Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2017Experimental verification and analysis of analytical model of the shape of bond wire antennas
Ndip, I.; Huhn, M.; Brandenburger, F.; Ehrhardt, C.; Schneider-Ramelow, M.; Reichl, H.; Lang, K.D.; Henke, H.
Journal Article
2016Comparison of different technologies for the die attach of power semiconductor devices conduting active power cycling
Hutter, Matthias; Weber, Constanze; Ehrhardt, Christian; Lang, Klaus-Dieter
Conference Paper
2016Entwicklung patientenspezifischer Orbitabodenimplantate - Ergebnisse und Perspektiven
Rotsch, Christian; Grunert, Ronny; Töppel, Thomas; Ehrhardt, Christoph; Wagner, Maximilian; Essig, Harald
Conference Paper
2016Packaging and characterization of silicon and SiC-based power inverter module with double sided cooling
Manier, C.-A.; Oppermann, H.; Dietrich, L.; Ehrhardt, C.; Sarkany, Z.; Rencz, M.; Wunderle, B.; Maurer, W.; Mitova, R.; Lang, K.-D.
Conference Paper
2016The reliability of wire bonding using Ag and Al
Schneider-Ramelow, Martin; Ehrhardt, Christian
Journal Article
2016Simulation of the lifetime of wire bonds modified through wedge trenches for higher reliability
Grams, Arian; Ehrhardt, Christian; Jaeschke, Johannes; Middendorf, Andreas; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper
2016Visuelle und mechanische Prüfung von Drahtbondverbindungen
Schneider-Ramelow, Martin; Ehrhardt, C.; Höfer, J.; Schmitz, S.; Lang, K.-D.
Journal Article
2015Active power cycling results using copper tin TLPB joints as new die-attach technology
Ehrhardt, Christian; Hutter, Matthias; Weber, Constanze; Lang, Klaus-Dieter
Conference Paper
2015Demonstratoren
Herberholz, T.; Fix, A.; Ehrhardt, C.; Kreysig, K.; Seiler, B.; Dudek, R.; Schulze, J.; Wilke, K.; Strogies, J.
Book Article
2015Electro-thermo-mechanical analyses on silver sintered IGBT-module reliability in power cycling
Dudek, R.; Döring, R.; Rzepka, S.; Ehrhardt, C.; Günther, M.; Haag, M.
Conference Paper
2015Failure analysis of Ag sintered joints after power cycling under harsh temperature conditions from +30°C up to +180°C
Weber, C.; Hutter, M.; Ehrhardt, C.; Lang, K.-D.
Conference Paper
2015Grenzen und Möglichkeiten der Weichlotverbindungen - Betrachtungen von Qualität und Zuverlässigkeit
Hutter, M.; Ehrhardt, C.
Conference Paper
2015Heterogeneous integration of a miniaturized W-band radar module
Becker, Karl-Friedrich; Georgi, L.; Kahle, R.; Koch, M.; Voges, S.; Brandenburger, F.; Höfer, J.; Ehrhardt, C.; Zech, C.; Baumann, B.; Huelsmann, A.; Grasenack, A.; Reinold, S.; Kleiner, B.; Braun, T.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper, Journal Article
2015Investigations on power cycling induced fatigue failure of IGBTs with silver sinterea interconnects
Dudek, R.; Doring, R.; Rzepka, S.; Ehrhardt, C.; Hutter, M.; Rudzki, J.; Osterwald, F.; Eisele, R.; Stegmeier, S.; Weidner, K.; Rittner, M.
Conference Paper
2015Investigations on power cycling induced fatigue failure of IGBTs with silver sintered interconnects
Dudek, R.; Döring, R.; Rzepka, S.; Ehrhardt, C.; Hutter, M.; Rudzki, J.; Osterwald, F.; Eisele, R.; Stegmeier, S.; Weidner, K.; Rittner, M.
Conference Paper
2015Verbindungstechnologien für erhöhte Einsatztemperaturen mikroelektronischer Anwendungen
Ehrhardt, Christian; Hutter, M.; Weber, C.; Goullon, L.; Oppermann, H.
Book Article
2014Advanced packaging methods for high-power LED modules
Jordan, R.C.; Weber, C.; Ehrhardt, C.; Wilke, M.
Conference Paper
2014High temperature electronics for LED-lighting architectures (European SEEL Project: Solution for energy efficient lighting)
Habenicht, S.; Funke, H.J.; Gruber, D.; Oelgeschläger, D.; Schumacher, O.; Gehn, R.; Walczyk, S.; Mavinkurve, A.; Reiners, T.; Fiederling, R.; Vogl, M.; Schug, J.; Willwohl, H.; Blandin, J.; Hutter, M.; Ehrhardt, C.; Oppermann, H.
Journal Article
2014A lead free joining technology for high temperature interconnects using Transient Liquid Phase Soldering (TLPS)
Ehrhardt, C.; Hutter, M.; Oppermann, H.; Lang, K.-D.
Conference Paper
2014Standard-Reflowlöten für Anwendungen bis 300°C - ein Widerspruch?
Fix, A.; Herberholz, T.; Guyenot, M.; Nowottnick, M.; Novikov, A.; Schulze, J.; Trodler, J.; Hutter, M.; Ehrhardt, C.; Dudek, R.; Wilke, K.; Strogies, J.; Seiler, B.; Kreyßig, K.; Diehm, R.; Liedke, V.; Zerna, T.; Klemm, A.
Conference Paper
2013The european SEEL (solutions for energy efficient lighting) project High temperature electronics for LED-lighting architectures
Habenicht, S.; Funke, H.J.; Gruber, D.; Oelgeschlager, D.; Schumacher, O.; Gehn, R.; Walczyk, S.; Mavinkurve, A.; Reiners, T.; Fiederling, R.; Vogl, M.; Schug, J.; Willwohl, H.; Blandin, J.; Hutter, M.; Ehrhardt, C.; Oppermann, H.
Conference Paper
2013Transient Liquid Phase Soldering-An emerging joining technique for power electronic devices
Ehrhardt, C.; Hutter, M.; Oppermann, H.; Lang, K.-D.
Conference Paper
2012Transient liquid phase soldering for lead-free joining of power electronic modules in high temperature applications
Ehrhardt, C.; Hutter, M.; Oppermann, H.; Lang, K.-D.
Conference Paper
2011Paste zum Verbinden von Bauteilen elektronischer Leistungsmodule, System und Verfahren zum Auftragen der Paste
Oppermann, H.; Hutter, M.; Ehrhardt, C.
Patent
2008A systematic approach to the transition from task-oriented requirements in TORE to a component-based design in KobrA
Ehrhardt, Christian
: Rombach, H. Dieter (Supervisor); Eisenbarth, Michael (Supervisor)
Thesis