Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2017Additive manufacturing using 3D screen printing
Dressler, M.; Studnitzky, T.; Kieback, B.
Conference Paper
20163D screen and stencil printing: Real mass production for metals, ceramics and their combinations
Studnitzky, T.; Dressler, M.; Jurisch, M.; Reuter, K.; Riecker, S.; Strauß, A.; Kieback, B.
Conference Paper
2016Micro parts manufacturing by powder metallurgy (Micro PM)
Kieback, B.; Dressler, M.; Jurisch, M.; Reuter, K.; Riecker, S.; Studnitzky, T.
Conference Paper
2012On the development of a modified button shear specimen to characterize the mixed mode delamination toughness
Durix, L.; Dreßler, M.; Coutellier, D.; Wunderle, B.
Journal Article
2010Reliability study of the stud bump bonding flip chip technology on molded interconnect devices
Dressler, M.; Wunderle, B.; Becker, K.-F.; Reichl, H.
Conference Paper
2009Application of interfacial fracture mechanics approach for obtaining design rules for flip chip interconnections
Dressler, M.; Becker, K.-F.; Wunderle, B.; Auersperg, J.; Reichl, H.
Conference Paper, Journal Article
2006Identifying the reliability affecting parameters of SBB flip chip interconnections for automotive applications
Dreßler, M.; Rohde, H.; Liebing, G.; Becker, K.-F.; Wunderle, B.; Auersperg, J.; Reichl, H.
Conference Paper
2006Influence of assembly process - material properties and geometry on the reliability of flip chip interconnections on MID for automotive applications
Dreßler, M.; Rohde, H.; Liebing, G.; Becker, K.-F.; Wunderle, B.; Reichl, H.
Conference Paper