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| 2012 | Advanced thin glass based photonic PCB integration
Schröder, Henning; Brusberg, L.; Arndt-Staufenbiel, Norbert; Richlowski, Karim; Ranzinger, Christian; Lang, Klaus-Dieter | Conference Paper |
| 2012 | Advances in CO2-laser drilling of glass substrates
Brusberg, L.; Queisser, M.; Gentsch, C.; Schröder, H.; Lang, K.D. | Conference Paper, Journal Article |
| 2012 | Entwicklung einer einmodigen Wellenleitertechnologie in Dünnglas für die photonische Systemintegration
Brusberg, L. | Dissertation |
| 2012 | Single-mode glass waveguide platform for DWDM chip-to-chip interconnects
Brusberg, Lars; Schröder, Henning; Queiser, Marco; Lang, Klaus-Dieter | Conference Paper |
| 2012 | Single-mode glass waveguide technology for optical interchip communication on board level
Brusberg, L.; Neitz, M.; Schröder, H. | Conference Paper |
| 2011 | Chip-to-chip communication by optical routing inside a thin glass substrate
Brusberg, L.; Schlepple, N.; Schröder, H. | Conference Paper |
| 2011 | Evaluation of graded index glass waveguides for board-level WDM optical chip-to-chip communications
Schrage, J.; Stuebbe, O.; Brusberg, L.; Soenmez, Y.; Schroeder, H.; Schuhmann, R. | Conference Paper |
| 2011 | Glass panel processing for electrical and optical packaging
Schröder, H.; Brusberg, L.; Arndt-Staufenbiel, N.; Hofmann, J.; Marx, S. | Conference Paper |
| 2011 | Thin glass based packaging and photonic single-mode waveguide integration by ion-exchange technology on board and module level
Brusberg, L.; Lang, G.; Schröder, H. | Conference Paper |
| 2010 | 3-D thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer
Töpper, M.; Ndip, I.; Erxleben, R.; Brusberg, L.; Nissen, N.; Schröder, H.; Yamamoto, H.; Todt, G.; Reichl, H. | Conference Paper |
| 2010 | Glass carrier based packaging approach demonstrated on a parallel optoelectronic transceiver module for PCB assembling
Brusberg, L.; Schröder, H.; Erxleben, R.; Ndip, I.; Töpper, M.; Nissen, N.F.; Reichl, H. | Conference Paper |
| 2010 | GlassPack - A 3D glass based interposer concept for sip with integrated optical interconnects
Schröder, H.; Brusberg, L.; Erxleben, R.; Ndip, I.; Töpper, M.; Nissen, N.F.; Reichl, H. | Conference Paper |
| 2010 | New options for chip-to-chip photonic packaging by using thin glass based waveguide substrates on board and module level
Schröder, H.; Brusberg, L.; Arndt-Staufenbiel, N. | Conference Paper |
| 2010 | Power efficient data communication modules for optical networks
Schröder, H.; Brusberg, L.; Stobbe, L.; Tekin, T. | Conference Paper |
| 2009 | Mikrooptisches Koppelelement mit integrierten optischen Wellenleitern
Tekin, T.; Schroeder, H.; Arndt-Staufenbiehl, N.; Brusberg, L. | Patent |
| 2009 | Out-of-plane coupling using thin glass based arrayed waveguide components
Schröder, H.; Arndt-Staufenbiel, N.; Brusberg, L.; Tekin, T. | Conference Paper |
| 2009 | Photonic system-in-package technologies using thin glass substrates
Brusberg, L.; Schröder, H.; Topper, M.; Reichl, H. | Conference Paper |
| 2009 | Thin glass based packaging technologies for optoelectronic modules
Brusberg, L.; Schröder, H.; Töpper, M.; Arndt-Staufenbiel, N.; Röder, J.; Lutz, M.; Reichl, H. | Conference Paper |
| 2008 | "glassPack" - Photonic packaging using thin glass foils for electrical-optical circuit boards (EOCB) and sensor modules
Schroder, H.; Amdt-Staufenbiel, N.; Brusberg, L. | Conference Paper |
| 2008 | "glassPack": A novel photonic packaging and integration technology using thin glass foils
Brusberg, L.; Schröder, H.; Arndt-Staufenbiel, N.; Wiemer, M. | Conference Paper |
| 2008 | Optical coupling using thin glass based arrayed waveguide components
Schröder, H.; Arndt-Staufenbiehl, N.; Brusberg, L.; Tekin, T. | Conference Paper |