Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2011Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO2 interface using molecular modelling
Hölck, O.; Dermitzaki, E.; Wunderle, B.; Bauer, J.; Michel, B.
Journal Article, Conference Paper
2010Influence of moisture on humidity sensitive material parameters of microelectronics relevant polymers
Walter, H.; Dermitzaki, E.; Wunderle, B.; Michel, B.
Conference Paper
2010Influence of moisture on humidity sensitive material parameters of polymers used in microelectronic applications
Walter, H.; Dermitzaki, E.; Wunderle, B.; Michel, B.
Conference Paper
2010Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling
Wunderle, B.; Dermitzaki, E.; Hölck, O.; Bauer, J.; Walter, H.; Shaik, Q.; Rätzke, K.; Faupel, F.; Michel, B.; Reichl, H.
Journal Article, Conference Paper
2010Molecular modeling of a 3D-crosslinked epoxy resin and its interface to native SiO2 - property prediction in microelectronic packaging
Hölck, O.; Dermitzaki, E.; Wunderle, B.; Bauer, J.; Michel, B.; Reichl, H.
Conference Paper
2010Molecular modelling of microelectronic packaging materials - basic thermo-mechanical property estimation of a 3D-crosslinked epoxy / SiO2 interface
Hölck, O.; Dermitzaki, E.; Wunderle, B.; Bauer, J.; Michel, B.
Conference Paper
2009Influence of moisture on the time and temperature dependent properties of polymer systems
Walter, H.; Dermitzaki, E.; Shirangi, H.; Wunderle, B.; Hartmann, S.; Michel, B.
Conference Paper
2009Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling
Wunderle, B.; Dermitzaki, E.; Hölck, O.; Bauer, J.; Walter, H.; Shaik, Q.; Rätzke, K.; Faupel, F.; Michel, B.; Reichl, H.
Conference Paper
2009Molecular dynamics simulation and mechanical characterisation for the establishment of structure-property correlations for epoxy resins in microelectronics packaging applications
Wunderle, B.; Dermitzaki, E.; Holck, O.; Bauer, J.; Walter, H.; Shaik, Q.; Ratzke, K.; Faupel, F.; Michel, B.
Conference Paper
2009Structure Property Correlation of epoxy resins under the influence of moisture; and comparison of Diffusion coefficient with MD-simulations
Dermitzaki, E.; Wunderle, B.; Bauer, J.; Walter, H.; Michel, B.
Conference Paper
2009Study on the effect of moisture and elevated temperature on the fracture properties of visco elastic polymers
Walter, H.; Shirangi, H.; Dermitzaki, E.; Wunderle, B.; Michel, B.
Conference Paper
2008Structure Property Correlation of Epoxy Resins Under the Influence of Moisture and Temperature; and Comparison of Diffusion Coefficient with MD-Simulations
Dermitzaki, E.; Wunderle, B.; Bauer, J.; Walter, H.; Michel, B.
Conference Paper
2007Molecular Dynamics Simulation and Mechanical Characterisation of Epoxy Resins Examined at Different Temperatures
Dermitzaki, E.; Bauer, J.; Walter, H.; Wunderle, B.; Michel, B.; Reichl, H.
Conference Paper
2007Molecular dynamics simulation for the diffusion of water in amorphous polymers examined at different temperatures
Dermitzaki, E.; Bauer, J.; Walter, H.; Wunderle, B.; Michel, B.; Reichl, H.
Conference Paper
2007A test system for ensuring material reliability in micro- and nanoelectronics
Wittler, O.; Auerswald, E.; Dermitzaki, E.; Gollhardt, A.; May, D.; Schmitz, S.; Wunderle, B.; Michel, B.
Conference Paper, Journal Article
2006Diffusion of water in amorphous polymers at different temperatures using molecular dynamics simulation
Dermitzaki, E.; Bauer, J.; Wunderle, B.; Michel, B.
Conference Paper
2004Fracture mechanical characterization of micro- and nano-filled polymers by a combined experimental and simulative procedure
Wunderle, B.; Dermitzaki, E.; Keller, J.; Vogel, D.; Michel, B.
Conference Paper