Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2012Characterizing the anisotropic hardening behavior of aluminum bonding wires
Altenbach, H.; Dresbach, C.; Petzold, M.
Conference Paper
2011Analysis of chip damage risk in thermosonic wire bonding
Dresbach, C.; Lorenz, G.; Petzold, M.; Altenbach, H.
Conference Paper
2010Elastic properties of bonding wires
Dresbach, C.; Mittag, M.; Petzold, M.
Conference Paper
2010Electron backscatter diffraction microstructure investigations of electronic materials down to the nanoscale
Krause, M.; März, B.; Dresbach, C.; Petzold, M.
Conference Paper
2010Mechanical characterization of gold and copper free air balls in thermosonic wire bond interconnections
Lorenz, G.; Petzold, M.; Mittag, M.; Dresbach, C.; Milke, E.
Conference Paper
2010Microstructure and mechanical properties of laser ablation cleaned NiP platings for aluminum wire bonding
Bennemann, S.; Dresbach, C.; Lorenz, G.; Berthold, L.; Petzold, M.
Conference Paper
2010Temperature dependent fracture toughness of glass frit bonding layers
Nötzold, K.; Dresbach, C.; Graf, J.; Böttge, B.
Conference Paper, Journal Article
2009Greatly increased toughness of infiltrated spider silk
Lee, S.-M.; Pippel, E.; Gösele, U.; Dresbach, C.; Qin, Y.; Chandran, C.V.; Bräuniger, T.; Hause, G.; Knez, M.
Journal Article
2009Local hardening behavior of free air balls and heat affected zones of thermosonic wire bond interconnections
Dresbach, C.; Lorenz, G.; Mittag, M.; Petzold, M.; Milke, E.; Müller, T.
Conference Paper
2009Low-temperature ZnO atomic layer deposition on biotemplates
Lee, S.-M.; Grass, G.; Kim, G.-M.; Dresbach, C.; Zhang, L.; Gösele, U.; Knez, M.
Journal Article
2009Temperature dependent fracture toughness of glass frit bonding layers
Nötzold, K.; Dresbach, C.; Graf, J.; Böttge, B.
Conference Paper
2008Mechanical characterization and micro structure diagnostics of glass frit bonded interfaces
Boettge, B.; Dresbach, C.; Graff, A.; Petzold, M.; Bagdahn, J.
Conference Paper
2008Mechanical fatigue properties of heavy aluminium wire bonds for power applications
Merkle, L.; Kaden, T.; Sonner, M.; Gademann, A.; Turki, J.; Dresbach, C.
Conference Paper
2006Fracture mechanical life-time investigation of glass-frit bonded MEMS sensors
Petzold, M.; Dresbach, C.; Ebert, M.; Bagdahn, J.; Wiemer, M.; Glien, K.; Graf, J.; Müller-Fiedler, R.; Höfer, H.
Conference Paper
2006Mechanical properties of glass frit bonded micro packages
Dresbach, C.; Krombholz, A.; Ebert, M.; Bagdahn, J.
Conference Paper, Journal Article
2006Test methods for characterizing the local plastic deformability of bonding wires
Dresbach, C.; Knoll, H.; Schischka, J.; Petzold, M.; Hosseini, K.; Schräpler, L.
Conference Paper
2005Mechanical failure behavior of glass frit bondet structures
Ebert, M.; Dresbach, C.; Krombholz, A.; Bagdahn, J.; Glien, K.; Graf, J.; Müller-Fiedler, R.; Hofer, H.
Conference Paper