Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018High Endurance Ferroelectric Hafnium Oxide-Based FeFET Memory Without Retention Penalty
Ali, T.; Polakowski, P.; Riedel, S.; Büttner, T.; Kämpfe, T.; Rudolph, M.; Pätzold, B.; Seidel, K.; Löhr, D.; Hoffmann, R.; Czernohorsky, M.; Kühnel, K.; Steinke, P.; Calvo, J.; Zimmermann, K.; Müller, J.
Journal Article
2018LPCVD in-situ doped silicon for thermoelectric applications
Calvo, Jesús; Drescher, Maximilian; Kühnel, Kati; Sauer, Bodo; Müller, Michael; Schmidt, Christian; Boui, Fatima; Völklein, Friedemann; Wagner-Reetz, Maik
Journal Article, Conference Paper
2018Silicon doped hafnium oxide (HSO) and hafnium zirconium oxide (HZO) based FeFET
Ali, T.; Polakowski, P.; Riedel, S.; Büttner, T.; Kämpfe, T.; Rudolph, M.; Pätzold, B.; Seidel, K.; Löhr, D.; Hoffmann, R.; Czernohorsky, M.; Kühnel, K.; Thrun, X.; Hanisch, N.; Steinke, P.; Calvo, J.; Müller, J.
Journal Article
2017Development of CMOS-compatible materials for thermoelectric and sensor applications in semiconductor industry
Wagner-Reetz, M.; Calvo, J.; Nichenametla, C.K.; Kühnel, K.; Göhler, T.; Schulz, S.; Burkov, A.; Uhlig, B.
Presentation
2016LPCVD in-situ doped silicon for thermoelectric applications
Calvo, J.; Müller, M.; Sauer, B.; Drescher, M.; Schmidt, C.; Völklein, F.; Wagner-Reetz, M.
Presentation
2015Advanced Wet-Etch-Only Process for Complete Tri-Layer Rework
Steinke, Philipp; Calvo, Jesús; Uhlig, Benjamin
Journal Article, Conference Paper
2015Alternative ULK integration approach using a sacrificial layer in a standard dual damascene flow
Uhlig, B.; Calvo, J.; Koch, J.; Thrun, X.; Liske, R.
Conference Paper
2015Organosilane Downstream Plasma On Ultra Low-k Dielectrics: Comparing Repair With Post Etch Treatment
Calvo, J.; Steinke, P.; Wislicenus, M.; Gerlich, L.; Seidel, R.; Clauss, E.; Uhlig, B.
Conference Paper
2015Porous Ultra Low-k Material Integration Through An Extended Dual Damascene Approach: Pre-/ Post-CMP Curing Comparison
Calvo, J.; Koch, J.; Thrun, X.; Seidel, R.; Clauss, E.; Uhlig, B.
Conference Paper