Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2020Ferrites in Transfer-Molded Power SiPs: Challenges in Packaging
Thomas, T.; Dijk, M. van; Dreissigacker, M.; Hoffmann, S.; Walter, H.; Becker, K.-F.; Schneider-Ramelow, M.
Journal Article
2020On the feasibility of fan-out wafer-level packaging of capacitive micromachined ultrasound transducers (CMUT) by using inkjet-printed redistribution layers
Roshanghias, A.; Dreissigacker, M.; Scherf, C.; Bretthauer, C.; Rauter, L.; Zikulnig, J.; Braun, T.; Becker, K.-F.; Rzepka, S.; Schneider-Ramelow, M.
Journal Article
2019Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration
Braun, T.; Becker, K.F.; Hoelck, O.; Voges, S.; Kahle, R.; Dreissigacker, M.; Schneider-Ramelow, M.
Journal Article
2019A numerical study on mitigation of flying dies in compression molding of microelectronic packages
Dreissigacker, M.; Hoelck, O.; Bauer, J.; Braun, T.; Becker, K.-F.; Schneider-Ramelow, M.; Lang, K.-D.
Journal Article
2019Numerische und experimentelle Betrachtung des Molded Underfills
Paetsch, M.; Nguyen, T.D.; Dreissigacker, M.; Bauer, J.; Hoelck, O.; Bader, V.; Braun, T.; Zuehlke, J.; Minkus, M.; Voges, S.; Becker, K.-F.; Woehrmann, M.; Lang, K.-D.; Schubert, D.W.; Schneider-Ramelow, M.
Conference Paper
2019Panel Level Packaging for Component Integration of an Energy Harvesting System
Braun, T.; Kahle, R.; Voges, S.; Hölck, O.; Bauer, J.; Becker, K.-F.; Aschenbrenner, R.; Dreissigacker, M.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2019Die Realisierung von Umverdrahtungslagen mittels Inkjet-Printing im Fan-Out Wafer Level Packaging
Dreissigacker, M.; Roshanghias, A.; Becker, K.-F.; Braun, T.; Schneider-Ramelow, M.; Lang, K.D.
Conference Paper
2018Using fluidic simulation for parameter optimization in compression molding of microelectronic packages
Dreissigacker, M.; Hoelck, O.; Raatz, S.; Bauer, J.; Braun, T.; Becker, K.-F.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper