Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2020Influence of Flexibility of the Interconnects on the Dynamic Bending Reliability of Flexible Hybrid Electronics
Palavesam, Nagarajan; Hell, Waltraud; Drost, Andreas; Landesberger, Christof; Kutter, Christoph; Bock, Karlheinz
Journal Article
2020Temperature driven memristive switching in Al/TiO2/Al devices
Reiser, Daniel; Drost, Andreas; Chryssikos, Domenikos; Eisele, Ignaz; Tornow, Marc
Conference Paper
2019A novel low cost roll-to-roll manufacturing compatible ultra-thin chip integration and direct metal interconnection process for flexible hybrid electronics
Palavesam, Nagarajan; Hell, Waltraud; Drost, Andreas; Landesberger, Christof; Kutter, Christoph; Bock, Karlheinz
Conference Paper
2019A novel low cost roll-to-roll manufacturing compatible ultra-thin chip integration and direct metal interconnection process for flexible hybrid electronics
Palavesam, Nagarajan; Hell, Waltraud; Drost, Andreas; Landesberger, Christof; Kutter, Christoph; Bock, Karlheinz
Journal Article, Conference Paper
2018Polyimide-based capacitive humidity sensor
Boudaden, Jamila; Steinmaßl, Matthias; Endres, Hanns-Erik; Drost, Andreas; Eisele, Ignaz; Kutter, Christoph; Müller-Buschbaum, Peter
Journal Article
2012Flexible multilayered circuit substrate, has flexible film substrates with opposing main surfaces, where bonding material of specific thickness is applied at connecting areas for separating flexible film substrates
Faul, Robert; Drost, Andreas
Patent