmann, O.; Lang, K.-D.; Ngo, H.-D.
Conference Paper
2014Flip chip assembly of thinned chips for hybrid pixel detector applications
Fritzsch, T.; Zoschke, K.; Woehrmann, M.; Rothermund, M.; Huegging, F.; Ehrmann, O.; Oppermann, H.; Lang, K.D.
Journal Article, Conference Paper
2014Wireless pressure sensor system
Gao, X.; Mackowiak, P.; Mukhopadhyay, B.; Ehrmann, O.; Lang, K.D.; Ngo, H.D.
Conference Paper
2013An advanced MEMS sensor packaging concept for use in harsh environments
Berg, Jochen von; Cavalloni, Claudio; Mukhopadhyay, Biswajit; Mackowiak, Piotr; Ehrmann, Oswin; Lang, Klaus-Dieter; Ngo, Ha Duong
Conference Paper
2013Packaging and modular assembly of large-area and fine-pitch 2-D ultrasonic transducer arrays
Lin, D.-S.; Wodnicki, R.; Zhuang, X.; Woychik, C.; Thomenius, K.E.; Fisher, R.A.; Mills, D.M.; Byun, A.J.; Burdick, W.; Khuri-Yakub, P.; Bonitz, B.; Davies, T.; Thomas, G.; Otto, B.; Töpper, M.; Fritzsch, T.; Ehrmann, O.
Journal Article
2013Silicon interposers with TSVs - a basis for wafer level 3D system integration
Zoschke, Kai; Wolf, J.; Ehrmann, Oswin; Lang, Klaus-Dieter
Conference Paper
2012Copper filling of TSVs for interposer applications
Jurgensen, N.; Huynh, Q.H.; Engelmann, G.; Ngo, H.-D.; Ehrmann, O.; Lang, K.-D.; Uhlig, A.; Dretschkow, T.; Rohde, D.; Worm, O.; Jager, C.
Conference Paper
2012Innovation driver of the next decade: Heterogeneous integration
Lang, Klaus-Dieter; Pötter, Harald; Aschenbrenner, Rolf; Becker, Karl-Friedrich; Boettcher, Lars; Ehrmann, Oswin; Wilke, Martin; Toepper, Michael
Journal Article
2012Innovation Driver of the Next Decade: Technology Follows Application
Lang, K.-D.; Pötter, H.; Aschenbrenner, R.; Becker, K.-F.; Boettcher, L.; Ehrmann, O.; Wilke, M.; Toepper, M.
Book Article
2012Packaged BiCMOS embedded RF-MEMS switches with integrated inductive loads
Kaynak, M.; Wietstruck, M.; Zhang, W.; Drews, J.; Barth, R.; Knoll, D.; Korndorfer, F.; Scholz, R.; Schulz, K.; Wipf, C.; Tillack, B.; Kaletta, K.; Suchodoletz, M.V.; Zoschke, K.; Wilke, M.; Ehrmann, O.; Ulusoy, A.C.; Purtova, T.; Liu, G.; Schumacher, H.
Conference Paper
2012Polyimide based temporary wafer bonding technology for high temperature compliant TSV backside processing and thin device handling
Zoschke, K.; Fischer, T.; Töpper, M.; Fritzsch, T.; Ehrmann, O.; Itabashi, T.; Zussman, M.P.; Souter, M.; Oppermann, H.; Lang, K.-D.
Conference Paper
2012Prototype ATLAS IBL modules using the FE-I4A front-end readout chip
Albert, J.; Alex, M.; Alimonti, G.; Allport, P.; Altenheiner, S.; Ancu, S.; Andreazza, A.; Arguin, J.; Arutinov, D.; Backhaus, M.; Bagolini, A.; Ballansat, J.; Barbero, M.; Barbier, G.; Bates, R.; Battistin, M.; Baudin, P.; Beau, T.; Beccherle, R.; Beck, H.; Benoit, M.; Bensinger, J.; Bomben, M.; Borri, M.; Boscardin, M.; Direito, J.B.; Bousson, N.; Boyd, R.G.; Breugnon, P.; Bruni, G.; Bruschi, M.; Buchholz, P.; Buttar, C.; Cadoux, F.; Calderini, G.; Caminada, L.; Capeans, M.; Casse, G.; Catinaccio, A.; Cavalli-Sforza, M.; Chauveau, J.; Chu, M.; Ciapetti, M.; Cindro, V.; Citterio, M.; Clark, A.; Cobal, M.; Coelli, S.; Colijn, A.; Colin, D.; Collot, J.; Crespo-Lopez, O.; Dalla Betta, G.; Darbo, G.; DaVia, C.; David, P.; Debieux, S.; Delebecque, P.; Devetak, E.; DeWilde, B.; Di Girolamo, B.; Dinu, N.; Dittus, F.; Diyakov, D.; Djama, F.; Dobos, D.; Doonan, K.; Dopke, J.; Dorholt, O.; Dube, S.; Dushkin, A.; Dzahini, D.; Egorov, K.; Ehrmann, O.; Elldge, D.; Elles, S.; Elsing, M.; Eraud, L.; Ereditato, A.
Journal Article
2012RF-MEMS switch module in a 0.25 µm BiCMOS technology
Kaynak, M.; Wietstruck, M.; Zhang, W.; Drews, J.; Scholz, R.; Knoll, D.; Korndörfer, F.; Wipf, C.; Schulz, K.; Elkhouly, M.; Kaletta, K.; Suchodoletz, M.V.; Zoschke, K.; Wilke, M.; Ehrmann, O.; Mühlhaus, V.; Liu, G.; Purtova, T.; Ulusoy, A.C.; Schumacher, H.; Tillack, B.
Conference Paper
2012Wafer level 3D system integration based on silicon interposers with through silicon vias
Zoschke, Kai; Oppermann, Hermann; Manier, Charles-Alix; Ndip, Ivan; Puschmann, René; Ehrmann, Oswin; Wolf, Jürgen; Lang, Klaus-Dieter
Conference Paper
2011Cost effective flip chip assembly and interconnection technologies for large area pixel sensor applications
Fritzsch, T.; Jordan, R.; Oppermann, H.; Ehrmann, O.; Töpper, M.; Baumgartner, T.; Lang, K.-D.
Journal Article
2011MEMS module integration into SiGe BiCMOS technology for embedded system applications
Kaynak, M.; Wietstruck, M.; Zhang, W.; Drews, J.; Knoll, D.; Korndörfer, F.; Wipf, C.; Schulz, K.; Suchodoletz, M.V.; Zoschke, K.; Kaletta, K.; Ehrmann, O.; Leidich, S.; Kurth, S.; Tillack, B.
Conference Paper
2011MEMS module integration into SiGe BiCMOS technology for embedded system applications
Kaynak, M.; Wietstruck, M.; Zhang, W.; Scholz, R.; Drews, J.; Marschmeyer, S.; Knoll, D.; Korndorfer, F.; Schulz, K.; Wipf, C.; Wolansky, D.; Kaletta, K.; Wegner, M.; Ehrmann, O.; Tillack, B.
Conference Paper
2011Prospects and limits in wafer-level-packaging of image sensors
Wilke, M.; Wippermann, F.; Zoschke, K.; Toepper, M.; Ehrmann, O.; Reichl, H.; Lang, K.-D.
Conference Paper
2011TSV based silicon interposer technology for wafer level fabrication of 3D SiP modules
Zoschke, K.; Wolf, J.; Lopper, C.; Kuna, I.; Jurgensen, N.; Glaw, V.; Samulewicz, K.; Roder, J.; Wilke, M.; Wunsch, O.; Klein, M.; Suchodoletz, M.V.; Oppermann, H.; Braun, T.; Wieland, R.; Ehrmann, O.
Conference Paper
2010Development of charged particle detectors by integrating gas amplification stages and CMOS ASICs on wafer level
Kaminski, J.; Baumgartner, T.; Desch, K.; Ehrmann, O.; Fritzsch, T.; Krautscheid, T.; Mayer, S.; Töpper, M.
Conference Paper
2010Dry film photo resists and polymers - The low cost option for standard and 3-D wafer level packaging
Baumgartner, T.; Hauck, K.; Töpper, M.; Manessis, D.; Ehrmann, O.; Lang, K.-D.; Liebsch, W.; Ehlin, M.; Itabashi, T.
Conference Paper
2010Evaluation of thin wafer processing using a temporary wafer handling system as key technology for 3D system integration
Zoschke, K.; Wegner, M.; Wilke, M.; Jürgensen, N.; Lopper, C.; Kuna, I.; Glaw, V.; Röder, J.; Wünsch, O.; Wolf, M.J.; Ehrmann, O.; Reichl, H.
Conference Paper
2010Wafer level processing of integrated passive components using polyimide or polybenzoxazole/copper multilayer technology
Zoschke, K.; Fischer, T.; Töpper, M.; Samulewicz, K.; Wünsch, O.; Röder, J.; Lutz, M.; Ehrmann, O.; Reichl, H.
Journal Article
20093D integration of image sensor SiP using TSV silicon interposer
Wolf, M.J.; Zoschke, K.; Klumpp, A.; Wieland, R.; Klein, M.; Nebrich, L.; Heinig, A.; Limansyah, I.; Weber, W.; Ehrmann, O.; Reichl, H.
Conference Paper
20093D process integration - requirements and challenges
Wolf, M.J.; Klumpp, A.; Zoschke, K.; Wieland, R.; Nebrich, L.; Klein, M.; Oppermann, H.; Ramm, P.; Ehrmann, O.; Reichl, H.
Conference Paper
2009Design study of the bump on flexible lead by FEA for wafer level packaging
Eidner, I.; Wunderle, B.; Pan, K.L.; Wolf, M.J.; Ehrmann, O.; Reichl, H.
Conference Paper
2009Reliability study of the bump on flexible lead for wafer level packaging
Kolb, I.; Wolf, M.J.; Ehrmann, O.; Reichl, H.
Conference Paper
2008Bump on flexible lead for wafer level packaging
Eidner, I.; Buschick, K.; Dietrich, L.; Pan, K.L.; Minkus, M.; Wolf, M.J.; Ehrmann, O.; Reichl, H.
Conference Paper
2008High aspect ratio TSV copper filling with different seed layers
Wolf, M.J.; Dretschkow, T.; Wunderle, B.; Jürgensen, N.; Engelmann, G.; Ehrmann, O.; Uhlig, A.; Michel, B.; Reichl, H.
Conference Paper
2008Profile of the wafer level ECD gold bumps under variable parameters
Jing, X.M.; Engelmann, G.; Chen, D.; Wolf, J.; Ehrmann, O.; Reichl, H.
Journal Article
2007Conformal coating and patterning of 3D structures on wafer level with electrophoretic photoresists
Fischer, T.; Töpper, M.; Jürgensen, N.; Ehrmann, O.; Wiemer, M.; Reichl, H.
Conference Paper
2007Copper / Benzocyclobutene multi layer wiring - A Flexible base technology for wafer level integration of passive components
Zoschke, K.; Wolf, J.; Ehrmann, O.; Toepper, M.; Reichl, H.
Conference Paper
2007ECD wafer bumping and packaging for pixel detector applications
Fritzsch, T.; Jordan, R.; Ehrmann, O.; Reichl, H.
Conference Paper
2007Evaluation of micro structured glass layers as dielectric-and passivation material for wafer level integrated thin film capacitors and resistors
Zoschke, K.; Feige, C.; Wolf, J.; Mund, D.; Töpper, M.; Ehrmann, O.; Schmückle, F.J.; Reichl, H.
Conference Paper
2007Fabrication of application specific integrated passive devices using wafer level packaging technologies
Zoschke, K.; Wolf, M.J.; Töpper, M.; Ehrmann, O.; Fritzsch, T.; Kaletta, K.; Schmückle, F.J.; Reichl, H.
Journal Article
2007Prospects and yield of electrochemical wafer plating for bumping and signal routing
Dietrich, L.; Töpper, M.; Fritzsch, Th.; Ehrmann, O.; Reichl, H.
Conference Paper
2006Biocompatible hybrid flip-chip microsystem integration for next generation wireless neural interfaces
Töpper, M.; Klein, M.; Buschick, K.; Glaw, V.; Orth, K.; Ehrmann, O.; Hutter, M.; Oppermann, H.; Becker, K.-F.; Braun, T.; Ebling, F.; Reichl, H.; Kim, S.; Tathireddy, P.; Chakravarty, S.; Solzbacher, F.
Conference Paper
2006Conformance of ECD wafer bumping to future demands on CSP, 3D integration and MEMS
Dietrich, L.; Toepper, M.; Ehrmann, O.; Reichl, H.
Conference Paper
2006Experience in fabrication of multichip-modules for the ATLAS pixel detector
Fritzsch, T.; Jordan, R.; Töpper, M.; Kuna, I.; Lutz, M.; Defo Kamga, F.; Wolf, J.; Ehrmann, O.; Oppermann, H.; Reichl, H.
Conference Paper, Journal Article
2006Multi-Chip-Modul und Verfahren zum Herstellen eines Multi-Chip-Moduls
Landesberger, C.; Reichl, H.; Ansorge, F.; Ramm, P.; Ehrmann, O.
Patent
2006Packaging of radiation and particle detectors
Fritzsch, T.; Jordan, R.; Glaw, V.; Töpper, M.; Dietrich, L.; Wolf, J.; Ehrmann, O.; Oppermann, H.; Reichl, H.; Wermes, N.
Conference Paper
2006Stackable thin film multi layer substrates with integrated passive components
Zoschke, K.; Buschick, K.; Scherpinski, K.; Fischer, T.; Wolf, J.; Ehrmann, O.; Jordan, R.; Reichl, H.; Schmuckle, F.J.
Conference Paper
2006WLCSP technology direction
Töpper, M.; Claw, V.; Zoschke, K.; Ehrmann, O.; Reichl, H.
Journal Article
2005Effect of the Cu thickness on the stability of a Ni/Cu bilayer UBM of lead free microbumps during liquid and solid state aging
Jurenka, C.; Kim, J.Y.; Wolf, M.J.; Engelmann, G.; Ehrmann, O.; Yu, J.; Reichl, H.
Conference Paper
2005Fabrication of application specific integrated passive devices using wafer level packaging technologies
Zoschke, K.; Wolf, J.; Töpper, M.; Ehrmann, O.; Fritzsch, T.; Scherpinski, K.; Reichl, H.; Schmückle, F.-J.
Conference Paper
2005Fabrication of Multichip-Modules for Pixel Detectors
Fritzsch, T.; Jordan, R.; Töpper, M.; Röder, J.; Kuna, I.; Lutz, M.; Wolf, M.J.; Ehrmann, O.; Oppermann, H.; Reichl, H.
Conference Paper
2005Herstellung dünner Chip-Kontaktierungsmetallisierungen auf der Basis von Lift-off und PVD
Hauck, K.; Samulewicz, K.; Jürgensen, N.; Töpper, M.; Ehrmann, O.; Reichl, H.
Journal Article
2005Herstellung von dünnen Chip-Kontaktierungsmetallisierungen auf der Basis von Lift-off und PVD
Hauck, K.; Samulewics, K.; Jürgensen, N.; Ehrmann, O.; Voigt, A.; Reichl, H.
Journal Article
2005A single layer negative tone lift-off photo resist for patterning a magnetron sputtered Ti/Pt/Au contact system and for solder bumps
Töpper, M.; Voigt, A.; Heinrich, M.; Hauck, K.; Mientus, R.; Gruetzner, G.; Ehrmann, O.
Conference Paper
2005Technologien, Anwendungen und Zukunft des WLP
Töpper, M.; Glaw, V.; Zoschke, K.; Ehrmann, O.; Reichl, H.
Conference Paper
2005Technology Requirements for Chip-On-Chip Packaging Solution
Töpper, M.; Fritzsch, T.; Glaw, V.; Jordan, R.; Lopper, C.; Röder, J.; Dietrich, L.; Lutz, M.; Oppermann, H.; Ehrmann, O.; Reichl, H.
Conference Paper
2005Technology requirements for chip-on-chip packaging solutions
Töpper, M.; Fritzsch, T.; Glaw, V.; Jordan, R.; Lopper, C.; Röder, J.; Dietrich, L.; Lutz, M.; Oppermann, H.; Ehrmann, O.; Reichl, H.
Conference Paper
2005Wafer Level Fabrication of Integrated Passive Components
Zoschke, K.; Wolf, M.J.; Töpper, M.; Ehrmann, O.; Reichl, H.
Conference Paper
2005WLCSP technology direction
Töpper, M.; Glaw, V.; Zoschke, K.; Ehrmann, O.; Reichl, H.
Conference Paper
2004Characterization of electroplated leadfree bumps
Wolf, M.J.; Jang, S.-Y.; Ehrmann, O.; Reichl, H.; Paik, K.-W.
Journal Article
2004Evolution of WLP: From Redristribution to 3-D Packaging and MEMS Packaging
Töpper, M.; Glaw, V.; Zoschke, K.; Jung, E.; Becker, K.-F.; Ehrmann, O.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2004Flexible circuit carrier with integrated passives for high density integration
Fischer, T.; Zoschke, K.; Scherpinski, K.; Buschick, K.; Ehrmann, O.; Wolf, M.J.; Reichl, H.
Journal Article
2004Thin film integration of passives - single components, filters, integrated passive devices
Zoschke, K.; Wolf, J.; Töpper, M.; Ehrmann, O.; Fritzsch, T.; Scherpinski, K.; Reichl, H.; Schmückle, F.-J.
Conference Paper
2003CrCu based UBM (under bump metallization) study with electroplated Pb/63Sn solder bumps - interfacial reaction and bump shear strength
Jang, S.Y.; Wolf, J.; Ehrmann, O.; Gloor, H.; Schreiber, T.; Reichl, H.; Paik, K.W.
Journal Article
2002Calculation of shape and experimental creation of AuSn solder bumps for flip chip applications
Hutter, M.; Oppermann, H.; Engelmann, G.; Wolf, J.; Ehrmann, O.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Pb-free Sn/3.5Ag electroplating bumping process and under bump metallization (UBM)
Jang, S.Y.; Wolf, J.; Ehrmann, O.; Gloor, H.; Reichl, H.; Paik, K.W.
Journal Article
2002Pb-free Sn/3.5Ag wafer-bumping process and UBM (under bump metallurgy) study
Jang, S.Y.; Wolf, J.; Ehrmann, O.; Reichl, H.; Paik, K.W.
Journal Article
2000Characteristics of fritting contacts utilized for micromachined wafer probe cards
Itoh, T.; Suga, T.; Engelmann, G.; Wolf, J.; Ehrmann, O.; Reichl, H.
Journal Article
2000Fab integrated packaging (FIP): A new concept for high reliability wafer-level chip size packaging
Töpper, M.; Auersperg, J.; Glaw, V.; Kaskoun, K.; Prack, E.; Keser, B.; Coskina, P.; Jäger, D.; Petter, D.; Ehrmann, O.; Samulewicz, K.; Meinherz, C.; Fehlberg, S.; Karduck, C.; Reichl, H.
Conference Paper
2000First MCM-D modules for the b-physics layer of the ATLAS pixel detector
Töpper, M.; Bäsken, O.; Becks, K.-H.; Ehrmann, O.; Gerlach, P.; Grah, C.; Gregor, I.M.; Linder, C.; Meuser, S.; Richardson, J.; Wolf, J.
Journal Article
2000High density pixel detector module using flip chip and thin film technology
Wolf, J.; Gerlach, P.; Beyne, E.; Töpper, M.; Dietrich, L.; Becks, K.H.; Wermes, N.; Ehrmann, O.; Reichl, H.
Conference Paper
2000Thin chip integration (TCI-modules) - a novel technique for manufacturing three dimensional IC-packages
Töpper, M.; Scherpinski, K.; Spörle, H.-P.; Landesberger, C.; Ehrmann, O.; Reichl, H.
Conference Paper
2000Verfahren und Vorrichtung zur Herstellung eines Verbundes zwischen einem Traegerkoerper und mindestens einer darin enthaltenen Komponente
Krabe, D.; Lang, G.; Springer, A.; Hagenbuechle, M.; Buschick, K.; Ehrmann, O.; Scheel, W.; Reichl, H.
Patent
2000Wafer level package using double balls
Töpper, M.; Glaw, V.; Coskina, P.; Auersperg, J.; Samulewicz, K.; Lange, M.; Karduck, C.; Fehlberg, S.; Ehrmann, O.; Reichl, H.
Conference Paper
2000Wafer-level chip size package (WL-CSP)
Töpper, M.; Fehlberg, S.; Scherpinski, K.; Karduck, C.; Glaw, V.; Heinricht, K.; Coskina, P.; Ehrmann, O.; Reichl, H.
Journal Article
1999Fabrication of a high-density MCM-D for a pixel detector system using a BCB/Cu technology
Töpper, M.; Dietrich, L.; Engelmann, G.; Fehlberg, S.; Gerlach, P.; Wolf, J.; Ehrmann, O.; Becks, K.-H.; Reichl, H.
Conference Paper
1999Fabrication of a high-density MCM-D for a pixel detector system using a BCB/Cu/PbSn technology
Töpper, M.; Gerlach, P.; Dietrich, L.; Fehlberg, S.; Karduck, C.; Meinherz, C.; Wolf, J.; Ehrmann, O.; Becks, K.-H.; Reichl, H.
Journal Article
1999Integration of NiCr resistors in a multilayer Cu/BCB wiring system
Scherpinski, K.; Töpper, M.; Hahn, R.; Ehrmann, O.; Reichl, H.
Conference Paper
1999A MCM-D-type module for the atlas pixel detector
Becks, K.H.; Beyne, E.; Ehrmann, O.; Gerlach, P.; Gregor, I.M.; Pieters, P.; Töpper, M.; Truzzi, C.; Wolf, J.
Journal Article
1999A MCM-D-type module for the ATLAS pixel detector
Becks, K.-H.; Beyne, E.; Ehrmann, O.; Gerlach, P.; Gregor, I.M.; Pieters, P.; Truzzi, C.; Wolf, J.
Conference Paper
1999Oberflächen- und Schichtcharakterisierung bei der Herstellung von Dünnfilm-NiCr-Widerständen
Töpper, M.; Scherpinski, K.; Krause, F.; Halser, K.; Ehrmann, O.; Scheel, W.; Reichl, H.
Journal Article
1999Wafer Bumping for Wafer-Level CSPs and Flip Chips using Stencil Printing Technology
Töpper, M.; Coskina, P.; Krause, F.; Halser, K.; Ehrmann, O.; Scheel, W.; Reichl, H.
Conference Paper
1998Chip size package - the option of choice for miniaturized medical devices
Töpper, M.; Schaldach, M.; Fehlberg, S.; Karduck, C.; Meinherz, C.; Heinricht, K.; Bader, V.; Hoster, L.; Coskina, P.; Kloeser, J.; Ehrmann, O.; Reichl, H.
Conference Paper
1998Combination of MCM-C technology with MCM-D technology using photosensitive polymers
Töpper, M.; Scherpinski, K.; Hahn, R.; Ehrmann, O.; Reichl, H.; Schmaus, C.; Bechtold, F.
Conference Paper
1998Deployment of State-of -the-Art Technology for Implantable Medical Systems
Töpper, M.; Schaldach, M.; Müller, J.; Starke, M.; Tessier, T.; Ehrmann, O.; Reichl, H.
Conference Paper
1998Gold and gold-tin wafer bumping by electrochemical deposition for flip chip and TAB
Dietrich, L.; Engelmann, G.; Ehrmann, O.; Reichl, H.
Conference Paper
1998Ein hochsprachenprogrammierbares System zur Vollbildauswertung im Videotakt, Anwendungen zur Interpretation monokularer, semi-strukturierter Bildfolgen bei natürlicher Beleuchtung und schnell bewegter Kamera
Baur, M.; Schumm, T.; Wertheimer, R.; Schanz, M.; Eckart, T.; Nitta, C.; Hosticka, B.J.; Wagner, R.; Liu, F.; Donner, K.; Haas, J.; Handmann, U.; Kalinke, T.; Tzomakas, C.; Werner, M.; Seelen, W. von; Ehrmann, O.; Buschick, K.; Chmiel, G.; Paredes, A.; Glaw, V.; Reichl, H.
Conference Paper
1998Thermal measurements with liquid cooled microchannel heat sinks
Glaw, V.; Hein, U.; Ginolas, A.; Ehrmann, O.; Reichl, H.
Conference Paper
1997BCB - a polymer for thinfilm applications
Töpper, M.; Ehrmann, O.; Reichl, H.; Glaw, V.; Wolf, J.; Fischbeck, G.; Petermann, K.
Conference Paper
1997Embedding technology - a chip-first approach using BCB
Töpper, M.; Buschick, K.; Wolf, J.; Glaw, V.; Hahn, R.; Dabek, A.; Ehrmann, O.; Reichl, H.
Conference Paper
1997High performance cooling technology for Multi Chip Modules (MCM-D) with planar embedded dice
Hahn, R.; Töpper, M.; Schmidt, M.; Kamp, A.; Ginolas, A.; Wolf, J.; Glaw, V.; Buschick, K.; Ehrmann, O.; Reichl, H.
Conference Paper
1997High power multi chip modules employing the planar embedding technique and microchannel water heat sinks
Hahn, R.; Kamp, A.; Ginolas, A.; Schmidt, M.; Wolf, J.; Glaw, V.; Töpper, M.; Ehrmann, O.; Reichl, H.
Journal Article
1997High power multichip modules employing the planar embedding technique and microchannel water heat sinks
Töpper, M.; Hahn, R.; Kamp, A.; Ginolas, A.; Schmidt, M.; Wolf, J.; Glaw, V.; Ehrmann, O.; Reichl, H.
Conference Paper
1997Laser machining of ceramics for MCM-D applications
Glaw, V.; Hahn, R.; Wolf, J.; Töpper, M.; Buschick, K.; Hein, U.; Ginolas, A.; Ehrmann, O.; Reichl, H.
Conference Paper
1997System Integration for High Frequency Applications
Töpper, M.; Wolf, J.; Schmückle, F.J.; Heinrich, W.; Buschick, K.; Owzar, A.; Ehrmann, O.; Reichl, H.
Conference Paper
1996Fabrication of high power MCMs by planar embedding technique and active cooling
Töpper, M.; Hahn, R.; Wolf, J.; Glaw, V.; Buschick, K.; Hoehne, J.; Schmidt, M.; Ehrmann, O.; Reichl, H.
Conference Paper
1996MCM-D with embedded active and passive components
Töpper, M.; Wolf, J.; Glaw, V.; Buschick, K.; Dabek, A.; Dietrich, L.; Ehrmann, O.; Reichl, H.
Conference Paper
1996Mehrlagenverdrahtung für MCM-D und Chip Size Package
Töpper, M.; Buschick, K.; Wolf, J.; Dietrich, L.; Ehrmann, O.
Book Article
1995Planare Multichip-Einbettung bei Dünnfilm-Hybriden auf keramischen Substraten
Buschik, K.; Chmiel, G.; Ehrmann, O.; Glaw, V.; Paredes, A.; Wolf, J.
Book Article