Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018"3rd Level" Solder Joint Reliability Investigations for Transfer of Consumer Electronics in Automotive Use
Dudek, R.; Hildebrandt, M.; Kreyßig, K.; Rzepka, S.; Döring, R.; Seiler, B.; Fries, T.; Zhang, M.; Ortmann, R.W.
Conference Paper
2018Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue
Dudek, R.; Hildebrandt, M.; Rzepka, S.; Fries, T.; Döring, R.; Seiler, B.; Ortmann, R.W.
Journal Article
2018Evaluation of Ag-sinter and CuSn-TLP based joining technologies on lead frame
Otto, A.; Schroeder, T.; Dudek, R.; Wang, W.-S.; Baum, M.; Wiemer, M.; Doering, R.; Kurian, J.J.; Murayama, K.; Oi, K.; Koyama, T.; Rzepka, S.
Conference Paper
2018Stress analyses in HPC-soldered assemblies by optical measurement and FEA
Dudek, R.; Döring, R.; Rzepka, S.; Herberholz, T.; Feil, D.; Seiler, B.; Scheiter, L.; Schellenberg, C.; Fritzsche, S.
Conference Paper
2017Board level reliability assessment of consumer components for automotive use by simulation and sophisticated optical deformation analyses
Dudek, R.; Hildebrand, M.; Rzepka, S.; Beintner, J.; Döring, R.; Scheiter, L.; Seiler, B.; Fries, T.; Ortmann, R.W.
Conference Paper
2017FE analyses and power cycling tests on the thermo-mechanical performance of silver sintered power semiconductors with different interconnection technologies
Dudek, R.; Doering, R.; Otto, A.; Rzepka, S.; Stegmeier, S.; Kiefl, S.; Lunding, A.; Eisele, R.
Conference Paper
2017Thermo-mechanical and mechanical robustness of the INCOBAT smart battery management system
Otto, A.; Rzepka, S.; Döring, R.; Scheiter, L.; Armengaud, E.
Conference Paper
2016Analyses of thermo-mechanical reliability issues for power modules designed in planar technology
Dudek, R.; Döring, R.; Hildebrandt, M.; Rzepka, S.; Stegmeier, S.; Kiefl, S.; Sommer, V.; Mitic, G.; Weidner, K.
Conference Paper
2016Electro-thermal-mechanical analyses on stress in silver sintered power modules with different copper interconnection technologies
Dudek, R.; Döring, R.; Hildebrandt, M.; Rzepka, S.; Stegmeier, S.; Kiefl, S.
Conference Paper
2016Embedding electrochemical impedance spectroscopy in smart battery management systems using multicore technology
Armengaud, E.; Macher, G.; Groppo, R.; Novaro, M.; Otto, A.; Döring, R.; Schmidt, H.; Kras, B.; Stankiewicz, S.
Conference Paper
2016HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature
Vogt, Holger; Altmann, Frank; Braun, Sebastian; Celik, Yusuf; Dietrich, Lothar; Dietz, Dorothee; Dijk, Marius van; Dreiner, Stefan; Döring, Ralf; Gabler, Felix; Goehlich, Andreas; Hutter, Matthias; Ihle, Martin; Kappert, Holger; Kordas, Norbert; Kokozinski, Rainer; Naumann, Falk; Nowak, Torsten; Oppermann, Hermann; Partsch, Uwe; Petzold, Matthias; Roscher, Frank; Rzepka, Sven; Schubert, Ralph; Weber, Constanze; Wiemer, Maik; Wittler, Olaf; Ziesche, Steffen
Conference Paper
2016Materials and technologies to enable high temperature stable MEMS and electronics for smart systems used in harsh environments
Gabler, Felix; Roscher, Frank; Döring, Ralf; Otto, Alexander; Ziesche, Steffen; Ihle, Martin; Celik, Yusuf; Dietz, Dorothee; Goehlich, Andreas; Kappert, Holger; Vogt, Holger; Naumann, Falk; Geßner, Thomas
Conference Paper
2015Charakterisierung der Verbindungseigenschaften
Dudek, R.; Döring, R.; Kreysig, K.; Seiler, B.; Nowottnick, M.; Ehrhard, C.
Book Article
2015Electro-thermo-mechanical analyses on silver sintered IGBT-module reliability in power cycling
Dudek, R.; Döring, R.; Rzepka, S.; Ehrhardt, C.; Günther, M.; Haag, M.
Conference Paper
2015Finite-Elemente-Analysen zur thermomechanischen Beanspruchung von Diffusionslöt- und Sinterverbindungen
Dudek, R.; Döring, R.; Rzepka, S.; Seiler, B.; Kreyßig, K.
Conference Paper
2015Investigations on power cycling induced fatigue failure of IGBTs with silver sintered interconnects
Dudek, R.; Döring, R.; Rzepka, S.; Ehrhardt, C.; Hutter, M.; Rudzki, J.; Osterwald, F.; Eisele, R.; Stegmeier, S.; Weidner, K.; Rittner, M.
Conference Paper
2014Combined experimental- and FE-studies on sinter-Ag behaviour and effects on IGBT-module reliability
Dudek, R.; Döring, R.; Sommer, P.; Seiler, B.; Kreyssig, K.; Walter, H.; Becker, M.; Günther, M.
Conference Paper
2014Solder fatigue acceleration prediction and testing results for different thermal test- and field cycling environments
Dudek, R.; Hildebrandt, M.; Doering, R.; Rzepka, S.; Trageser, H.; Kohl, R.; Wang, C.
Conference Paper
2014Thermo-mechanical behavior and reliability issues for high temperature interconnections
Dudek, R.; Sommer, P.; Döring, R.; Herberholz, T.; Fix, A.; Seiler, B.; Rzepka, S.
Conference Paper
2013Effect of moisture swelling on MEMS packaging and integrated sensors
Keller, J.; Mrossko, R.; Dobrinski, H.; Stürmann, J.; Döring, R.; Dudek, R.; Rzepka, S.; Michel, B.
Journal Article, Conference Paper
2013FEM-basierte Zuverlässigkeitsprognostik für die Verbindungstechnik in der Leistungselektronik
Dudek, R.; Doering, R.; Seiler, B.
Book Article
2013Modellierungsansatz zur thermo-mechanischen Analyse von gesinterten Halbleiterbauelementen in der Leistungselektronik
Dudek, R.; Guenther, M.; Sommer, J.-P.; Doering, R.; Kreyssig, K.
Journal Article
2013A new packaging approach for reliable high temperature MEMS devices based on multilayer ceramic interposers
Roschner, F.; Otto, A.; Döring, R.; Ihle, M.; Ziesche, S.; Rzepka, S.; Wiemer, M.
Conference Paper
2013Reliability simulation on solder joints for high temperature application
Dudek, R.; Doering, R.
Conference Paper
2012Delamination modeling for power packages by the cohesive zone approach
Dudek, R.; Doering, R.; Pufall, R.; Kanert, W.; Seiler, B.; Rzepka, S.; Michel, B.
Conference Paper
2010Theoretical analysis on the shear test
Dudek, R.; Doering, R.; Kreyssig, K.; Michel, B.
Conference Paper
2009Simulation based analysis of secondary effects on solder fatigue
Dudek, R.; Doering, R.; Bombach, C.; Michel, B.
Conference Paper, Journal Article
2009Simulation Based Analysis of Secondary Effects on Solder Fatigue
Dudek, R.; Doering, R.; Bombach, C.; Michel, B.
Conference Paper
2007In-situ Microscopic Studies on Microstructural Degradation and FE Analyses for Miniaturized SAC Solder Joints under Thermal Test- and Field Cycling
Dudek, R.; Faust, W.; Döring, R.; Michel, B.
Conference Paper
2006Advanced packages with buried dies
Sommer, J.-P.; Döring, R.; Dost, M.; Michel, B.
Conference Paper
2006Fatigue Life Prediction and Analysis of Wafer Level Packages with SnAgCu Solder Balls
Dudek, R.; Rzepka, S.; Dobritz, S.; Döring, R.; Kreißig, K.; Wiese, S.; Michel, B.
Conference Paper
2006Thermo-mechanical Design of Resilient Contact Systems for Wafer Level Packaging
Dudek, R.; Walter, H.; Döring, R.; Michel, B.; Meyer, T.; Zapf, J.; Hedler, H.
Conference Paper
2006Zuverlässigkeitsprognostik von in der Leiterplatte integrierten Chips
Sommer, J.-P.; Döring, R.; Dost, M.; Michel, B.
Conference Paper
2005Design support for a real pressure sensor by means of finite element analysis
Sommer, J.-P.; Döring, R.; Hussack, J.; Glien, K.; Graf, J.; Müller-Fiedler, R.
Abstract
2005Reliability Analyses of Pb- and SnAgCu Solder Interconnects at Ceramic Quartz Components Subjected to Several test and Field Conditions
Dudek, R.; Döring, R.; Michel, B.; Picault, A.; Autissier, J.-F.
Conference Paper
2005Thermal and mechanical reliability analysis of an anisotropic magneto-resistive current measurement sensor
Vogel, J.; Kaulfersch, E.; Schmitt, J.; Doering, R.; Hoelzl, J.; Michel, B.
Conference Paper
2005Thermo-mechanical design for reliability of WLPs with compliant interconnects
Dudek, R.; Walter, H.; Doering, R.; Michel, B.; Meyer, T.; Zapf, J.; Hedler, H.
Conference Paper
2005Thermo-mechanical Reliability Analysis of Magneto-resistive Current Sensors
Vogel, J.; Kaulfersch, E.; Schmitt, J.; Auersperg, J.; Döring, R.; Jost, F.; Kreyßig, K.; Walter, H.; Hölzl, J.
Conference Paper
2005Thermo-mechanical reliability analysis on solder joints of ceramic components
Dudek, R.; Döring, R.; Michel, B.; Picault, A.; Autissier, J.-F.
Conference Paper
2004FE-analysis of leaded and lead-free solder joints under thermal fatigue loading
Dudek, R.; Walter, H.; Döring, R.; Michel, B.
Book Article
2004Investigations on the reliability of lead-free CSP subjected to harsh environments
Dudek, R.; Döring, R.; Michel, B.
Conference Paper
2004Thermal fatigue modelling for SnAgCu and SnPb solder joints
Dudek, R.; Walter, H.; Döring, R.; Michel, B.
Conference Paper
2003Reliability prediction of area array solder joints
Dudek, R.; Döring, R.; Michel, B.
Journal Article
2002Thermo-mechanical reliability of lead-free solder interconnects
Schubert, A.; Dudek, R.; Döring, R.; Walter, H.; Auerswald, E.; Gollhardt, A.; Michel, B.
Conference Paper
2001Gains and challenges of parameterized finite element modeling of microelectronics packages
Auersperg, J.; Döring, R.; Michel, B.
Journal Article, Conference Paper
2001Reliability prediction of area array solder joints
Dudek, R.; Döring, R.; Michel, B.
Conference Paper
2001A Short Crack Growth Model for the Prediction of Fatigue Lives under Multiaxial Nonproportional Loading
Döring, R.; Hoffmeyer, J.; Seeger, T.; Vormwald, M.
Conference Paper
2000Mechanical design support by means of FEA for advanced millimeter wave communication devices
Sommer, J.-P.; Michel, B.; Döring, R.; Hager, W.; Rehme, F.
Conference Paper
2000Modular loading and measuring system for material characterization of microcomponents
Vogel, J.; Dost, M.; Seebacher, S.; Osten, W.; Fassler, R.; Köpp, N.; Döring, R.; Sommer, J.-P.; Michel, B.
Conference Paper
2000Parameterization in finite element modeling of microelectronics packages
Auersperg, J.; Döring, R.; Dudek, R.; Michel, B.
Book Article
2000Reliability investigations of vibration excited circuit boards
Rümmler, N.; Schnitzer, R.; Döring, R.; Kaulfersch, E.; Faust, W.; Michel, B.
Conference Paper
2000Stress-induced laterial deflections of microstructures
Küchler, M.; Knöfler, R.; Steiniger, c.; Raschke, T.; Gessner, T.; Dudek, R.; Döring, R.
Conference Paper
1998Nonlinear FEA for thermo-mechanical reliability. Estimation of advanced electronic packages
Auersperg, J.; Döring, R.; Dudek, R.; Michel, B.
Conference Paper
1998Reliability investigations of flip chip interconnects in FCOB and FCOG applications by FEA
Schubert, A.; Dudek, R.; Döring, R.; Michel, B.
Conference Paper
1997Characterization of packages for laser diodes
Auerswald, E.; Döring, R.; Nechansky, H.; Kämpfe, B.; Michel, B.
Conference Paper
1997Problem-adapted 3D finite element modelling for VLSI components
Döring, R.; Sommer, J.-P.; Dudek, R.; Michel, B.
Conference Paper
1995Lötstellenbewertung an SMD-Aufbauten
Dudek, R.; Sommer, J.-P.; Faust, W.; Döring, R.
Conference Paper