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| 2013 | Feuchtediffusion in partikelgefüllten Epoxidharzen für die Mikroelektronik
Braun, Tanja | Dissertation |
| 2013 | Innerklinische Bewältigung von Großschadensereignissen
Luiz, Thomas; Braun, Thomas; Fischer, Philipp; Kleber, Christian; Frank, Christian | Journal Article |
| 2013 | Panel level packaging - a manufacturing solution for cost-effective systems
Aschenbrenner, Rolf; Becker, K.-F.; Braun, T.; Ostmann, A. | Conference Paper |
| 2012 | Combination of channel- and droplet-based microfluidics for complex PoC devices
Jung, Erik; Georgi, Leopold; Bauer, Jörg; Braun, Tanja; Schuldt, Victoria; Metwally, Khaled; Robert, Laurent; Khan-Malek, Chantal | Conference Paper |
| 2012 | Enhancement of barrier properties of encapsulants for harsh environment applications
Braun, T.; Bauer, J.; Georgi, L.; Becker, K.F.; Koch, M.; Aschenbrenner, R.; Lang, K.D. | Conference Paper |
| 2012 | Enhancement of Humidity Barrier Properties of Polymers with Micro- and Nano-sized Filler Particles
Braun, Tanja; Bauer, Jörg; Georgi, Leopold; Becker, Karl-Friedrich; Koch, Mathias; Aschenbrenner, Rolf; Lang, Klaus-Dieter | Conference Paper |
| 2012 | In-situ - Characterization of moisture induced swelling behaviour of microelectronic relevant polymers
Walter, H.; Bauer, J.; Braun, T.; Hölck, O.; Wunderle, B.; Wittler, O. | Conference Paper |
| 2012 | Innerklinische Bewältigung von Großschadensereignissen
Luiz, Thomas; Braun, Thomas; Fischer, Philipp; Kleber, Christian; Frank, Christian | Research Report |
| 2012 | Transport of moisture at epoxy-SiO2 interfaces investigated by molecular modeling
Hölck, O.; Bauer, J.; Braun, T.; Walter, H.; Wittler, O.; Wunderle, B. | Conference Paper |
| 2011 | 3D stacking approaches for mold embedded packages
Braun, Tanja; Becker, Karl-F.; Voges, Steve; Thomas, Tina; Töpper, Michael; Fischer, Thorsten; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Lang, Klaus-Dieter | Conference Paper |
| 2011 | Heterogenous integration - packaging on and in organic substrates
Becker, Karl-Friedrich; Braun, T.; Bauer, J.; Böttcher, L.; Ostmann, A.; Pahl, B.; Haberland, J.; Kallmayer, C.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D. | Conference Paper |
| 2011 | Potential of large area mold embedded packages with pcb based redistribution
Braun, Tanja; Becker, Karl-Friedrich; Böttcher, Lars; Ostmann, Andreas; Jung, Erik; Voges, Steve; Thomas, Tina; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Schneider-Ramelow, Martin; Lang, Klaus-Dieter | Conference Paper |
| 2011 | Through mold vias for stacking of mold embedded packages
Braun, T.; Becker, K.-F.; Voges, S.; Thomas, T.; Kahle, R.; Bader, V.; Bauer, J.; Piefke, K.; Krüger, R.; Aschenbrenner, R.; Lang, K.-D. | Conference Paper |
| 2011 | Transfer molding technology for smart power electronics modules - materials and processes
Becker, K.-F.; Joklitschke, D.; Braun, T.; Koch, M.; Schreier-Alt, T.; Bader, V.; Bauer, J.; Nowak, T.; Aschenbrenner, R.; Schneider-Ramelow, M.; Thomas, T.; Bochow-Ness, O.; Lang, K.-D. | Conference Paper |
| 2011 | TSV based silicon interposer technology for wafer level fabrication of 3D SiP modules
Zoschke, K.; Wolf, J.; Lopper, C.; Kuna, I.; Jurgensen, N.; Glaw, V.; Samulewicz, K.; Roder, J.; Wilke, M.; Wunsch, O.; Klein, M.; Suchodoletz, M.V.; Oppermann, H.; Braun, T.; Wieland, R.; Ehrmann, O. | Conference Paper |
| 2010 | The biocompatibility of materials used in printed circuit board technologies with respect to primary neuronal and K562 cells
Mazzuferi, M.; Bovolenta, R.; Bocchi, M.; Braun, T.; Bauer, J.; Jung, E.; Iafelice, B.; Guerrieri, R.; Destro, F.; Borgatti, M.; Bianchi, N.; Simonato, M.; Gambari, R. | Journal Article |
| 2010 | Contactless handling and precision positioning of smallest components for assembly of microelectronics
Braun, T.; Bauer, J.; Becker, K.-F.; Kahle, R.; Jung, E.; Koch, M.; Mollath, G.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2010 | Contactless material deposition by jetting for heterogeneous system integration
Becker, K.-F.; Kurz, A.; Reichl, H.; Koch, M.; Bauer, J.; Braun, T. | Conference Paper |
| 2010 | Effects of biomaterials for Lab-on-a-chip production on cell growth and expression of differentiated functions of leukemic cell lines
Destro, F.; Borgatti, M.; Iafelice, B.; Gavioli, R.; Braun, T.; Bauer, J.; Böttcher, L.; Jung, E.; Bocchi, M.; Guerrieri, R.; Gambari, R. | Journal Article |
| 2010 | Large area embedding for heterogeneous system integration
Braun, T.; Becker, K.-F.; Böttcher, L.; Bauer, J.; Thomas, T.; Koch, M.; Kahle, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.; Bründel, M.; Haag, J.F.; Scholz, U. | Conference Paper |
| 2010 | Nano- und micro sized filler particles for improved humidity resistance of encapsulants
Braun, T.; Bauer, J.; Georgi, L.; Becker, K.-F.; Koch, M.; Thomas, T.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2010 | Precision material deposition for SiP manufacturing using jetting processes
Becker, K.-F.; Kurz, A.; Reichl, H.; Koch, M.; Bauer, J.; Braun, T. | Conference Paper |
| 2010 | Water diffusion in micro- and nano-particle filled encapsulants
Braun, T.; Georgi, L.; Bauer, J.; Koch, M.; Becker, K.-F.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2009 | Biocompatible lab-on-substrate technology platform
Braun, T.; Böttcher, L.; Bauer, J.; Bocchi, M.; Faenza, A.; Guerrieri, R.; Gambari, R.; Becker, K.-F.; Jung, E.; Ostmann, A.; Koch, M.; Kahle, R.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2009 | Embedding technologies for an automotive radar system
Becker, K.-F.; Koch, M.; Kahle, R.; Braun, T.; Böttcher, L.; Ostmann, A.; Kostelnik, J.; Ebling, F.; Noack, E.; Sommer, J.P.; Richter, M.; Schneider, M.; Reichl, H. | Conference Paper |
| 2009 | Embedding technology development for a 77 GHz automotive radar system
Becker, Karl-Friedrich; Koch, M.; Kahle, R.; Braun, T.; Böttcher, L.; Ostmann, A.; Kostelnik, J.; Ebling, F.; Noack, E.; Sommer, J.P.; Richter, M.; Schneider, M.; Reichl, H. | Conference Paper |
| 2009 | Embroidered interconnections and encapsulation for electronics in textiles for wearable electronics applications
Linz, T.; Vieroth, R.; Dils, C.; Koch, M.; Braun, T.; Becker, K.-F.; Kallmayer, C.; Hong, S.-M. | Conference Paper |
| 2009 | Failure modeling of ACA-glued flip-chip on flex assemblies
Wunderle, B.; Kallmayer, C.; Walter, H.; Braun, T.; Gollhardt, A.; Michel, B.; Reichl, H. | Conference Paper, Journal Article |
| 2009 | Flip chips on PCB - from single chip encapsulation to systems in package
Schreier-Alt, T.; Braun, T.; Becker, K.-F.; Rebholz, C.; Wunderle, B.; Reichl, H. | Journal Article |
| 2009 | Lab-on-substrate technology platform
Braun, T.; Böttcher, L.; Bauer, J.; Jung, E.; Becker, K.-F.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Journal Article, Conference Paper |
| 2009 | Microtechnology platform for cell cell interaction detection
Jung, E.; Manessis, D.; Neumann, A.; Böttcher, L.; Braun, T.; Bauer, J.; Reichl, H. | Conference Paper |
| 2009 | Nondestructive failure analysis and simulation of encapsulated 0402 multilayer ceramic chip capacitors under thermal and mechanical loading
Wunderle, B.; Braun, T.; May, D.; Michel, B.; Reichl, H. | Journal Article |
| 2009 | Plastic packaging for high temperature applications
Braun, T.; Becker, K.-F.; Bauer, J.; Koch, M.; Bader, V.; Kahle, R.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2009 | Smart sensor systems - packaging technologies for multi-sensory consumer applications
Jung, E.; Becker, K.-F.; Braun, T.; Aschenbrenner, R. | Conference Paper |
| 2008 | Adaption berührungslos induzierter Strukturbildungen mit Nanopartikeln für die Mikro-Nano-AVT
Fiedler, S.; Braun, T.; Bauer, J. | Research Report |
| 2008 | Contactless component handling on PCB using EWOD principles
Braun, T.; Becker, K.-F.; Koch, M.; Lienemann, J.; Kahle, R.; Bauer, J.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2008 | Embroidered interconnections and encapsulation for electronics in textiles for wearable electronics applications
Linz, T.; Vieroth, R.; Dils, C.; Koch, M.; Braun, T.; Becker, K.-F.; Kallmayer, C.; Hong, S.-M. | Conference Paper |
| 2008 | Lamination and laser structuring for a microwell array
Jung, E.; Manessis, D.; Neumann, A.; Böttcher, L.; Braun, T.; Bauer, J.; Reichl, H.; Iafelice, B.; Destro, F.; Gambari, R. | Journal Article |
| 2008 | Lifetime Model for Flip-Chip on Flex using Anisotropic Conductive Adhesive under Moisture and Temperature Loading
Wunderle, B.; Kallmayer, C.; Walter, H.; Braun, T.; Michel, B.; Reichl, H. | Conference Paper |
| 2008 | Micro to nano - scaling packaging technologies for future microsystems
Braun, T.; Becker, K.-F.; Bauer, J.; Hausel, F.; Pahl, B.; Wittler, O.; Mrossko, R.; Jung, E.; Ostmann, A.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2008 | Nano-particle enhanced encapsulants for improved humidity resistance
Braun, T.; Hausel, F.; Bauer, J.; Wittler, O.; Mrossko, R.; Bouazza, M.; Becker, K.-F.; Oestermann, U.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2008 | Nano-Particle Filled Epoxy Resins with Improved Diffusion Barrier Functionality
Braun, T.; Hausel, F.; Bauer, J.; Wittler, O.; Mrossko, R.; Bouazza, M.; Becker, K.-F.; Oestermann, U.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H. | Journal Article, Conference Paper |
| 2008 | Reliability modeling & test for flip-chip on flex substrates with Ag-filled anisotropic conductive adhesive
Wunderle, B.; Kallmayer, C.; Walter, H.; Braun, T.; Michel, B.; Reichl, H. | Conference Paper |
| 2008 | Reliable Encapsulation of Microsystems for Automotive Use
Becker, K.-F.; Braun, T.; Koch. M.; Bauer, J.; Wunderle, B.; Sommer, J.-P.; Aschenbrenner, R.; Reichl, H. | Conference Paper, Journal Article |
| 2007 | Aluminium printed circuit board technology for biomedical microdevices
Iafelice, B.; Destro, F.; Manessis, D.; Gazzola, D.; Jung, E.; Böttcher, L.; Borgatti, M.; Braun, T.; Bauer, J.; Gavioli, R.; Gambari, R.; Ostmann, A.; Guerrieri, R. | Conference Paper |
| 2007 | Lamination and laser structuring for a DEP microwell array
Jung, E.; Manessis, D.; Neumann, A.; Böttcher, L.; Braun, T.; Bauer, J.; Reichl, H. | Conference Paper |
| 2007 | Microtechnology for realization of dielectrophoresis enhanced microwells for biomedical applications
Braun, T.; Böttcher, L.; Bauer, J.; Manessis, D.; Jung, E.; Ostmann, A.; Becker, K.-F.; Aschenbrenner, R.; Reichl, H.; Guerrieri, R.; Gambari, R. | Conference Paper |
| 2007 | New sensor packaging concept for avionic application
Aschenbrenner, R.; Jung, E.; Braun, T.; Oestermann, U.; Bauer, J.; Becker, K.-F.; Reichl, H. | Conference Paper |
| 2007 | Non-destructive failure analysis and modeling of encapsulated miniature SMD ceramic chip capacitors under thermal and mechanical loading
Wunderle, B.; Braun, T.; May, D.; Mazloum, A.; Bouazza, M.; Walter, H.; Wittier, O.; Schacht, R.; Becker, K.-F.; Schneider-Ramelow, M.; Michel, B.; Reichl, H. | Conference Paper |
| 2006 | Biocompatible hybrid flip-chip microsystem integration for next generation wireless neural interfaces
Töpper, M.; Klein, M.; Buschick, K.; Glaw, V.; Orth, K.; Ehrmann, O.; Hutter, M.; Oppermann, H.; Becker, K.-F.; Braun, T.; Ebling, F.; Reichl, H.; Kim, S.; Tathireddy, P.; Chakravarty, S.; Solzbacher, F. | Conference Paper |
| 2006 | High-temperature reliability of flip chip assemblies
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2006 | Improved reliability of leadfree flip chip assemblies using direct underfilling by transfer molding
Braun, T.; Wunderle, B.; Becker, K.-F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2006 | Rapid tooling for high reliability transfer molded devices
Becker, K.-F.; Koch, M.; Gramckow, J.; Braun, T.; Bader, V.; Jung, E.; Lang, K.-D.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | Chip in duromer technology for system in package realization
Becker, K.-F.; Braun, T.; Neumann, A.; Ostmann, A.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | Duromer MID technology for system-in-package generation
Becker, K.-F.; Braun, T.; Neumann, A.; Ostmann, A.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.; Jung, E. | Journal Article |
| 2005 | Film coating - large area encapsulation process for electronics packaging
Becker, K.-F.; Braun, T.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | Film coatings as an encapsulation process for polymer electronics
Becker, K.-F.; Braun, T.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | High temperature potential of flip chip assemblies for automotive applications
Braun, T.; Becker, K.-F.; Sommer, J.-P.; Löher, T.; Schottenloher, K.; Kohl, R.; Pufall, R.; Bader, V.; Koch, M.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | A new wafer level packaging approach: Encapsulation, metallization and laser structuring for advanced system in package manufacturing
Becker, K.-F.; Braun, T.; Neumann, A.; Ostmann, A.; Coko, E.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2005 | Reliability potential of epoxy based encapsulants for automotive applications
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper, Journal Article |
| 2004 | Erfolgreich Entwicklungsprojekte planen
Schuh, G.; Lindemann, U.; Kohlhase, N.; Braun, T.; Breuer, T. | Journal Article |
| 2004 | Stackable system-on-packages with integrated components
Becker, K.-F.; Jung, E.; Ostmann, A.; Braun, T.; Neumann, A.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2003 | Automatische Lokalisierung von Gesichtern in digitalen Videoströmen
Braun, T.
: Cavet, R. (Prüfer) | Thesis |
| 2003 | Flip chip technology for high temperature automotive applications
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2003 | Vom Wafer zum System-in-Package
Braun, T.; Becker, K.-F.; Ostmann, A. | Journal Article |
| 2003 | Wafer level encapsulation for system in package generation
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Manessis, D.; Neumann, A.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2002 | Encapsulant characterization - valuable tools for process setup and failure analysis
Becker, K.F.; Braun, T.; Koch, M.; Vogel, D.; Aschenbrenner, R.; Reichl, H.; Hagedorn, H.W.; Neumann Rodekirch, J. | Conference Paper |
| 2002 | Flip chip molding - highly reliable flip chip encapsulation
Braun, T.; Becker, K.F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2002 | Flip chip molding - Recent progress in flip chip encapsulation
Braun, T.; Becker, K.F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2002 | Simultaneous flip chip underfill and encapsulation
Becker, K.F.; Braun, T.; Adams, T. | Journal Article |
| 2002 | Wafer level encapsulation - a transfer molding approach to system in package generation
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Oystermann, U.; Manessis, D.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2001 | Advanced flip chip encapsulation: Transfer molding process for simultaneous underfiling and postencapsulation
Becker, K.-F.; Braun, T.; Koch, M.; Ansorge, F.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2001 | Plastic encapsulation technologies - Processes and characterization
Ansorge, F.; Becker, K.-F.; Braun, T.; Jung, E.; Misawa, D. | Conference Paper |
| 2000 | Aufbau-, Verbindungs- und Verkapselungstechnik in der Mechatronik. Neuartige Systemlösungen
Ansorge, F.; Becker, K.-F.; Großer, V.; Michel, B.; Braun, T. | Journal Article |
| 2000 | Dynamic mechanical analysis (DMA) of an highly-filled epoxy resin in thin layers
Braun, T.; Mießner, R.; Becker, K.-F. | Conference Paper |
| 2000 | Mechatronic solutions for modular MEMS
Amiri Jam, K.; Hillmann, V.; Braun, T.; Becker, K.-F.; Ansorge, F.; Großer, V.; Reichl, H. | Conference Paper |
| 2000 | Mechatronik - Kleiner - Funktioneller - Intelligenter
Ansorge, F.; Braun, T.; Jansen, M.; Aab, V.; Sporer, M. | Conference Paper |
| 1995 | The Scientometric Weight of 50 nations in 27 Science Areas, 1989-1993. Part I. All Fields combined, Mathematics, Engineering, Chemistry and Physics
Braun, T.; Glänzel, W.; Grupp, H. | Journal Article |
| 1995 | The Scientometric Weight of 50 nations in 27 Science Areas, 1989-1993. Part II. Life Sciences
Braun, T.; Glänzel, W.; Grupp, H. | Journal Article |
| 1991 | Baculovirus-expressed myogenic determination factors require E12 complex formation for binding to the myosin-light-chain enhancer
Braun, T.; Gearing, K.; Wright, W.E.; Arnold, H.-H. | Journal Article |
| 1991 | The four human muscle regulatory helix-loop-helix proteins Myf3-Myf6 exhibit similar hetero-dimerization and DNA binding properties
Braun, T.; Arnold, H.-H. | Journal Article |
| 1991 | The muscle regulatory gene, Myf-6, has a biphasic pattern of expression during early mouse development
Bober, E.; Lyons, G.E.; Braun, T.; Cossu, G.; Buckingham, M.; Arnold, H.-H. | Journal Article |
| 1991 | Transcription of the muscle regulatory gene Myf4 is regulated by serum components, peptide growth factors and signaling pathways involving G proteins
Salminen, A.; Braun, T.; Buchberger, A.; Juers, S.; Winter, B.; Arnold, H.-H. | Journal Article |
| 1990 | Identification of three developmentally controlled isoforms of human myosin heavy chains
Bober, E.; Buchberger-Seidl, A.; Braun, T.; Singh, S.; Goedde, H.W.; Arnold, H.-H. | Journal Article |
| 1990 | Isolation and characterization of human myogenic factors involved in lineage determination and regulation of gene expression
Braun, T.; Bober, E.; Winter, B.; Arnold, H.-H.; Buschhausen-Denker, G. | Conference Paper |
| 1990 | Myf-6, a new member of the human gene family of myogenic determination factors - evidence for a gene cluster on chromosome 12
Braun, T.; Bober, E.; Winter, B.; Rosenthal, N.; Arnold, H.-H. | Journal Article |
| 1990 | Transcriptional activation domain of the muscle-specific gene-regulatory protein myf5
Braun, T.; Winter, B.; Bober, E.; Arnold, H.-H. | Journal Article |
| 1989 | Differential expression of myogenic determination genes in musle cells - possible autoactivation by the Myf gene products
Arnold, H.-H.; Bober, E.; Braun, T.; Buschhausen-Denker, G.; Grzeschik, K.-H.; Kotz, S. | Journal Article |
| 1989 | A novel human muscle factor related to but distinct from MyoD1 induces myogenic conversion in 1OT1/2 fibroblasts
Braun, T.; Bober, E.; Tannich, E.; Arnold, H.-H.; Buschhausen-Denker, G. | Journal Article |
| 1989 | Promoter upstream elements of the chicken cardiac myosin light-chain 2-A gene interact with transacting regulatory factors for muscle-specific transcription
Arnold, H.-H.; Braun, T.; Buschhausen-Denker, G.; Tannich, E. | Journal Article |