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| 2012 | Delamination modeling for power packages by the cohesive zone approach
Dudek, R.; Doering, R.; Pufall, R.; Kanert, W.; Seiler, B.; Rzepka, S.; Michel, B. | Conference Paper |
| 2010 | Theoretical analysis on the shear test
Dudek, R.; Doering, R.; Kreyssig, K.; Michel, B. | Conference Paper |
| 2009 | Simulation based analysis of secondary effects on solder fatigue
Dudek, R.; Doering, R.; Bombach, C.; Michel, B. | Conference Paper, Journal Article |
| 2009 | Simulation Based Analysis of Secondary Effects on Solder Fatigue
Dudek, R.; Doering, R.; Bombach, C.; Michel, B. | Conference Paper |
| 2007 | In-situ Microscopic Studies on Microstructural Degradation and FE Analyses for Miniaturized SAC Solder Joints under Thermal Test- and Field Cycling
Dudek, R.; Faust, W.; Döring, R.; Michel, B. | Conference Paper |
| 2006 | Advanced packages with buried dies
Sommer, J.-P.; Döring, R.; Dost, M.; Michel, B. | Conference Paper |
| 2006 | Fatigue Life Prediction and Analysis of Wafer Level Packages with SnAgCu Solder Balls
Dudek, R.; Rzepka, S.; Dobritz, S.; Döring, R.; Kreißig, K.; Wiese, S.; Michel, B. | Conference Paper |
| 2006 | Thermo-mechanical Design of Resilient Contact Systems for Wafer Level Packaging
Dudek, R.; Walter, H.; Döring, R.; Michel, B.; Meyer, T.; Zapf, J.; Hedler, H. | Conference Paper |
| 2006 | Zuverlässigkeitsprognostik von in der Leiterplatte integrierten Chips
Sommer, J.-P.; Döring, R.; Dost, M.; Michel, B. | Conference Paper |
| 2005 | Design support for a real pressure sensor by means of finite element analysis
Sommer, J.-P.; Döring, R.; Hussack, J.; Glien, K.; Graf, J.; Müller-Fiedler, R. | Abstract, Conference Paper |
| 2005 | Reliability Analyses of Pb- and SnAgCu Solder Interconnects at Ceramic Quartz Components Subjected to Several test and Field Conditions
Dudek, R.; Döring, R.; Michel, B.; Picault, A.; Autissier, J.-F. | Conference Paper |
| 2005 | Thermo-mechanical Reliability Analysis of Magneto-resistive Current Sensors
Vogel, J.; Kaulfersch, E.; Schmitt, J.; Auersperg, J.; Döring, R.; Jost, F.; Kreyßig, K.; Walter, H.; Hölzl, J. | Conference Paper |
| 2005 | Thermo-mechanical reliability analysis on solder joints of ceramic components
Dudek, R.; Döring, R.; Michel, B.; Picault, A.; Autissier, J.-F. | Conference Paper |
| 2004 | FE-analysis of leaded and lead-free solder joints under thermal fatigue loading
Dudek, R.; Walter, H.; Döring, R.; Michel, B. | Book Article |
| 2004 | Investigations on the reliability of lead-free CSP subjected to harsh environments
Dudek, R.; Döring, R.; Michel, B. | Conference Paper |
| 2004 | Thermal fatigue modelling for SnAgCu and SnPb solder joints
Dudek, R.; Walter, H.; Döring, R.; Michel, B. | Conference Paper |
| 2003 | Reliability prediction of area array solder joints
Dudek, R.; Döring, R.; Michel, B. | Journal Article |
| 2002 | Thermo-mechanical reliability of lead-free solder interconnects
Schubert, A.; Dudek, R.; Döring, R.; Walter, H.; Auerswald, E.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2001 | Gains and challenges of parameterized finite element modeling of microelectronics packages
Auersperg, J.; Döring, R.; Michel, B. | Journal Article, Conference Paper |
| 2001 | Reliability prediction of area array solder joints
Dudek, R.; Döring, R.; Michel, B. | Conference Paper |
| 2001 | A Short Crack Growth Model for the Prediction of Fatigue Lives under Multiaxial Nonproportional Loading
Döring, R.; Hoffmeyer, J.; Seeger, T.; Vormwald, M. | Conference Paper |
| 2000 | Mechanical design support by means of FEA for advanced millimeter wave communication devices
Sommer, J.-P.; Michel, B.; Döring, R.; Hager, W.; Rehme, F. | Conference Paper |
| 2000 | Modular loading and measuring system for material characterization of microcomponents
Vogel, J.; Dost, M.; Seebacher, S.; Osten, W.; Fassler, R.; Köpp, N.; Döring, R.; Sommer, J.-P.; Michel, B. | Conference Paper |
| 2000 | Parameterization in finite element modeling of microelectronics packages
Auersperg, J.; Döring, R.; Dudek, R.; Michel, B. | Book Article |
| 2000 | Reliability investigations of vibration excited circuit boards
Rümmler, N.; Schnitzer, R.; Döring, R.; Kaulfersch, E.; Faust, W.; Michel, B. | Conference Paper |
| 2000 | Stress-induced laterial deflections of microstructures
Küchler, M.; Knöfler, R.; Steiniger, c.; Raschke, T.; Gessner, T.; Dudek, R.; Döring, R. | Conference Paper |
| 1998 | Nonlinear FEA for thermo-mechanical reliability. Estimation of advanced electronic packages
Auersperg, J.; Döring, R.; Dudek, R.; Michel, B. | Conference Paper |
| 1998 | Reliability investigations of flip chip interconnects in FCOB and FCOG applications by FEA
Schubert, A.; Dudek, R.; Döring, R.; Michel, B. | Conference Paper |
| 1997 | Characterization of packages for laser diodes
Auerswald, E.; Döring, R.; Nechansky, H.; Kämpfe, B.; Michel, B. | Conference Paper |
| 1997 | Problem-adapted 3D finite element modelling for VLSI components
Döring, R.; Sommer, J.-P.; Dudek, R.; Michel, B. | Conference Paper |
| 1995 | Lötstellenbewertung an SMD-Aufbauten
Dudek, R.; Sommer, J.-P.; Faust, W.; Döring, R. | Conference Paper |