Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2020Influence of Flexibility of the Interconnects on the Dynamic Bending Reliability of Flexible Hybrid Electronics
Palavesam, Nagarajan; Hell, Waltraud; Drost, Andreas; Landesberger, Christof; Kutter, Christoph; Bock, Karlheinz
Journal Article
2020Temperature driven memristive switching in Al/TiO2/Al devices
Reiser, Daniel; Drost, Andreas; Chryssikos, Domenikos; Eisele, Ignaz; Tornow, Marc
Conference Paper
2019A novel low cost roll-to-roll manufacturing compatible ultra-thin chip integration and direct metal interconnection process for flexible hybrid electronics
Palavesam, Nagarajan; Hell, Waltraud; Drost, Andreas; Landesberger, Christof; Kutter, Christoph; Bock, Karlheinz
Conference Paper
2019A novel low cost roll-to-roll manufacturing compatible ultra-thin chip integration and direct metal interconnection process for flexible hybrid electronics
Palavesam, Nagarajan; Hell, Waltraud; Drost, Andreas; Landesberger, Christof; Kutter, Christoph; Bock, Karlheinz
Journal Article
2019Piezoelektrisch angetriebene Silizium Mikropumpe der Baugröße 3,5 x 3,5 x 0,6 mm3
Richter, M.; Leistner, H.; Congar, Y.; Drost, A.; Kibler, S.; Röhl, S.; Wackerle, M.
Conference Paper
2018Polyimide-based capacitive humidity sensor
Boudaden, Jamila; Steinmaßl, Matthias; Endres, Hanns-Erik; Drost, Andreas; Eisele, Ignaz; Kutter, Christoph; Müller-Buschbaum, Peter
Journal Article
2016Novel processing scheme for embedding and interconnection of ultra-thin IC devices in flexible chip foil packages and recurrent bending reliability analysis
Landesberger, C.; Palavesam, N.; Hell, W.; Drost, A.; Faul, R.; Gieser, H.; Bonfert, D.; Bock, K.; Kutter, C.
Conference Paper
2016Thin chip foil packaging: An enabling technology for ultra-thin packages
Landesberger, C.; Palavesam, N.; Drost, A.; Hell, W.; Faul, R.; Kutter, C.
Journal Article
2015Self-aligned flexible organic thin-film transistors with gates patterned by nano-imprint lithography
Gold, H.; Haase, A.; Fian, A.; Prietl, C.; Striedinger, B.; Zanella, F.; Marjanović, N.; Ferrini, R.; Ring, J.; Lee, K.D.; Jiawook, R.; Drost, A.; König, M.; Müller, R.; Myny, K.; Genoe, J.; Kleb, U.; Hirshy, H.; Prétôt, R.; Kraxner, J.; Schmied, R.; Stadlober, B.
Journal Article
2014Interflex: Challenges and solutions to fabricate a double-sided wiring layer for a "system in foil"
Yacoub-George, E.; Drost, A.; Hemmetzberger, D.; Bollmann, D.; Faul, R.; Bock, K.
Conference Paper
2014Multifunctional system integration in flexible substrates
Bock, K.; Yacoub-George, E.; Hell, W.; Drost, A.; Wolf, H.; Bollmann, D.; Landesberger, C.; Klink, G.; Gieser, H.; Kutter, C.
Conference Paper
2013Design and modeling of self-aligned nano-imprinted sub-micrometer pentacene-based organic thin-film transistors
Zanella, F.; Marjanovi, N.; Ferrini, R.; Gold, H.; Haase, A.; Fian, A.; Stadlober, B.; Müller, R.; Genoe, J.; Hirshy, H.; Drost, A.; König, M.; Lee, K.-D.; Ring, J.; Prétôt, R.; Enz, C.C.; Sallese, J.-M.
Journal Article
2012Anwendung des Plasma-Ätzens in der Rolle-zu-Rolle Prozessierung von Folien
Nettinger, K.; Schaber, U.; Drost, A.
Journal Article
2012Flexible multilayered circuit substrate, has flexible film substrates with opposing main surfaces, where bonding material of specific thickness is applied at connecting areas for separating flexible film substrates
Faul, Robert; Drost, Andreas
Patent
2009Electrostatic wafer handling for thin wafer processing
Landesberger, C.; Wieland, R.; Klumpp, A.; Ramm, P.; Drost, A.; Schaber, U.; Bonfert, D.; Bock, K.
Conference Paper
2009Elektrisch funktionales Foliensystem und Verfahren zur Herstellung eines elektrisch funktionalen Foliensystems
Drost, A.; König, M.; Strohhöfer, C.; Klink, G.
Patent
2009Elektrisch funktionales Mehrschichtfoliensystem und Verfahren zum Herstellen desselben
Drost, A.; König, M.; Strohhöfer, C.; Klink, G.; Hemmetzberger, D.
Patent
2009Individualisierung einer Karte
Landesberger, C.; Yacoub-George, E.; Drost, A.; Klink, G.
Patent
2007Roll-to-roll microfabrication of polymer microsystems
Strohhöfer, C.; Klink, G.; Feil, M.; Drost, A.; Bollmann, D.; Hemmetzberger, D.; Bock, K.
Journal Article
2007Roll-to-roll microfabrication of polymer systems
Strohhöfer, C.; Klink, G.; Feil, M.; Drost, A.; Bollmann, D.; Hemmetzberger, D.; Bock, K.
Journal Article
2006Handling and processing of thin semiconductor substrates
Landesberger, C.; Bollmann, D.; Drost, A.; Schaber, U.; Bock, K.
Conference Paper
2006Polymer Electronic Circuits Based on Reel-to-Reel Photolithography
Klink, G.; Drost, A.; Hammerl, E.; Hemmetzberger, D.; Strohhöfer, C.; Bock, K.
Conference Paper
2005Processing of thin substrates by means of electrostatic carriers
Landesberger, C.; Bollmann, D.; Bock, K.; Drost, A.; Schaber, U.
Conference Paper
2005Reel-to-reel fabrication of integrated circuits based on soluble polymer semiconductor
Klink, G.; Hammerl, E.; Drost, A.; Hemmetzberger, D.; Bock, K.
Conference Paper
2005Studies of fine pitch patterning by reel-to-reel processes for flexible electronic systems
Drost, A.; Klink, G.; Feil, M.; Bock, K.
Conference Paper
2004A bi-directional micro pump for the handling of liquids and gases
Wackerle, M.; Richter, M.; Drost, A.; Schaber, U.; Bigus, H.-J.
Conference Paper
2003Mikromechanisches Relais mit verbessertem Schaltverhalten
Faul, R.; Drost, A.; Pradel, H.
Patent
2003Vorrichtung zur Ueberwachung der Fluiddurchflussrate in einer Fluidleitung
Richter, M.; Wackerle, M.; Drost, A.
Patent
2002Oberflaechenwellenfluessigkeitssensor
Leidl, A.; Langer, P.; Drost, A.
Patent
2002Step towards a standard fabrication method of micro fluid actuators
Kruckow, J.; Brand, S.; Wackerle, M.; Schwan, M.; Stamova, D.; Weidhaas, J.; Drost, A.; Schaber, U.; Richter, M.
Book Article
2001Batch fabrication of silicon micropumps
Richter, M.; Kruckow, J.; Weidhaas, M.; Wackerle, M.; Drost, A.; Schaber, U.; Schwan, M.; Kühl, K.
Conference Paper
2001Full wafer fabrication technologies of micro pumps
Richter, M.; Kruckow, J.; Weidhaas, J.; Drost, A.; Schaber, U.; Kühl, K.
Book Article
2000Mikromechanisches Relais und Verfahren zur Herstellung
Schiele, I.; Faul, R.; Drost, A.
Patent
1998Directly heated quartz crystal microbalance with an integrated dielectric sensor
Roth, M.; Dera, T.; Hillerich, B.; Drost, A.; Hartinger, R.; Wendler, F.; Endres, H.-E.
Journal Article
1998Simultaneous fabrication of dielectric and electrical joints by wafer bonding
Drost, A.; Klink, G.; Scherbaum, S.; Feil, M.
Conference Paper
1998Thin-film processing on a thick-film multilayer
Klink, G.; Drost, A.; Schmaus, C.; Bechtold, F.; Feil, M.
Journal Article
1997Anodic bonding with sputtered Pyrex glass
Drost, A.; Scherbaum, S.; Klink, G.
Conference Paper
1997Directly heated quartz crystal microbalance with an integrated dielectric sensor
Roth, M.; Dera, T.; Hillerich, B.; Drost, A.; Hartinger, R.; Wendler, F.; Endres, H.-E.
Conference Paper
1994Vorrichtung zur Waermeableitung in einem Chip mittels einer als Peltier-Element ausgebildeten Kuehlstelle
Lang, W.; Drost, A.
Patent
1990Measurement of the thermal diffusivity of electrically nonconducting substrates
Hemmetzberger, D.; Emmer, J.; Drost, A.
Conference Paper
1990Reliability investigations of thin film metallizations on AlN-ceramics
Bonfert, D.; Drost, A.; Feil, M.
Conference Paper
1990Thin film metallisation on AlN substrates
Drost, A.; Feil, M.
Conference Paper