Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. | | |
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| 2020 | Influence of Flexibility of the Interconnects on the Dynamic Bending Reliability of Flexible Hybrid Electronics
Palavesam, Nagarajan; Hell, Waltraud; Drost, Andreas; Landesberger, Christof; Kutter, Christoph; Bock, Karlheinz | Journal Article |
| 2020 | Temperature driven memristive switching in Al/TiO2/Al devices
Reiser, Daniel; Drost, Andreas; Chryssikos, Domenikos; Eisele, Ignaz; Tornow, Marc | Conference Paper |
| 2019 | A novel low cost roll-to-roll manufacturing compatible ultra-thin chip integration and direct metal interconnection process for flexible hybrid electronics
Palavesam, Nagarajan; Hell, Waltraud; Drost, Andreas; Landesberger, Christof; Kutter, Christoph; Bock, Karlheinz | Conference Paper |
| 2019 | A novel low cost roll-to-roll manufacturing compatible ultra-thin chip integration and direct metal interconnection process for flexible hybrid electronics
Palavesam, Nagarajan; Hell, Waltraud; Drost, Andreas; Landesberger, Christof; Kutter, Christoph; Bock, Karlheinz | Journal Article, Conference Paper |
| 2018 | Polyimide-based capacitive humidity sensor
Boudaden, Jamila; Steinmaßl, Matthias; Endres, Hanns-Erik; Drost, Andreas; Eisele, Ignaz; Kutter, Christoph; Müller-Buschbaum, Peter | Journal Article |
| 2012 | Flexible multilayered circuit substrate, has flexible film substrates with opposing main surfaces, where bonding material of specific thickness is applied at connecting areas for separating flexible film substrates
Faul, Robert; Drost, Andreas | Patent |