Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018"3rd Level" Solder Joint Reliability Investigations for Transfer of Consumer Electronics in Automotive Use
Dudek, R.; Hildebrandt, M.; Kreyßig, K.; Rzepka, S.; Döring, R.; Seiler, B.; Fries, T.; Zhang, M.; Ortmann, R.W.
Conference Paper
2018Application-driven reliability research of next generation for automotive electronics: Challenges and approaches
Rzepka, S.; Otto, A.; Vogel, D.; Dudek, R.
Journal Article
2018Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue
Dudek, R.; Hildebrandt, M.; Rzepka, S.; Fries, T.; Döring, R.; Seiler, B.; Ortmann, R.W.
Journal Article
2018Design of robust packages by deliberate release of elastic energy to avoid interfacial crack propagation
Pufall, R.; Goroll, M.; Reuther, G.M.; Pflügler, N.; Udiljak, D.; Dudek, R.
Conference Paper
2018Evaluation of Ag-sinter and CuSn-TLP based joining technologies on lead frame
Otto, A.; Schroeder, T.; Dudek, R.; Wang, W.-S.; Baum, M.; Wiemer, M.; Doering, R.; Kurian, J.J.; Murayama, K.; Oi, K.; Koyama, T.; Rzepka, S.
Conference Paper
2018Long-term thermal fatigue testing of solder joints and related fatigue life predictions
Dudek, R.; Hildebrandt, M.; Kreyßig, K.; Rzepka, S.; Novak, M.; Grübl, W.; Schuck, B.
Conference Paper
2018Lotermüdung von SAC- und Innolot-Verbindungen unter Langzeit-Feldbeanspruchungen und vergleichende Simulationen
Dudek, R.; Hildebrandt, M.; Kreyßig, K.; Rzepka, S.; Novak, M.; Beart, K.; Grübl, W.; Schuch, B.
Conference Paper
2018Stress analyses in HPC-soldered assemblies by optical measurement and FEA
Dudek, R.; Döring, R.; Rzepka, S.; Herberholz, T.; Feil, D.; Seiler, B.; Scheiter, L.; Schellenberg, C.; Fritzsche, S.
Conference Paper
2018Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data
Wunderle, B.; May, D.; Zschenderlein, U.; Ecke, R.; Springborn, M.; Jöhrmann, N.; Pareek, K.A.; Heilmann, J.; Stiebing, M.; Arnold, J.; Dudek, R.; Schulz, S.; Wolf, M.J.; Rzepka, S.
Conference Paper
2017Application driven reliability research of next generation for automotive electronics: Challenges and approaches
Rzepka, S.; Otto, A.; Vogel, D.; Dudek, R.
Conference Paper
2017Board level reliability assessment of consumer components for automotive use by simulation and sophisticated optical deformation analyses
Dudek, R.; Hildebrand, M.; Rzepka, S.; Beintner, J.; Döring, R.; Scheiter, L.; Seiler, B.; Fries, T.; Ortmann, R.W.
Conference Paper
2017Characterization of partial discharge performance of die attach adhesives
Schaller, R.; Strutz, V.; Theuss, H.; Dudek, R.; Rzepka, S.
Journal Article, Conference Paper
2017FE analyses and power cycling tests on the thermo-mechanical performance of silver sintered power semiconductors with different interconnection technologies
Dudek, R.; Doering, R.; Otto, A.; Rzepka, S.; Stegmeier, S.; Kiefl, S.; Lunding, A.; Eisele, R.
Conference Paper
2017Lifetime modeling based on anodic oxidation failure for packages with internal galvanic isolation
Schaller, R.; Strutz, V.; Theuss, H.; Dudek, R.; Rzepka, S.
Conference Paper
2017Reliability investigation on SiC based diode and MOSFET modules developed for high power conversion in medical X-ray applications
Otto, A.; Dudek, R.; Rzepka, S.; Abo Ras, M.; Essen, T. von; Bast, M.; Hindel, A.; Eisele, R.; Mueter, U.; Lunding, A.
Conference Paper
2016Analyses of thermo-mechanical reliability issues for power modules designed in planar technology
Dudek, R.; Döring, R.; Hildebrandt, M.; Rzepka, S.; Stegmeier, S.; Kiefl, S.; Sommer, V.; Mitic, G.; Weidner, K.
Conference Paper
2016Electro-thermal-mechanical analyses on stress in silver sintered power modules with different copper interconnection technologies
Dudek, R.; Döring, R.; Hildebrandt, M.; Rzepka, S.; Stegmeier, S.; Kiefl, S.
Conference Paper
2016Investigating fracture strength of poly-silicon membranes using microscopic loading tests and numerical simulation
Brueckner, J.; Dehé, A.; Auerswald, E.; Dudek, R.; Vogel, D.; Michel, B.; Rzepka, S.
Journal Article
2016Sprödbruchrisiko an keramischen Bauelementen in Abhängigkeit vom Hochtemperatur-Lotwerkstoff und der Beanspruchungsgeschwindigkeit
Dudek, Rainer; Hildebrandt, Marcus; Rzepka, Sven; Röllig, Mike; Trodler, Jörg
Conference Paper
2016Sub-micrometer warpage measurement setups for the verification of material models of soft solder die attaches by inverse modeling
Niessner, M.; Dudek, R.; Hildebrandt, M.; Gehring, M.; Yongbo, Y.; Piller, A.; Schrag, G.
Conference Paper
2015Charakterisierung der Verbindungseigenschaften
Dudek, R.; Döring, R.; Kreysig, K.; Seiler, B.; Nowottnick, M.; Ehrhard, C.
Book Article
2015Demonstratoren
Herberholz, T.; Fix, A.; Ehrhardt, C.; Kreysig, K.; Seiler, B.; Dudek, R.; Schulze, J.; Wilke, K.; Strogies, J.
Book Article
2015Electro-thermo-mechanical analyses on silver sintered IGBT-module reliability in power cycling
Dudek, R.; Döring, R.; Rzepka, S.; Ehrhardt, C.; Günther, M.; Haag, M.
Conference Paper
2015Finite-Elemente-Analysen zur thermomechanischen Beanspruchung von Diffusionslöt- und Sinterverbindungen
Dudek, R.; Döring, R.; Rzepka, S.; Seiler, B.; Kreyßig, K.
Conference Paper
2015Investigations on power cycling induced fatigue failure of IGBTs with silver sinterea interconnects
Dudek, R.; Doring, R.; Rzepka, S.; Ehrhardt, C.; Hutter, M.; Rudzki, J.; Osterwald, F.; Eisele, R.; Stegmeier, S.; Weidner, K.; Rittner, M.
Conference Paper
2015Investigations on power cycling induced fatigue failure of IGBTs with silver sintered interconnects
Dudek, R.; Döring, R.; Rzepka, S.; Ehrhardt, C.; Hutter, M.; Rudzki, J.; Osterwald, F.; Eisele, R.; Stegmeier, S.; Weidner, K.; Rittner, M.
Conference Paper
2015Mechanical characterization of poly-silicon membranes by efficient experimental tests and numerical simulations
Brückner, J.; Auerswald, E.; Vogel, D.; Dudek, R.; Rzepka, S.; Dehe, A.
Conference Paper
2015Thermal and mechanical behaviour of an RFID based smart system embedded in a transmission belt determined by FEM simulations for Industry 4.0 applications
Albrecht, J.; Dudek, R.; Auersperg, J.; Pantou, R.; Rzepka, S.
Conference Paper
2014Analysis of interface delamination by combined theoretical and experimental means
Dudek, R.; Braemer, B.; Auersperg, J.
Book Article
2014Analytische und numerische Beschleunigungsmodelle für Lötverbindungen und Verifizierung mit Feldtestergebnissen
Dudek, R.; Hildebrandt, M.; Faust, W.; Trageser, H.; Kohl, R.; Schuch, B.
Conference Paper
2014Combined experimental- and FE-studies on sinter-Ag behaviour and effects on IGBT-module reliability
Dudek, R.; Döring, R.; Sommer, P.; Seiler, B.; Kreyssig, K.; Walter, H.; Becker, M.; Günther, M.
Conference Paper
2014Drop impact simulations for lifetime assessment of PCB/BGA assemblies regarding pad cratering
Tsebo Simo, G.L.; Shirangi, H.; Nowottnick, M.; Dudek, R.; Kaulfersch, E.; Rzepka, S.; Michel, B.
Conference Paper
2014Experimental testing of silicon die strength depending on the processing history
Brueckner, J.; Dudek, R.; Auerswald, E.; Rzepka, S.; Michel, B.
Book Article
2014Integrated investigation approach for determining mechanical properties of poly-silicon membranes
Brueckner, J.; Dehe, A.; Auerswald, E.; Dudek, R.; Michel, B.; Rzepka, S.
Journal Article, Conference Paper
2014Investigation on thermal fatigue of SnAgCu, Sn100C, and SnPbAg solder joints in varying temperature environments
Johansson, J.; Belov, I.; Johnson, E.; Dudek, R.; Leisner, P.
Journal Article
2014On the crack and delamination risk optimization of a Si-interposer for LED packaging
Auersperg, J.; Dudek, R.; Jordan, R.; Bochow-Neß, O.; Rzepka, S.; Michel, B.
Journal Article, Conference Paper
2014Reliability investigations for high temperature interconnects
Dudek, R.; Sommer, P.; Fix, A.; Trodler, J.; Rzepka, S.; Michel, B.
Journal Article, Conference Paper
2014Solder fatigue acceleration prediction and testing results for different thermal test- and field cycling environments
Dudek, R.; Hildebrandt, M.; Doering, R.; Rzepka, S.; Trageser, H.; Kohl, R.; Wang, C.
Conference Paper
2014Standard-Reflowlöten für Anwendungen bis 300°C - ein Widerspruch?
Fix, A.; Herberholz, T.; Guyenot, M.; Nowottnick, M.; Novikov, A.; Schulze, J.; Trodler, J.; Hutter, M.; Ehrhardt, C.; Dudek, R.; Wilke, K.; Strogies, J.; Seiler, B.; Kreyßig, K.; Diehm, R.; Liedke, V.; Zerna, T.; Klemm, A.
Conference Paper
2014Statistical Strength Investigation of Poly-Silicon Membranes using Microscopic Loading Tests and Numerical Simulation
Brueckner, J.; Auerswald, E.; Dudek, R.; Wunderle, B.; Michel, B.; Rzepka, S.; Dehe, A.
Conference Paper
2014Temperature characterization of flip-chip packaged piezoresistive barometric pressure sensors
Waber, T.; Pahl, W.; Schmidt, M.; Feiertag, G.; Stufler, S.; Dudek, R.; Leidl, A.
Journal Article
2014Thermo-mechanical behavior and reliability issues for high temperature interconnections
Dudek, R.; Sommer, P.; Döring, R.; Herberholz, T.; Fix, A.; Seiler, B.; Rzepka, S.
Conference Paper
2013Advantage and current limitations of advanced fracture mechanics for 3D-integration and BEoL under CPI aspects
Auersperg, J.; Dudek, R.; Rzepka, S.; Michel, B.
Conference Paper
2013Characterization of the thermo-mechanical deformation behaviour of composite materials for power electronics using digital image correlation method microDAC
Seiler, B.; Dudek, R.; Scheiter, L.; Kreyssig, K.; Haase, S.
Conference Paper
2013Effect of moisture swelling on MEMS packaging and integrated sensors
Keller, J.; Mrossko, R.; Dobrinski, H.; Stürmann, J.; Döring, R.; Dudek, R.; Rzepka, S.; Michel, B.
Journal Article, Conference Paper
2013FEM-basierte Zuverlässigkeitsprognostik für die Verbindungstechnik in der Leistungselektronik
Dudek, R.; Doering, R.; Seiler, B.
Book Article
2013Finite-Element-Modelling of Intermetallics in Solders
Sommer, J.-P.; Dudek, R.; Michel, B.
Conference Paper
2013Flip-chip packaging of piezoresistive barometric pressure sensors
Waber, T.; Pahl, W.; Schmidt, M.; Feiertag, G.; Stufler, S.; Dudek, R.; Leidl, A.
Conference Paper
2013Maintenance of solder joints on the strength of simultaneously acting creep and fatigue phenomena by using microindentation technique
Jankowski, K.; Swierczynski, R.; Urbanski, K.; Wymyslowski, A.; Chicot, D.; Dudek, R.
Conference Paper
2013Modellierungsansatz zur thermo-mechanischen Analyse von gesinterten Halbleiterbauelementen in der Leistungselektronik
Dudek, R.; Guenther, M.; Sommer, J.-P.; Doering, R.; Kreyssig, K.
Journal Article
2013On the crack and delamination risk optimization of a Si-interposer for LED packaging
Auersperg, J.; Dudek, R.; Jordan, R.; Bochow-Neß, O.; Rzepka, S.; Michel, B.
Conference Paper
2013Reliability Investigations for High Temperature Interconnects
Dudek, R.; Sommer, J.-P.; Fix, A.; Trodler, J.; Rzepka, S.; Michel, B.
Conference Paper
2013Reliability issues for high temperature interconnections based on transient liquid phase soldering
Dudek, R.; Sommer, P.; Fix, A.; Rzepka, S.; Michel, B.
Conference Paper
2013Reliability simulation on solder joints for high temperature application
Dudek, R.; Doering, R.
Conference Paper
2013Review of experimental strength testing methods for Silicon dies
Brueckner, J.; Auerswald, E.; Dudek, R.; Rzepka, S.; Michel, B.
Conference Paper
2012Capturing interface toughness parameters from shear testing using different fracture mechanics approaches
Auersperg, J.; Dudek, R.; Brämer, B.; Pufall, R.; Seiler, B.; Michel, B.
Conference Paper
2012Degradation of moulding compounds during highly accelerated stress tests - A simple approach to study adhesion by performing button shear tests
Pufall, R.; Goroll, M.; Mahler, J.; Kanert, W.; Bouazza, M.; Wittler, O.; Dudek, R.
Journal Article
2012Delamination modeling for power packages by the cohesive zone approach
Dudek, R.; Doering, R.; Pufall, R.; Kanert, W.; Seiler, B.; Rzepka, S.; Michel, B.
Conference Paper
2012Determination of interface fracture parameters by shear testing using different theoretical approaches
Dudek, R.; Brämer, B.; Auersperg, J.; Pufall, R.; Walter, H.; Seiler, B.; Wunderle, B.
Conference Paper
2012Increasing the robustness for reliable packages by prediction of delamination by cohesive zone element simulation
Pufall, R.; Goroll, M.; Kanert, W.; Dudek, R.
Conference Paper
2012Local deformation and stress analysis in the micro-nano interface regions
Vogel, D.; Auerswald, E.; Dudek, R.; Auersperg, J.; Rzepka, S.; Michel, B.
Conference Paper
2012Novel architecture for battery management systems in fully electrical cars
Rzepka, S.; Otto, A.; Dudek, R.; Michel, B.
Conference Paper
2012Studies on the reliability of power packages based on strength and fracture criteria
Dudek, R.; Pufall, R.; Seiler, B.; Michel, B.
Journal Article
2011Degradation of moulding compounds during highly accelerated stress tests. A simple approach to study adhesion by performing button shear tests
Pufall, R.; Goroll, M.; Mahler, J.; Kanert, W.; Bouazza, M.; Wittler, O.; Dudek, R.
Conference Paper
2011Interaction integral and mode separation for BEoL-cracking and -delamination investigations under 3D-IC integration aspects
Auersperg, J.; Dudek, R.; Oswald, J.; Michel, B.
Conference Paper
2011Modelling of metal degradation in power devices under active cycling conditions
Kanert, W.; Pufall, R.; Wittler, O.; Dudek, R.; Bouazza, M.
Conference Paper
2011Popcorn cracking
Dudek, R.
Book Article
2011Reliability investigation of large GaAs pixel detectors flip-chip-bonded on Si readout chips
Klein, M.; Hutter, M.; Engelmann, G.; Fritzsch, T.; Oppermann, H.; Dietrich, L.; Wolf, M.J.; Brämer, B.; Dudek, R.; Reichl, H.
Journal Article
2011Studies on the reliability of power packages based on strength and fracture criteria
Dudek, R.; Pufall, R.; Seiler, B.; Michel, B.
Conference Paper
2011Thermal fatigue analysis
Dudek, R.; Auerswald, E.
Book Article
2010Application of nanoindentation technique to extract properties of thin films through experimental and numerical analysis
Wymyslowski, A.; Dowha, L.; Wittler, O.; Mrossko, R.; Dudek, R.
Journal Article
2010An integrated experimental and theoretical approach to evaluate Si strength dependent on the processing history
Brueckner, J.; Dudek, R.; Rzepka, S.; Michel, B.
Conference Paper
2010Solder joint reliability in automotive applications: Describing damage mechanisms through the use of EBSD
Steller, A.; Pape, U.; Dudek, R.
Conference Paper
2010Theoretical analysis on the shear test
Dudek, R.; Doering, R.; Kreyssig, K.; Michel, B.
Conference Paper
2010Thermo mechanical behaviour of dies in multi material stacks
Hintz, M.; Dudek, R.; Koch, I.; Schindler-Saefkow, F.; Steinke, A.
Conference Paper
2010VCCT and integral concepts of Bi-material interface fracture in low-K structures - going to understand relation
Auersperg, J.; Dudek, R.; Michel, B.
Conference Paper
2009Micro- and nanoreliability research in the micro materials center Chemnitz of Fraunhofer ENAS
Michel, B.; Dudek, R.; Auersperg, J.; Winkler, T.
Journal Article
2009Multi-objective decision support system in numerical reliability optimization of modern electronic packaging
Dowhán, L.; Wymyslowski, A.; Dudek, R.
Journal Article
2009Numerical approach to extraction of elasto-plastic material models and corresponding properties of thin layers through nanoindentation technique
Wymyslowski, A.; Wittler, O.; Mrossko, R.; Dudek, R.; Auersperg, J.; Dowhan, L.
Conference Paper
2009Simulation based analysis of secondary effects on solder fatigue
Dudek, R.; Doering, R.; Bombach, C.; Michel, B.
Conference Paper, Journal Article
2009Simulation Based Analysis of Secondary Effects on Solder Fatigue
Dudek, R.; Doering, R.; Bombach, C.; Michel, B.
Conference Paper
2009Thermo-mechanical reliability assessment for 3D through-Si stacking
Dudek, R.; Brämer, B.; Irsigler, R.; Rzepka, S.; Michel, B.
Conference Paper
2009Virtual prototyping in microelectronics and packaging
Rzepka, S.; Dudek, R.; Vogel, D.; Michel, B.
Conference Paper
2008An approach of numerical multi-objective optimization in stacked packaging
Dowhán, L.; Wymyslowski, A.; Dudek, R.
Conference Paper, Journal Article
2008Challenges for multi-scale modeling of multiple failure modes in microelectronics
Auersperg, J.; Wunderle, B.; Dudek, R.; Walter, H.; Michel, B.
Conference Paper
2008Challenges for multi-scale modeling of multiple failure modes in microelectronics packaging
Auersperg, J.; Dudek, R.; Vogel, D.; Michel, B.
Conference Paper
2008Development and evaluation of lead free reflow soldering techniques for the flip chip bonding of large GaAs pixel detectors on Si readout chips
Klein, M.; Hutter, M.; Oppermann, H.; Fritzsch, T.; Engelmann, G.; Dietrich, L.; Wolf, J.; Brämer, B.; Dudek, R.; Reichl, H.
Conference Paper
2008FEA Based Reliability Prediction for Different Sn-Based Solders Subjected to Fast Shear and Fatigue Loadings
Dudek, R.; Kaulfersch, E.; Rzepka, S.; Röllig, M.; Michel, B.
Conference Paper
2008Investigations of Reliability of Lead-Free Solder Joints
Faust, W.; Poller, T.; Dudek, R.; Michel, B.
Journal Article, Conference Paper
2008The Polymer Materials as the Essential Input Parameters in Numerical Multi-Objective Optimization of Stacked Packaging
Dowhán, L.; Wymyslowski, A.; Felba, J.; Dudek, R.
Conference Paper
2008Reliability of Several Sn-Based Solders under Test- and Field Fatigue Loadings
Dudek, R.; Ratchev, R.; Faust, W.; Michel, B.
Journal Article, Conference Paper
2008Thermal test- and field cycling induced degradation and its Fe-based prediction for different SAC solders
Dudek, R.; Faust, W.; Ratchev, R.; Roellig, M.; Albrecht, H.-J.; Michel, B.
Conference Paper
2007Design for reliability with AuSn interconnects
Dudek, R.; Wittler, O.; Faust, W.; Brämer, B.; Klein, M.; Jun, W.; Michel, B.
Conference Paper
2007Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept
Roellig, M.; Dudek, R.; Wiese, S.; Boehme, B.; Wunderle, B.; Wolter, K.-J.; Michel, B.
Journal Article
2007In-situ Microscopic Studies on Microstructural Degradation and FE Analyses for Miniaturized SAC Solder Joints under Thermal Test- and Field Cycling
Dudek, R.; Faust, W.; Döring, R.; Michel, B.
Conference Paper
2007Low-cycle fatigue of Ag-based solders dependent on alloying composition and thermal cycle conditions
Dudek, R.; Faust, W.; Wiese, S.; Röllig, M.; Michel, B.
Conference Paper
2007Microstucture of Damaged Solder
Faust, W.; Dudek, R.; Michel, B.
Conference Paper
2007Multi-objective parametric approach to numerical optimization of stacked packages
Dowhán, L.; Wymyslowski, A.; Dudek, R.
Conference Paper
2007Numerical Analysis for Thermo-Mechanical Reliability of Polymers in Electronic Packaging
Dudek, R.; Walter, H.; Auersperg, J.; Michel, B.
Conference Paper
2007Reliability Investigation of Large GaAs Pixel Detectors Flip Chip Bonded on Si Readout Chips
Klein, M.; Oppermann, H.; Hutter, M.; Fritzsch, T.; Engelmann, G.; Dietrich, L.; Wolf, J.; Brämer, B.; Dudek, R; Reichl, H.
Conference Paper
2007Schadensanalyse in der AVT am Beispiel bleifreier Lotverbindungen
Faust, W.; Dudek, R.; Michel, B.; Poller, T.
Conference Paper
2007Zuverlässigkeit für elektronische Bauelemente mit hoher Packungsdichte
Sommer, J.-P.; Dudek, R.; Michel, B.; Noack, E.; Seiler, B.
Conference Paper
2006Characterization and modelling of solder joint reliability
Dudek, R.
Book Article
2006Combined fracture, delamination risk and fatigue evaluation of advanced microelectronics applications towards RSM/DOE concepts
Auersperg, J.; Dudek, R.; Michel, B.
Conference Paper
2006Deformation and fatigue behaviour of AuSn interconnects
Wittler, O.; Walter, H.; Dudek, R.; Faust, W.; Jun, W.; Michel, B.
Conference Paper
2006Experimental investigation for fracture analysis of solder joints in microelectronic and mems applications
Walter, H.; Bombach, C.; Dudek, R.; Faust, W.; Michel, B.
Conference Paper
2006Fatigue Life Prediction and Analysis of Wafer Level Packages with SnAgCu Solder Balls
Dudek, R.; Rzepka, S.; Dobritz, S.; Döring, R.; Kreißig, K.; Wiese, S.; Michel, B.
Conference Paper
2006A FE-study of solder fatigue compared to microstructural damage evaluation by in-situ laser scanning and FIB microscopy
Dudek, R.; Faust, W.; Gollhard, A.; Michel, B.
Conference Paper
2006Lifetime prediction for advanced packaging based on physics of failure approaches on a micro and nano-scale
Wunderle, B.; Dudek, R.; Vogel, D.; Michel, B.
Abstract
2006Parametric approach to numerical design for optimization of stacked packages
Dowhán, L.; Wymyslowski, A.; Dudek, R.; Auersperg, J.
Conference Paper
2006Simulation of Deformation and Fracture Behaviour in Microelectronic Packaging
Wittler, O.; Walter, H.; Keller, J.; Dudek, R.; Vogel, D.; Michel, B.
Conference Paper
2006Simulation of Interface Cracks in Microelectronic Packaging
Auersperg, J.; Seiler, B.; Cadalen, E.; Dudek, R.; Michel, B.
Conference Paper
2006Thermo-mechanical Design of Resilient Contact Systems for Wafer Level Packaging
Dudek, R.; Walter, H.; Döring, R.; Michel, B.; Meyer, T.; Zapf, J.; Hedler, H.
Conference Paper
2005A comparative study of solder fatigue evaluated by microscopic in-situ analysis, on-line resistance measurement and FE calculations
Dudek, R.; Faust, W.; Vogel, J.; Michel, B.
Conference Paper
2005Fracture and Fatigue Behaviour of MEMS related Micro Materials
Walter, H.; Dudek, R.; Michel, B.
Conference Paper
2005Fracture Mechanics Based Crack and Delamination Risk Evaluation and RSM/DOE Concepts for Advanced Microelectronics Applications
Auersperg, J.; Seiler, B.; Cadalen, E.; Dudek, R.; Michel, B.
Conference Paper
2005Novel test concept for experimental lifetime prediction of miniaturized lead-free solder contacts
Roellig, M.; Dudek, R.; Wiese, S.; Wunderle, B.; Wolter, K.-J.; Michel, B.
Conference Paper
2005Novell test concept for experimental lifetime prediction of miniaturized lead-free solder contacts
Röllig, M.; Dudek, R.; Wiese, S.; Wunderle, B.; Wolter, K.-J.; Michel, B.
Conference Paper
2005Relevance of primary creep in thermo-mechanical cycling for life-time prediction in Sn-based solders
Déplanque, S.; Nüchter, W.; Spraul, M.; Wunderle, B.; Dudek, R.; Michel, B.
Conference Paper
2005Reliability Analyses of Pb- and SnAgCu Solder Interconnects at Ceramic Quartz Components Subjected to Several test and Field Conditions
Dudek, R.; Döring, R.; Michel, B.; Picault, A.; Autissier, J.-F.
Conference Paper
2005Reliability Testing of Polytronics Components in the Micro-Nano Region
Michel, B.; Dudek, R.; Walter, H.
Conference Paper
2005Thermal Lap Shear Tests on MEMS Interconnect Solder joints
Vogel, J.; Dudek, R.; Faust, W.; Dost, M.; Michel, B.
Conference Paper
2005Thermo-mechanical design for reliability of WLPs with compliant interconnects
Dudek, R.; Walter, H.; Doering, R.; Michel, B.; Meyer, T.; Zapf, J.; Hedler, H.
Conference Paper
2005Thermo-mechanical reliability analysis on solder joints of ceramic components
Dudek, R.; Döring, R.; Michel, B.; Picault, A.; Autissier, J.-F.
Conference Paper
2004FE-analysis of leaded and lead-free solder joints under thermal fatigue loading
Dudek, R.; Walter, H.; Döring, R.; Michel, B.
Book Article
2004In-situ solder fatigue studies using a thermal lap shear test
Dudek, R.; Faust, W.; Vogel, J.; Michel, B.
Conference Paper
2004Investigations on the reliability of lead-free CSP subjected to harsh environments
Dudek, R.; Döring, R.; Michel, B.
Conference Paper
2004Thermal fatigue modelling for SnAgCu and SnPb solder joints
Dudek, R.; Walter, H.; Döring, R.; Michel, B.
Conference Paper
2004Thermo-mechanical reliability of power flip-chip cooling concepts
Wunderle, B.; Dudek, R.; Michel, B.; Reichl, H.
Conference Paper
2004Zuverlässigkeitsbewertung elektronischer Baugruppen mit modernen Mikro- und Nanomesstechniken in Kopplung zur Simulation
Michel, B.; Dudek, R.; Keller, J.; Luczak, F.
Conference Paper
2003Combining DIC techniques and finite element analysis for reliability assessment on micro and nano scale
Vogel, D.; Dudek, R.; Keller, J.; Michel, B.
Conference Paper
2003Investigations on low cycle fatigue of electrodeposited thin copper and nickel films
Dudek, R.; Walter, H.; Michel, B.; Zapf, J.
Conference Paper
2003Reliability Evaluations of Lead Free Soldered Packages
Walter, H.; Auerswald, E.; Schubert, A.; Dudek, R.; Michel, B.
Conference Paper
2003Reliability prediction of area array solder joints
Dudek, R.; Döring, R.; Michel, B.
Journal Article
2003Swept away. QWIPs are fast and can have ideal (~100%) absorption tool
Liu, H.C.; Dudek, R.; Oogarah, T.; Grant, P.D.; Wasilewski, R.; Schneider, H.; Steinkogler, S.; Walther, M.; Koidl, P.
Journal Article
2003Thermo-mechanical reliability aspects and finite element simulation in packaging
Dudek, R.; Auersperg, J.; Michel, B.; Reichl, H.
Conference Paper
2002Lead-free solder interconnects - characterization, testing and reliability
Schubert, A.; Dudek, R.; Walter, H.; Auerswald, E.; Gollhardt, A.; Michel, B.; Schuch, B.
Conference Paper
2002On the mode II popcorn effect in thin packages
Alpern, P.; Dudek, R.; Schmidt, R.; Wicher, V.; Tilgner, R.
Journal Article
2002Parameterized FE-modeling and interfacial fracture toughness investigations towards reliability enhancements of advanced plastic packages
Auersperg, R.; Dudek, R.; Michel, B.
Conference Paper
2002Reliability assessment of flip-chip assemblies with lead-free solder joints
Schubert, A.; Dudek, R.; Walter, H.; Jung, E.; Gollhardt, A.; Michel, B.; Reichl, H.
Conference Paper
2002A simple model for the mode I popcorn effect for IC packages with copper leadframe
Alpern, P.; Lee, K.C.; Dudek, R.; Tilgner, R.
Journal Article
2002Studies on moisture diffusion and popcorn cracking
Dudek, R.; Walter, H.; Michel, B.
Conference Paper
2002Thermo-mechanical reliability of lead-free solder interconnects
Schubert, A.; Dudek, R.; Döring, R.; Walter, H.; Auerswald, E.; Gollhardt, A.; Michel, B.
Conference Paper
2001Constitution behaviour of lead-free solders vs. lead-containing solders - Experiments on bulk specimens and flip-chip joints
Wiese, S.; Schubert, A.; Walter, H.; Dudek, R.; Meusel, E.; Michel, B.
Conference Paper
2001Lead-free flip-chip solder interconnects - materials mechanics and reliability issues
Schubert, A.; Dudek, R.; Walter, H.; Jung, E.; Gollhardt, A.; Michel, B.
Journal Article, Conference Paper
2001The microDAC deformation analysis - a new method for testing and evaluation of solder interconnect reliability
Michel, B.; Dudek, R.; Vogel, D.
Conference Paper
2001mTest - A new approach to measure material properties from microscopic specimens
Vogel, D.; Gollhardt, A.; Walter, H.; Dudek, R.; Kühnert, R.; Michel, B.
Conference Paper
2001Reliability prediction of area array solder joints
Dudek, R.; Döring, R.; Michel, B.
Conference Paper
2001Studies on parameters for popcorn cracking
Dudek, R.; Walter, H.; Michel, B.; Alpern, P.; Schmidt, R.; Tilgner, R.
Conference Paper
2001Studies on parameters for popcorn cracking
Dudek, R.; Walter, H.; Michel, B.; Alpern, P.; Schmidt, R.; Tilgner, R.
Journal Article, Conference Paper
2001Thermo-mechanical properties and creep deformation of lead-containing and lead-free solders
Schubert, A.; Walter, H.; Dudek, R.; Michel, B.; Lefranc, G.; Otto, J.; Mitic, G.
Conference Paper
2000Analyses of flip-chip attach reliability
Dudek, R.; Schubert, A.; Michel, B.
Conference Paper
2000Characterization of Micro Materials and Micro Components by Combination of the Micro-Bending Test and UNIDAC
Michel, B.; Seiler, B.; Dost, M.; Wielage, B.; Kieselstein, E.; Winkler, T.; Dudek, R.; Auersperg, J.; Schubert, A.; Schneider, W.
Conference Paper
2000Experimental and numerical analyses of flip-chip attach reliability
Schubert, A.; Dudek, R.; Michel, B.
Conference Paper
2000Experimental and numerical reliability investigations of FCOB assemblies with process-induced defects
Schubert, A.; Dudek, R.; Kloeser, J.; Michel, B.; Reichl, H.; Hauck, T.; Kaskoun, K.
Conference Paper
2000Investigation of interface cracking in electronic packages
Kieselstein, E.; Seiler, B.; Winkler, T.; Auersperg, J.; Dudek, R.; Schubert, A.; Schneider, W.; Michel, B.
Conference Paper
2000Numerical and experimental investigations of large IC flip chip attach
Schubert, A.; Dudek, R.; Leutenbauer, R.; Coskina, P.; Becker, K.-F.; Kloeser, J.; Michel, B.; Reichl, H.; Baldwin, D.; Qu, J.; Sitaraman, S.; Wong, C.P.; Tummala, R.
Conference Paper
2000Package reliability studies by experimental and numerical analysis
Schubert, A.; Dudek, R.; Michel, B.; Reichl, H.
Conference Paper
2000Parameterization in finite element modeling of microelectronics packages
Auersperg, J.; Döring, R.; Dudek, R.; Michel, B.
Book Article
2000Reliability investigations of FCOB assemblies with process-induced defects
Schubert, K.; Dudek, R.; Klöser, J.; Michel, B.; Reichl, H.; Hauck, T.; Kaskoun, K.
Conference Paper
2000Reliability investigations on conductive adhesive joints with emphasis on the mechanics of the conduction mechanism
Dudek, R.; Berek, H.; Fritsch, T.; Michel, B.
Journal Article
2000Results of Experimental Vibration Measurements as Input of Numerical Reliability Valuations
Schnitzer, R.; Rümmler, N.; Dudek, R.; Michel, B.
Conference Paper
2000A simple model for the mode I popcorn effect for IC packages
Alpern, P.; Lee, K.C.; Dudek, R.; Tilgner, R.
Conference Paper, Journal Article
2000Simulation for fatigue, crack and delamination
Dudek, R.; Auersperg, J.; Michel, B.
Conference Paper
2000Simulation for fatigue, cracks and delamination
Dudek, R.; Auersperg, J.; Michel, B.
Conference Paper
2000Stress-induced laterial deflections of microstructures
Küchler, M.; Knöfler, R.; Steiniger, c.; Raschke, T.; Gessner, T.; Dudek, R.; Döring, R.
Conference Paper
2000Thermo-mechanical reliability of microcomponents
Dudek, R.; Schubert, A.; Michel, B.
Conference Paper
1999An efficient approach to predict solder fatigue life and its application to SM- and area array components
Dudek, R.; Nylen, M.; Schubert, A.; Michel, B.; Reichl, H.
Book Article
1999Flip chip solder joint reliability
Schubert, A.; Dudek, R.; Vogel, D.; Becker, K.-F.; Kloeser, J.; Michel, B.; Reichl, H.
Conference Paper
1999Investigations on popcorn cracking of T-QFP packages
Dudek, R.; Sommer, J.-P.; Michel, B.; Alpern, P.; Birzer, C.; Tilgner, R.
Book Article
1999Materials mechanics and thermo-mechanical reliability of flip chip area array packages
Schubert, A.; Dudek, R.; Michel, B.
Conference Paper
1998Improvement of the thermo-mechanical performance of advanced packages by experimentally assisted FE-analysis
Michel, B.; Dudek, R.; Schubert, A.
Conference Paper
1998Nonlinear FEA for thermo-mechanical reliability. Estimation of advanced electronic packages
Auersperg, J.; Döring, R.; Dudek, R.; Michel, B.
Conference Paper
1998Reliability investigations of flip chip interconnects in FCOB and FCOG applications by FEA
Schubert, A.; Dudek, R.; Döring, R.; Michel, B.
Conference Paper
1998Thermo-mechanical reliability of flip chip structures used in DCA and CSP
Schubert, A.; Dudek, R.; Vogel, D.; Michel, B.; Reichl, H.
Conference Paper
1997An efficient approach to predict solder fatigue life and its application to SM- and area array components
Dudek, R.; Nylen, M.; Schubert, A.; Michel, B.; Reichl, H.
Conference Paper
1997Fatigue life studies on Flip Chip, PBGA and PQFP solder joints
Dudek, R.; Nylen, M.; Gustavsson, U.; Michel, B.
Conference Paper
1997FE-Simulation for polymeric packaging materials
Dudek, R.; Scherzer, M.; Schubert, A.; Michel, B.
Conference Paper
1997Materials mechanics and mechanical reliability of flip chip assemblies on organics substrates
Schubert, A.; Dudek, R.; Michel, B.; Reichl, H.; Jiang, H.
Conference Paper
1997Materials mechanics and mechanical reliability of flip chip assemblies on organics substrates
Schubert, A.; Dudek, R.; Vogel, D.; Michel, B.; Reichl, H.
Journal Article
1997Mechanical reliability study of FCOB and CSP assemblies by FEA and MicroDAC
Schubert, A.; Dudek, R.; Vogel, D.; Auersperg, J.; Michel, B.; Reichl, H.
Conference Paper
1997Predict solder fatigue life and its application to SM- and area array components
Dudek, R.; Nylen, M.; Schubert, A.; Michel, B.; Reichl, H.
Conference Paper
1997Problem-adapted 3D finite element modelling for VLSI components
Döring, R.; Sommer, J.-P.; Dudek, R.; Michel, B.
Conference Paper
1997Thermo-mechanical reliability analysis of flip chip assemblies by combined MicroDAC and the Finite Element Method
Schubert, A.; Dudek, R.; Auersperg, J.; Vogel, D.; Michel, B.; Reichl, H.
Conference Paper
1997Thermo-mechanical reliability issues of flip chip structures used in DCA and CSP
Schubert, A.; Dudek, R.; Auersperg, J.; Vogel, D.; Michel, B.; Reichl, H.
Conference Paper
1996Die Finite-Elemente Methode als Analysewerkzeug in der Mikrotechnik
Sommer, J.-P.; Dudek, R.; Michel, B.
Book Article
1996Mechanisch-thermische Zuverlässigkeit von Chipkarten
Schubert, A.; Dudek, R.; Faust, W.; Vogel, D.; Michel, B.; Reichl, H.
Book Article
1996Zuverlässigkeitsuntersuchungen an AlN-Cu-Verbunden
Auerswald, E.; Kämpfe, B.; Dudek, R.; Faust, W.
Book Article
1995Anwendungen der Laser Scanning Mikroskopie in der Mikrosystemtechnik
Faust, W.; Dudek, R.; Michel, B.; Dost, M.
Conference Paper
1995Anwendungen der Laser Scanning Mikroskopie in der Mikrosystemtechnik
Faust, W.; Dudek, R.; Michel, B.; Dost, M.
Conference Paper
1995Attachment reliability of electronic components mounted on printed circuit substrates
Sorensen, T.A.; Dudek, R.
Conference Paper
1995FEM-Anwendungen auf mechanisch-thermische Probleme in der Mikrotechnik
Auersperg, J.; Kaulfersch, E.; Dudek, R.; Michel, B.
Conference Paper
1995Lötstellenbewertung an SMD-Aufbauten
Dudek, R.; Sommer, J.-P.; Faust, W.; Döring, R.
Conference Paper
1995Mechanisch-thermische Simulation und Lebensdauerbewertung von mikrotechnischen Komponenten
Sommer, J.-P.; Dudek, R.; Faust, W.; Michel, B.
Book Article
1995Numerische Beanspruchungsanalyse an mikrotechnischen Baugruppen mit Kunststoffgehäuse
Sommer, J.-P.; Dudek, R.; Michel, B.
Conference Paper
1995Thermal and mechanical characterization of electronic packages in extremely high frequency applications by means of finite element analysis
Sommer, J.-P.; Dudek, R.; Michel, B.; Boheim, M.; Hager, W.
Conference Paper
1995Thermische Verformungsuntersuchungen an Polymer-Abdeckmassen für Si-Chips - Simulation Tauchlötvorgang
Grosser, V.; Vogel, D.; Bombach, C.; Dudek, R.; Michel, B.
Book Article
1995Thermomechanische Analysen mikrotechnischer Komponenten
Faust, W.; Dudek, R.; Michel, B.
Conference Paper
1995Zuverlässigkeitsuntersuchungen an AlN-Verbunden, angewendet auf die Mikrosystem-Modultechniken
Auerswald, E.; Dudek, R.; Faust, W.; Kämpfe, B.
Conference Paper
1994Experimental and numerical investigations of thermo-mechanically stressed micro-components
Michel, B.; Schubert, A.; Dudek, R.; Grosser, V.
Journal Article
1994Optical deformation analysis of surface mounted devices
Vogel, D.; Kaulfersch, E.; Dudek, R.; Michel, B.
Conference Paper
1994Reliability of epoxy Globtop in microelectronic assemblies
Krause, F.; Voges, T.; Rehme, F.; Dudek, R.; Vogel, D.; Faust, W.
Conference Paper
1994Thermal reliability assessment in SM- and COB-technology by combined experimental and finite element method
Dudek, R.; Michel, B.
Conference Paper
1993Beanspruchung von Lötverbindungen oberflächenmontierter ICs in Abhängigkeit von der Pin-Form
Dudek, R.; Faust, W.; Michel, B.; Hartmann, H.J.
Conference Paper
1993Determination of residual stress in a ceramic multilayer chip capacitor
Schubert, A.; Kämpfe, B.; Dudek, R.; Skurt, L.
Conference Paper
1993Zuverlässigkeitsbewertung hochbeanspruchter elektronischer Baugruppen. Teil 1
Michel, B.; Großer, V.; Dudek, R.; Kühnert, R.; Schubert, A.
Journal Article
1993Zuverlässigkeitsbewertung hochbeanspruchter elektronischer Baugruppen. Teil 2
Michel, B.; Großer, V.; Dudek, R.; Kühnert, R.; Schubert, A.
Journal Article