Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2016Plasmaätzen zur Herstellung von Siliziumdurchkontaktierungen mit kontrolliertem Seitenwinkel für die dreidimensionale Integration im Wafer Level Packaging
Wilke, Martin
: Dieckerhoff, S.; Lang, K.-D.; Bock, K.; Tillack, B.
Dissertation
2009Improved Switching Characteristics of Fast Power MOSFETs Applying Solder Bump Technology
Dieckerhoff, S.; Wernicke, T.; Kallmayer, C.; Guttowski, S.; Reichl, H.
Journal Article
2008On-line condition monitoring of power semiconductors
Wernicke, T.; Gegusch, R.; Dieckerhoff, S.; Middendorf, A.; Seliger, G.; Reichl, H.
Conference Paper
2007Electric characteristics of planar interconnect technologies for power MOSFETs
Dieckerhoff, S.; Kirfo, T.; Wernicke, T.; Kallmayer, C.; Ostmann, A.; Jung, E.; Wunderle, B.; Reichl, H.
Conference Paper
2007Experimental characterization methods for power MOSFET assemblies
Wernicke, T.; Dieckerhoff, S.; Kirfe, T.; Feix, G.; Guttowski, S.; Reichl, H.
Conference Paper
2007Measurement techniques for the thermal characterization of power modules
Wernicke, T.; Dieckerhoff, S.; Guttowski, S.; Reichl, H.
Conference Paper
2006Performance comparison of advanced power electronic packages for automotive applications
Dieckerhoff, S.; Guttowski, S.; Reichl, H.
Conference Paper
2005Power Loss-Oriented Evaluation of High Voltage IGBTs and Multilevel Converters in Transformerless Traction Applications
Dieckerhoff, S.; Bernet, S.; Krug, D.
Book Article