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| 2012 | Nanoporous gold bumps for low temperature bonding
Oppermann, H.; Dietrich, L. | Journal Article |
| 2011 | Reliability investigation of large GaAs pixel detectors flip-chip-bonded on Si readout chips
Klein, M.; Hutter, M.; Engelmann, G.; Fritzsch, T.; Oppermann, H.; Dietrich, L.; Wolf, M.J.; Brämer, B.; Dudek, R.; Reichl, H. | Journal Article |
| 2010 | Advances in thermal interface technology: Mono-metal interconnect formation, processing and characterisation
Wunderle, B.; Klein, M.; Dietrich, L.; Abo Ras, M.; Mrossko, R.; May, D.; Schacht, R.; Oppermann, H.; Michel, B.; Reichl, H. | Conference Paper |
| 2010 | Integration of carrierless ultrathin wafers into a TSV process flow
Bieck, F.; Spiller, S.; Molina, F.; Töpper, M.; Lopper, C.; Kuna, I.; Fischer, T.; Röder, J.; Dietrich, L.; Tabuchi, T. | Conference Paper |
| 2010 | Nanoporous interconnects
Oppermann, H.; Dietrich, L.; Klein, M.; Wunderle, B. | Conference Paper |
| 2010 | Progress in thermal characterisation methods and thermal interface technology within the "Nanopack" project
Wunderle, B.; Ras, M.A.; Klein, M.; Mrossko, R.; Engelmann, G.; May, D.; Wittler, O.; Schacht, R.; Dietrich, L.; Oppermann, H.; Michel, B. | Conference Paper |
| 2008 | Development and evaluation of lead free reflow soldering techniques for the flip chip bonding of large GaAs pixel detectors on Si readout chips
Klein, M.; Hutter, M.; Oppermann, H.; Fritzsch, T.; Engelmann, G.; Dietrich, L.; Wolf, J.; Brämer, B.; Dudek, R.; Reichl, H. | Conference Paper |
| 2007 | Reliability Investigation of Large GaAs Pixel Detectors Flip Chip Bonded on Si Readout Chips
Klein, M.; Oppermann, H.; Hutter, M.; Fritzsch, T.; Engelmann, G.; Dietrich, L.; Wolf, J.; Brämer, B.; Dudek, R; Reichl, H. | Conference Paper |
| 2007 | Verfahren zum Herstellen einer nanoporoesen Schicht
Oppermann, H.; Dietrich, L.; Engelmann, G.; Wolf, J. | Patent |
| 2006 | Conformance of ECD wafer bumping to future demands on CSP, 3D integration and MEMS
Dietrich, L.; Toepper, M.; Ehrmann, O.; Reichl, H. | Conference Paper |
| 2006 | Flip chip bumping technology - Status and update
Wolf, M.J.; Engelmann, G.; Dietrich, L.; Reichl, H. | Conference Paper, Journal Article |
| 2006 | Packaging of radiation and particle detectors
Fritzsch, T.; Jordan, R.; Glaw, V.; Töpper, M.; Dietrich, L.; Wolf, J.; Ehrmann, O.; Oppermann, H.; Reichl, H.; Wermes, N. | Conference Paper |
| 2006 | Precise flip chip assembly using electroplated AuSn20 and SnAg3.5 solder
Hutter, M.; Oppermann, H.; Engelmann, G.; Dietrich, L.; Reichl, H. | Conference Paper |
| 2006 | Thin film substrate technology and FC interconnection for very high frequency applications
Töpper, M.; Rosin, T.; Fritzsch, T.; Jordan, R.; Mekonnen, G.; Sakkas, C.; Kunkel, R.; Scherpinski, K.; Schmidt, D.; Oppermann, H.; Dietrich, L.; Beling, A.; Eckhardt, T.; Bach, H.-G.; Reichl, H. | Conference Paper |
| 2005 | Lead Free Solder / UBM Phase Reactions in Electroplated Bumps
Engelmann, G.; Jurenka, C.; Wolf, M.J.; Dietrich, L. | Conference Paper |
| 2005 | Technology Requirements for Chip-On-Chip Packaging Solution
Töpper, M.; Fritzsch, T.; Glaw, V.; Jordan, R.; Lopper, C.; Röder, J.; Dietrich, L.; Lutz, M.; Oppermann, H.; Ehrmann, O.; Reichl, H. | Conference Paper |
| 2005 | Technology requirements for chip-on-chip packaging solutions
Topper, M.; Fritzsch, T.; Glaw, V.; Jordan, R.; Lopper, C.; Roder, J.; Dietrich, L.; Lutz, M. | Conference Paper |
| 2000 | High density pixel detector module using flip chip and thin film technology
Wolf, J.; Gerlach, P.; Beyne, E.; Töpper, M.; Dietrich, L.; Becks, K.H.; Wermes, N.; Ehrmann, O.; Reichl, H. | Conference Paper |
| 1999 | Fabrication of a high-density MCM-D for a pixel detector system using a BCB/Cu technology
Töpper, M.; Dietrich, L.; Engelmann, G.; Fehlberg, S.; Gerlach, P.; Wolf, J.; Ehrmann, O.; Becks, K.-H.; Reichl, H. | Conference Paper |
| 1999 | Fabrication of a high-density MCM-D for a pixel detector system using a BCB/Cu/PbSn technology
Töpper, M.; Gerlach, P.; Dietrich, L.; Fehlberg, S.; Karduck, C.; Meinherz, C.; Wolf, J.; Ehrmann, O.; Becks, K.-H.; Reichl, H. | Journal Article |
| 1999 | Verfahren zum Testen von mit einer Leiterbahnstruktur versehenen Substraten
Zakel, E.; Ansorge, F.; Kasulke, P.; Ostmann, A.; Aschenbrenner, R.; Dietrich, L. | Patent |
| 1998 | Gold and gold-tin wafer bumping by electrochemical deposition for flip chip and TAB
Dietrich, L.; Engelmann, G.; Ehrmann, O.; Reichl, H. | Conference Paper |
| 1997 | The influence of NiSn intermetallics on the performance of flip chip contacts using a low cost electroless nickel bumping approach
Jung, E.; Kasulke, P.; Giebler, R.; Klöser, J.; Dietrich, L.; Ostmann, A.; Zakel, E.; Reichl, H. | Journal Article |
| 1997 | Spin coating in UV depth lithography and 3D microfabrication
Engelmann, G.; Dietrich, L.; Renger, E.; Gentzsch, S.; Reichl, H. | Conference Paper |
| 1996 | The influence of NiSn intermetallics on the performance of flip chip contacts using a low cost electroless nickel bumping approach
Jung, E.; Giebler, R.; Klöser, J.; Dietrich, L.; Zakel, E.; Reichl, H.; Kasulke, P.; Ostmann, A. | Conference Paper |
| 1996 | MCM-D with embedded active and passive components
Töpper, M.; Wolf, J.; Glaw, V.; Buschick, K.; Dabek, A.; Dietrich, L.; Ehrmann, O.; Reichl, H. | Conference Paper |
| 1996 | Mehrlagenverdrahtung für MCM-D und Chip Size Package
Töpper, M.; Buschick, K.; Wolf, J.; Dietrich, L.; Ehrmann, O. | Book Article |
| 1996 | Reliability investigations of different bumping processes for flip chip and TAB applications
Jung, E.; Klöser, J.; Nave, J.; Engelmann, G.; Dietrich, L.; Zakel, E.; Reichl, H. | Conference Paper |