| | |
|---|
| 2020 | 3DIC: Past, Present and Future - a European Perspective
Ramm, Peter; Klumpp, Armin; Landesberger, Christof; Weber, Josef; Braun, Tanja; Vivet, Pascal; Engelhard, Manfred | Presentation, Non Book Material |
| 2020 | Fan-out wafer level packaging of GaN components for RF applications
Braun, Tanja; Nguyen, Thanh Duy; Voges, Steves; Wöhrmann, Markus; Gernhardt, Robert; Becker, Karl-Friedrich; Ndip, Ivan; Freimund, Damian; Schneider-Ramelow, Martin; Lang, Klaus-Dieter; Schwantuschke, Dirk; Ture, Erdin; Pretl, Michael; Engels, Sven | Conference Paper |
| 2020 | Scalable hybrid microelectronic-microfluidic integration of highly sensitive biosensors
Reinecke, Patrick; Putze, Marie-Theres; Georgi, Leopold; Kahle, Ruben; Kaiser, David; Hüger, Daniel; Livshits, Pavel; Weidenmüller, Jens; Weimann, Thomas; Turchanin, Andrey; Braun, Tanja; Becker, Karl-Friedrich; Schneider-Ramelow, Martin; Lang, Klaus-Dieter | Journal Article |
| 2019 | Plattformkonzept zum Aufbau von hochintegrierten Multisensorknoten
Becker, Karl-Friedrich; Böttcher, Mathias; Schiffer, Michael; Pötter, Harald; Brockmann, Carsten; Freimund, Damian; Tschoban, Christian; Windrich, Frank; Braun, Tanja; Hopsch, Fabian; Heinig, Andy; Voigt, Sven; Baum, Mario; Hofmann, Lutz; Lang, Klaus-Dieter | Conference Paper |
| 2018 | The Evolution of Panel Level Packaging
Aschenbrenner, Rolf; Töpper, M.; Braun, Tanja; Ostmann, A. | Conference Paper |
| 2018 | Fan-out wafer level packaging for 5G and mm-Wave applications
Braun, Tanja; Becker, K.-F.; Hoelck, O.; Kahle, R.; Woehrmann, M.; Toepper, M.; Ndip, I.; Maass, U.; Tschoban, C.; Aschenbrenner, R.; Voges, S.; Lang, K.-D. | Conference Paper |
| 2018 | First responders occupancy, activity and vital signs monitoring - SAFESENS
O’Flynn, Brendan; Walsh, Michael; Brahmi, I.H.; Oudenhoven, Jos; Nackaerts, Axel; Pereira, Eduardo M.; Agrawal, Piyush; Fuchs, Tino; Braun, Tanja; Lang, Klaus-Dieter; Dils, Christian | Journal Article |
| 2018 | Scalable hybrid microelectronic-microfluidic integration of highly sensitive biosensors
Reinecke, Patrick; Putze, Marie-Theres; Georgi, Leopold; Kahle, Ruben; Kaiser, David; Hüger, Daniel; Livshits, Pavel; Weidenmüller, Jens; Weimann, Thomas; Turchanin, Andrey; Braun, Tanja; Becker, Karl-Friedrich; Schneider-Ramelow, Martin; Lang, Klaus-Dieter | Journal Article, Conference Paper |
| 2018 | Wafer Level Package mit integrierten Antennen und Mittel zum Schirmen
Braun, Tanja; Ndip, Ivan | Patent |
| 2018 | Wafer Level Package mit zumindest einem integrierten Antennenelement
Braun, Tanja; Ndip, Ivan | Patent |
| 2018 | Wafer Level Packages mit integrierter oder eingebetteter Antenne
Braun, Tanja; Ndip, Ivan | Patent |
| 2017 | SAFESENS - Smart Sensors for Fire Safety
O’Flynn, Brendan; Walsh, Michael; Pereira, Eduardo M.; Agrawal, Piyush; Fuchs, Tino; Oudenhoven, Jos; Nackaerts, Axel; Braun, Tanja; Lang, Klaus-Dieter; Dils, Christian | Conference Paper |
| 2017 | Zuverlässigkeitsauslegung eines piezoelektrischen Energy Harvesters
Wittler, Olaf; Hölck, Ole; Benecke, Stephan; Dobs, Tom; Dijk, Marius van; Keller, Jürgen; Schulz, Marcus; Bader, Volker; Braun, Tanja; Lang, Klaus-Dieter | Conference Paper |
| 2016 | BCB-based dry film low k permanent polymer with sub 4 µm vias for advanced WLP and FO-WLP applications
Toepper, Michael; Braun, Tanja; Gernhardt, Robert; Wilke, Martin; Mackowiak, Piotr; Lang, Klaus-Dieter; O'Connor, Corey; Barr, Robert; Aoude, Tina; Calvert, Jeffrey; Gallagher, Michael; Kim, Jong-Uk; Politis, Andrew; Iagodkine, Ellisei | Conference Paper |
| 2015 | Development of solder paste jetting processes for advanced packaging
Thomas, Tina; Voges, Steve; Fliess, M.; Becker, Karl-Friedrich; Reiners, Philipp; Koch, Mathias; Bauer, Jörg; Braun, Tanja; Lang, Klaus-Dieter | Conference Paper |
| 2015 | Evaluation of the dielectric cure monitoring of epoxy molding compound in transfer molding process for electronic packages
Kaya, Burcu; Kaiser, Jan-Martin; Becker, Karl-Friedrich; Braun, Tanja; Lang, Klaus-Dieter | Conference Paper |
| 2015 | From fan-out wafer to fan-out panel level packaging
Braun, Tanja; Becker, Karl-Friedrich; Raatz, Stefan; Bader, Volker; Bauer, Jochen; Aschenbrenner, Rolf; Voges, Steve; Thomas, Tina; Kahle, Ruben; Lang, Klaus-Dieter | Conference Paper |
| 2015 | Influence of humidity on reliability of plastic packages
Braun, Tanja; Bauer, Jörg; Becker, Karl-Friedrich; Hölck, Ole; Walter, Hans; Dijk, M. van; Aschenbrenner, Rolf; Lang, Klaus-Dieter | Conference Paper |
| 2015 | Large area compression molding for Fan-out Panel Level Packing
Braun, Tanja; Raatz, Stefan; Voges, Steve; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Becker, Karl-Friedrich; Thomas, Tina; Aschenbrenner, Rolf; Lang, Klaus-Dieter | Conference Paper |
| 2015 | Material and process trends for moving from FOWLP to FOPLP
Braun, Tanja; Voges, S.; Töpper, Michael; Wilke, Martin; Wöhrmann, M.; Maaß, Uwe; Huhn, Max; Becker, Karl-Friedrich; Raatz, Stefan; Kim, J.-U.; Aschenbrenner, Rolf; Lang, Klaus-Dieter; O'Connor, C.; Barr, R.; Calvert, J.; Gallagher, M.; Iagodkine, E.; Aoude, T.; Politis, A. | Conference Paper |
| 2015 | A novel and practical method for in-situ monitoring of interface delamination by local thermal diffusivity measurement
Wunderle, Bernhard; Schulz, M.; Braun, Tanja; May, D.; Bauer, Jörg; Hölck, Ole; Walter, Hans; Keller, J. | Conference Paper |
| 2014 | 24"×18" fan-out panel level packing
Braun, Tanja; Becker, Karl-Friedrich; Voges, Steve; Bauer, Jörg; Kahle, Ruben; Bader, V.; Thomas, Tina; Aschenbrenner, Rolf; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Assessment of high temperature reliability of molded smart power modules
Thomas, Tina; Becker, Karl-Friedrich; Braun, Tanja; Dijk, Marius van; Wittler, Olaf; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Challenges and opportunities for Fan-out Panel Level Packaging (FOPLP)
Braun, Tanja; Becker, Karl-Friedrich; Voges, Steve; Thomas, Tina; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Fan-out wafer level packaging for MEMS and sensor applications
Braun, Tanja; Becker, Karl-Friedrich; Jung, Erik; Voges, Steve; Thomas, Tina; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Grenzflächendiffusions- und Adhäsionsverhalten von Epoxidharzen für mikroelektronische Sensorapplikationen
Walter, Hans; Bauer, Jörg; Braun, Tanja; Hölck, Ole; Wunderle, Bernhard; Schulz, Markus; Keller, Jürgen; Wittler, Olaf; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Reliability assessment of molded smart power modules
Thomas, Tina; Lang, Klaus-Dieter; Becker, Karl-Friedrich; Dijk, Marius van; Wittler, Olaf; Braun, Tanja; Bauer, Jörg | Conference Paper |
| 2013 | Feuchtediffusion in partikelgefüllten Epoxidharzen für die Mikroelektronik
Braun, Tanja | Dissertation |
| 2013 | From wafer level to panel level mold embedding
Braun, Tanja; Becker, K.-F.; Voges, S.; Thomas, T.; Kahle, R.; Bauer, J.; Aschenbrenner, R.; Lang, K.-D. | Conference Paper |
| 2013 | Mechanically relevant chemical shrinkage of epoxy molding compounds
Sousa, Micaela F.; Hölck, Ole; Braun, Tanja; Bauer, Jörg; Walter, Hans; Wittler, Olaf; Lang, Klaus-Dieter | Conference Paper |
| 2013 | Moisture induced swelling in epoxy moulding compounds
Walter, Hans; Hölck, Ole; Dobrinski, Heiko; Stuermann, J.; Braun, Tanja; Bauer, Jörg; Wittler, Olaf; Lang, Klaus-Dieter | Conference Paper |
| 2013 | Panel level packaging - a manufacturing solution for cost-effective systems
Aschenbrenner, Rolf; Becker, Karl-Friedrich; Braun, Tanja; Ostmann, Andreas | Conference Paper |
| 2013 | Transfer molding compounds for power electronic applications - a qualification methodology for HT capable materials
Braun, Tanja; Becker, K.-F.; Koch, M.; Thomas, T.; Amende, T.; Schreier-Alt, T.; Bader, V.; Bauer, J.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D. | Conference Paper |
| 2013 | Transport of moisture at epoxy-SiO2 interfaces investigated by molecular modeling
Hölck, Ole; Bauer, Jörg; Braun, Tanja; Walter, Hans; Wittler, Olaf; Wunderle, Bernhard; Lang, Klaus-Dieter | Journal Article |
| 2012 | Charakterisierung des feuchteinduzierten Schwellverhaltens von mikroelektronisch relevanten Werkstoffsystemen
Walter, Hans; Bauer, Jörg; Braun, Tanja; Hölck, Ole; Wunderle, Bernhard; Keller, Jürgen; Wittler, Olaf; Lang, Klaus-Dieter | Conference Paper |
| 2012 | Combination of channel- and droplet-based microfluidics for complex PoC devices
Jung, Erik; Georgi, Leopold; Bauer, Jörg; Braun, Tanja; Schuldt, Victoria; Metwally, Khaled; Robert, Laurent; Khan-Malek, Chantal | Conference Paper |
| 2012 | Enhancement of barrier properties of encapsulants for harsh environment applications
Braun, Tanja; Bauer, Jörg; Georgi, Leopold; Becker, Karl Friedrich; Koch, Mathias; Aschenbrenner, Rolf; Lang, Klaus-Dieter | Conference Paper |
| 2012 | Enhancement of Humidity Barrier Properties of Polymers with Micro- and Nano-sized Filler Particles
Braun, Tanja; Bauer, Jörg; Georgi, Leopold; Becker, Karl-Friedrich; Koch, Mathias; Aschenbrenner, Rolf; Lang, Klaus-Dieter | Conference Paper |
| 2012 | In-situ - Characterization of moisture induced swelling behaviour of microelectronic relevant polymers
Walter, Hans; Bauer, Jörg; Braun, Tanja; Hölck, Ole; Wunderle, B.; Wittler, O. | Conference Paper |
| 2012 | Substrateless sensor packaging using wafer level fan-out technology
Briindel, Matthias; Scholz, U.; Haag, F.; Graf, E.; Braun, Tanja; Becker, Karl-Friedrich | Conference Paper |
| 2012 | Through mold via technology for multi-sensor stacking
Braun, Tanja; Brundel, Mathias; Becker, Karl-Friedrich; Kahle, Ruben; Piefke, Kathrin; Scholz, U.; Haag, F.; Bader, Volker; Voges, Steve; Thomas, Tina; Aschenbrenner, Rolf; Lang, Klaus-Dieter | Conference Paper |
| 2012 | Transport of moisture at epoxy-SiO2 interfaces investigated by molecular modeling
Hölck, Ole; Bauer, Jörg; Braun, Tanja; Walter, Hans; Wittler, Olaf; Wunderle, Bernhard | Conference Paper |
| 2011 | 3D stacking approaches for mold embedded packages
Braun, Tanja; Becker, Karl-F.; Voges, Steve; Thomas, Tina; Töpper, Michael; Fischer, Thorsten; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Lang, Klaus-Dieter | Conference Paper |
| 2011 | Combination of channel- and droplet- based microfluidics for complex PoC-Devices
Georgi, Leopold; Jung, Erik; Bauer, Jörg; Braun, Tanja; Schuldt, Victoria; Metwally, Khaled; Robert, Laurent; Khan-Malek, Chantal | Conference Paper |
| 2011 | Potential of large area mold embedded packages with pcb based redistribution
Braun, Tanja; Becker, Karl-Friedrich; Böttcher, Lars; Ostmann, Andreas; Jung, Erik; Voges, Steve; Thomas, Tina; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Schneider-Ramelow, Martin; Lang, Klaus-Dieter | Conference Paper |