Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Dual-Side Heat Removal by Silicon Cold Plate and Interposer With Embedded Fluid Channels
Brunschwiler, T.; Steller, W.; Oppermann, H.; Kleff, J.; Robertson, S.; Mroßko, R.; Keller, J.; Schlottig, G.
Conference Paper
2018Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration
Brunschwiler, T.; Schlottig, G.; Sridhar, A.; Bezerra, P.; Ruch, P.; Ebejer, N.; Oppermann, H.; Kleff, J.; Steller, W.; Jatlaoui, M.; Voiron, F.; Pavlovic, Z.; McCloskey, P.; Bremner, D.; Parida, P.; Krismer, F.; Kolar, J.; Michel, B.
Conference Paper
2016Intra-stack sealing of tier interconnects using the interconnect alloy
Kleff, J.; Schlottig, G.; Mrossko, R.; Steller, W.; Oppermann, H.; Keller, J.; Brunschwiler, T.
Conference Paper
2016Master curve synthesis by effective viscoelastic plastic material modeling
Schindler-Saefkow, F.; Pantou, R.; Schlottig, G.; Kumar, S.; Brunschwiler, T.; Keller, J.; Wunderle, B.; Rzepka, S.
Conference Paper
2016Re-building the underfill: Performance of percolating fillers at package scale
Zschenderlein, U.; Baum, M.; Schlottig, G.; Schindler-Saefkow, F.; Kumar, S.G.; Wang, W.-S.; Brunschwiler, T.; Wunderle, B.
Conference Paper
2016Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K
Brunschwiler, T.; Zürcher, J.; Zimmermann, S.; Burg, B.R.; Schlottig, G.; Chen, X.; Sinha, T.; Baum, M.; Hofmann, C.; Pantou, R.; Achen, A.; Zschenderlein, U.; Kumar, S.; Wunderle, B.; Haupt, M.; Schindler-Saefkow, F.; Strässle, R.
Conference Paper
2016Stress investigations in 3D-integrated silicon microstructures
Stiebing, M.; Lörtscher, E.; Steller, W.; Vogel, D.; Wolf, M.J.; Brunschwiler, T.; Wunderle, B.
Conference Paper
2015Advances in percolated thermal underfill (PTU) simulations for 3D-integration
Kumar, S.G.; Zschenderlein, U.; Pantou, R.; Brunschwiler, T.; Schlottig, G.; Schindler-Saefkow, F.; Wunderle, B.
Conference Paper
2015Nanoparticle assembly and sintering towards all-copper flip chip interconnects
Zürcher, J.; Yu, K.; Schlottig, G.; Baum, M.; Taklo, M.M.V.; Wunderle, B.; Warszyński, P.; Brunschwiler, T.
Conference Paper
2015Self-assembly of micro- and nano-particles by centrifugal forces and capillary bridging for 3D thermal interconnects
Hofmann, C.; Baum, M.; Bodny, F.; Wiemer, M.; Gessner, T.; Brunschwiler, T.; Zürcher, J.; Burg, B.R.; Zimmermann, S.
Conference Paper
2014Characterization of particle beds in percolating thermal underfills based on centrifugation
Zimmermann, S.; Brunschwiler, T.; Zuercher, J.; Burg, B.; Hong, G.; Poulikakos, D.; Baum, M.; Hofmann, C.
Conference Paper
2012Extended tensor description to design non-uniform heat-removal in interlayer cooled chip stacks
Brunschwiler, T.; Paredes, S.; Drechsler, U.; Michel, B.; Wunderle, B.; Reichl, H.
Conference Paper
2011Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacks
Brunschwiler, T.; Paredes, S.; Drechsler, U.; Michel, B.; Wunderle, B.; Reichl, H.
Conference Paper
2010Heat-removal performance scaling of interlayer cooled chip stacks
Brunschwiler, T.; Paredes, S.; Drechsler, U.; Michel, B.; Cesar, W.; Leblebici, Y.; Wunderle, B.; Reichl, H.
Conference Paper
2009Hotspot-optimized interlayer cooling in vertically integrated packages
Brunschwiler, T.; Michel, B.; Rothuizen, H.; Kloter, U.; Wunderle, B.; Reichl, H.
Conference Paper
2009Interlayer cooling potential in vertically integrated packages
Brunschwiler, T.; Michel, B.; Rothuizen, H.; Kloter, U.; Wunderle, B.; Oppermann, H.; Reichl, H.
Journal Article, Conference Paper
2008Forced Convection Interlay Cooling in Vertically Integrated Packages
Brunschwiler, T.; Michel, B.; Rothuizen, H.; Kloter, U.; Wunderle, B.; Oppermann, H.; Reichl, H.
Conference Paper