Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Insights into interactions and microscopic behavior of shale gas in organic-rich nano-slits by molecular simulation
Li, Y.; Hu, Z.; Liu, X.; Gao, S.; Duan, X.; Chang, J.; Wu, J.
Journal Article
2016Efficient total crosstalk analysis of large via arrays in silicon interposers
Dahl, D.; Reuschel, T.; Preibisch, J.B.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C.
Journal Article
2016Glass based interposers for RF applications up to 100GHz
Woehrmann, M.; Juergensen, N.; Lutz, M.; Wilke, M.; Duan, X.; Ndip, I.; Töpper, M.; Lang, K.-D.
Conference Paper
2016High frequency characterization of silicon substrate and through silicon vias
Duan, X.; Boettcher, M.; Dahl, D.; Schuster, C.; Tschoban, C.; Ndip, I.; Lang, K.-D.
Conference Paper
2016On the upper bound of total uncorrelated crosstalk in large through silicon via arrays
Dahl, D.; Reuschel, T.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C.
Conference Paper
2016A rigorous approach for the modeling of through-silicon via pairs using multipole expansions
Duan, X.M.; Dahl, D.; Ndip, I.; Lang, K.D.; Schuster, C.
Journal Article
2015Comparison of passivation materials for high frequency 3D packaging application up to 110 GHz
Duan, X.; Böttcher, M.; Dobritz, S.; Dahl, D.; Schuster, C.; Ndip, I.; Lang, K.-D.
Conference Paper
2015Efficient analysis of wave propagation for Through-Silicon-Via pairs using multipole expansion method
Duan, Xiaomin; Dahl, D.; Schuster, C.; Ndip, I.; Lang, K.-D.
Conference Paper
2015Efficient computation of localized fields for through silicon via modeling up to 500 GHz
Dahl, D.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C.
Journal Article
2014Analysis of wave propagation along coaxial through silicon vias using a matrix method
Dahl, D.; Beyreuther, A.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C.
Conference Paper
2014Optimization of microstrip-to-via transition for high-speed differential signaling on printed circuit boards by suppression of the parasitic modes in shared antipads
Duan, X.; Hardock, A.; Ndip, I.; Schuster, C.; Lang, K.-D.
Conference Paper
2013Application of the transverse resonance method for efficient extraction of the dispersion relation of arbitrary layers in silicon interposers
Dahl, D.; Duan, X.; Beyreuther, A.; Ndip, I.; Lang, K.-D.; Schuster, C.
Conference Paper
2013Applying a physics-based via model for the simulation of Through Silicon Vias
Dahl, D.; Duan, X.; Beyreuther, A.; Ndip, I.; Lang, K.-D.; Schuster, C.
Conference Paper