Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Characterisation of ferroelectric thin films with scanning probe microscope methods
Norouzi Kalkani, Mahsa
: Kämpfe, Thomas (Betreuer); Ecke, Ramona (Betreuer); Schulz, Stefan E. (Gutachter)
Master Thesis
2018Magneto-optical spectroscopy and spectroscopic ellipsometry of Co60Fe20B20 thin films
Sharma, A.; Almeida, M.; Matthes, P.; Ecke, R.; Zahn, D.R.T.; Schulz, S.E.; Salvan, G.
Abstract
2018Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data
Wunderle, B.; May, D.; Zschenderlein, U.; Ecke, R.; Springborn, M.; Jöhrmann, N.; Pareek, K.A.; Heilmann, J.; Stiebing, M.; Arnold, J.; Dudek, R.; Schulz, S.; Wolf, M.J.; Rzepka, S.
Conference Paper
20173D wafer level packaging by using Cu-through silicon vias for thin MEMS accelerometer packages
Hofmann, L.; Schubert, I.; Wuensch, D.; Ecke, R.; Vogel, K.; Gottfried, K.; Reuter, D.; Rennau, M.; Schulz, S.E.; Gessner, T.
Journal Article
2016Atomic layer deposition of ultrathin Cu2O and subsequent reduction to Cu studied by in situ x-ray photoelectron spectroscopy
Dhakal, D.; Assim, K.; Lang, H.; Bruener, P.; Grehl, T.; Georgi, C.; Waechtler, T.; Ecke, R.; Schulz, S.E.; Gessner, T.
Journal Article
2016Characterisation of the barrier formation process of self-forming barriers with CuMn, CuTi and CuZr alloys
Franz, M.; Ecke, R.; Kaufmann, C.; Kriz, J.; Schulz, S.E.
Journal Article, Conference Paper
2016Study on TSV isolation liners for a Via Last approach with the use in 3D-WLP for MEMS
Hofmann, L.; Fischer, T.; Werner, T.; Selbmann, F.; Rennau, M.; Ecke, R.; Schulz, S.E.; Gessner, T.
Journal Article
20153D integration approaches for MEMS and CMOS sensors based on a Cu through-silicon-via technology and wafer level bonding
Hofmann, L.; Dempwolf, S.; Reuter, D.; Ecke, R.; Gottfried, K.; Schulz, S.E.; Knechtel, R.; Geßner, T.
Conference Paper
20153d Wafer Level Packaging By Using Cu-Through Silicon Vias For Thin Mems Accelerometer Packages
Hofmann, L.; Reuter, D.; Schubert, I.; Wuensch, D.; Rennau, M.; Ecke, R.; Vogel, K.; Gottfried, K.; Schulz, S.E.; Gessner, T.
Conference Paper
2015High-performance giant magnetoresistive sensorics on flexible Si membranes
Pérez, N.; Melzer, M.; Makarov, D.; Ueberschär, O.; Ecke, R.; Schulz, S.E.; Schmidt, O.G.
Journal Article
2015Investigation of barrier formation and stability of self-forming barriers with CuMn, CuTi and CuZr alloys
Franz, M.; Ecke, R.; Kaufmann, C.; Kriz, J.; Schulz, S.E.
Conference Paper
2015Monolithic integration of 2D spin valve magnetic field sensors for angular sensing
Almeida, M.J.; Götze, T.; Ueberschär, O.; Matthes, P.; Müller, M.; Ecke, R.; Exner, H.; Schulz, S.E.
Journal Article, Conference Paper
2015Monolithic integration of focused 2D GMR spin valve magnetic field sensor for high-sensitivity (compass) applications
Ueberschär, O.; Almeida, M.J.; Matthes, P.; Müller, M.; Ecke, R.; Exner, H.; Schulz, S.E.
Conference Paper
2015Optimized monolithic 2-D spin-valve sensor for high-sensitivity compass applications
Ueberschär, O.; Almeida, M.J.; Matthes, P.; Müller, M.; Ecke, R.; Rückriem, R.; Schuster, J.; Exner, H.; Schulz, S.E.
Journal Article
2015Optimum laser exposure for setting exchange bias in spin valve sensors
Almeida, M.J.; Matthes, P.; Ueberschär, O.; Müller, M.; Ecke, R.; Exner, H.; Albrecht, M.; Schulz, S.E.
Journal Article, Conference Paper
2014Monolithic microelectronic spin valve compass for autonomous MEMS navigation in geomagnetic field
Almeida, M.J.; Ueberschär, O.; Matthes, P.; Ecke, R.; Mueller, M.; Exner, H.; Schulze, K.
Conference Paper
2014Monolithic spin valve compass for autonomous MEMS navigation in geomagnetic field
Almeida, M.J.; Ueberschär, O.; Ecke, R.; Schulz, S.E.; Matthes, P.; Müller, M.; Exner, H.
Conference Paper
2013Vertical Integration techniques for MEMS using HAR TSV
Hofmann, L.; Schubert, I.; Ecke, R.; Gottfried, K.; Schulz, S.E.; Gessner, T.
Conference Paper
2012Analysis of pore sealing processes and TiN diffusion barrier deposition on a porous ultra low-k dielectric by ellipsometric porosimetry and PALS
Ahner, N.; Ecke, R.; Schulz, S.E.; Jungmann, M.; Krause-Rehberg, R.; Butterling, M.; Anwand, W.; Wagner, A.; Preusse, A.
Conference Paper
2012Back-end-of the line compatible homogeneous coating of vertical aligned carbon nanotubes with a conductive diffusion barrier for interconnect applications
Fiedler, H.; Ecke, R.; Hermann, S.; Schulz, S.E.; Gessner, T.
Conference Paper
2012Growth of carbon nanotube forests between a bi-metallic catalyst layer and a SiO2 substrate to form a self-assembled carbon-metal heterostructure
Hermann, S.; Schulze, S.; Ecke, R.; Liebig, A.; Schaefer, P.; Zahn, D.R.T.; Albrecht, M.; Hietschold, M.; Schulz, S.E.; Gessner, T.
Journal Article
2011Investigations regarding through silicon via filling for 3D integration by periodic pulse reverse plating with and without additives
Hofmann, L.; Ecke, R.; Schulz, S. E.; Geßner, T.
Conference Paper, Journal Article
2011Lewis-base copper(I) formates: Synthesis, reaction chemistry, structural characterization and their use as spin-coating precursors for copper deposition
Tuchscherer, A.; Shen, Y.; Jakob, A.; Mothes, R.; Al-Anber, M.; Walfort, B.; Rüffer, T.; Frühauf, S.; Ecke, R.; Schulz, S.E.; Gessner, T.; Lang, H.
Journal Article
2010Carbon nanotubes for nanoscale low temperature flip chip connections
Hermann, S.; Pahl, B.; Ecke, R.; Schulz, S.E.; Gessner, T.
Conference Paper
2010Metallisierungsverfahren für die 3D Integration in der Mikroelektronik und Mikrosystemtechnik
Hofmann, L.; Ecke, R.; Schulz, S.E.; Gessner, T.
Journal Article
2010Phosphite copper(I) trifluoroacetates [((RO)(3)P)(m)CuO2CCF3] (m=1, 2, 3): synthesis, solid state structures and their potential use as CVD precursors
Mothes, R.; Rüffer, T.; Shen, Y.Z.; Jakob, A.; Walfort, B.; Petzold, H.; Schulz, S.E.; Ecke, R.; Gessner, T.; Lang, H.
Journal Article
2010Pulse reverse electroplating for TSV filling in 3D integration
Hofmann, L.; Ecke, R.; Schulz, S.E.; Gessner, T.
Conference Paper
2009Controlling the formation of nanoparticles for definite growth of carbon nanotubes for interconnect applications
Hermann, S.; Ecke, R.; Schulz, S.E.; Gessner, T.
Journal Article
2009Copper oxide films grown by atomic layer deposition from Bis(tri-n-butylphosphane)copper(I)acetylacetonate on Ta, TaN, Ru, and SiO2
Waechtler, T.; Oswald, S.; Roth, N.; Jakob, A.; Lang, H.; Ecke, R.; Schulz, S.E.; Gessner, T.; Moskvinova, A.; Schulze, S.; Hietschold, M.
Journal Article
2009Metallisierungsverfahren für die 3D Integration in der Mikroelektronik und Mikrosystemtechnik
Hofmann, L.; Ecke, R.; Schulz, S.E.; Gessner, T.
Conference Paper
2009Process development for smart systems integration in MEMS
Ecke, R.; Frömel, J.; Schulz, S.E.; Wiemer, M.; Gessner, T.
Journal Article
2009Through silicon vias in micro-electromechanical systems
Warnat, S.; Ecke, R.; Marenco, N.; Gruenzig, S.; Reinert, W.; Lange, P.
Conference Paper
2008Controlling the formation of nanoparticles for definite growth of carbon nanotubes for interconnect applications
Hermann, S.; Ecke, R.; Schulz, S.; Gessner, T.
Journal Article, Conference Paper
2008Investigations on via geometry and wetting behavior for the filling of through silicon vias by copper electro deposition
Hofmann, L.; Küchler, M.; Gumprecht, T.; Ecke, R.; Schulz, S.; Gessner, T.
Conference Paper
2008Metallization by chemical vapor deposition of W and Cu
Klumpp, A.; Wieland, R.; Ecke, R.; Schulz, S.E.
Book Article
20073D-integrated Si- and SiGe CMOS-devices by ICV-SLID technology
Wieland, R.; Ecke, R.; Klumpp, A.; Merkel, R.; Schulz, S.E.; Ramm, P.
Conference Paper
2007Influence of barrier crystallization on CV characteristics of MIS structures
Ecke, R.; Rennau, M.; Zimmermann, S.; Schulz, S.E.; Gessner, T.
Conference Paper
2006Abscheidung (CVD) und Charakterisierung W-basierter Diffusionsbarrieren für die Kupfermetallisierung
Ecke, R.
Dissertation
2003Deposition and treatment of titanium based barrier layers by MOCVD
Ecke, R.; Schulz, S.E.; Gessner, T.; Riedel, S.; Lipp, E.; Eizenberg, M.
Conference Paper
2003Influence of SiH4 on the WN4-PECVD process
Ecke, R.; Schulz, S.E.; Hecker, M.; Mattern, N.; Gessner, T.
Conference Paper
2002InterChip via technology by using copper for vertical system integration
Ramm, P.; Bonfert, D.; Ecke, R.; Iberl, F.; Klumpp, A.; Riedel, S.; Schulz, S.E.; Wieland, R.; Zacher, M.; Gessner, T.
Conference Paper
2001Charakterisierung von CVD-WNx-Schichten als Barriere gegen Kupferdiffusion
Ecke, R.; Richter, K.; Schulz, S.E.; Gessner, T.
Conference Paper
2001Copper metallization scheme for vertical chip integration
Riedel, S.; Ecke, R.; Schulz, S.E.; Gessner, T.; Wieland, R.; Leutenecker, R.; Klumpp, A.; Ramm, P.
Conference Paper