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| 2012 | Electrical stress on intrinsically conductive polymer layer
Bonfert, D.; Hemmetzberger, D.; Klink, G.; Bock, K.; Svasta, P.; Ionescu, C. | Conference Paper |
| 2011 | Analytic parameter extraction for organic transistors with TIPS-Pentacene
Buu, I.; Bonea, A.; Svasta, P.; Bonfert, D. | Conference Paper |
| 2011 | Contact resistance in Polytriarylamine based organic transistors
Bonea, A.; Bonfert, D.; Svasta, P. | Conference Paper |
| 2011 | Electrical stress on film resistive structures on different substrates
Bonfert, D.; Klink, G.; Bock, K.; Svasta, P.; Ionescu, C. | Conference Paper |
| 2011 | Electrical stress on thin film TaN resistive structures
Bonfert, D.; Gieser, H.; Bock, K.; Svasta, P.; Ionescu, C. | Conference Paper |
| 2011 | Simulation of printed thermoelectric generators using finite element analysis
Ionescu, C.; Svasta, P.; Bonfert, D. | Conference Paper |
| 2010 | Analysis of planar inductors on flexible substrates for RFID antennas
Ionescu, C.; Svasta, P.; Bonfert, D.; Klink, G. | Conference Paper |
| 2010 | Electrical stress on film resistive structures on flexible substrates
Bonfert, D.; Klink, G.; Gieser, H.; Bock, K.; Svasta, P.; Ionescu, C. | Conference Paper |
| 2010 | Influence of nano silver filler content on properties of ink-jet printed structures for microelectronics
Falat, T.; Felba, J.; Moscicki, A.; Smolarek, A.; Bock, K.; Bonfert, D. | Conference Paper |
| 2010 | Polymer electronics towards system integration
Bonfert, D.; Klink, G.; Bock, K. | Conference Paper |
| 2010 | Pulsed stress behavior of platinum thin films
Bonfert, D.; Gieser, H.; Bock, K.; Svasta, P.; Ionescu, C. | Conference Paper |
| 2010 | Rapid prototyping of electronic modules combining aerosol printing and ink jet printing
Gieser, H.A.; Bonfert, D.; Hengelmann, H.; Wolf, H.; Bock, K.; Zollmer, V.; Werner, C.; Domann, G.; Bahr, J.; Ndip, I.; Curran, B.; Oehler, F.; Milosiu, H. | Conference Paper |
| 2009 | DC and thermal behavior of PEDOT:PSS thin films
Busu, I.; Svasta, P.; Bunea, R.; Bonfert, D. | Conference Paper |
| 2009 | Electrostatic wafer handling for thin wafer processing
Landesberger, C.; Wieland, R.; Klumpp, A.; Ramm, P.; Drost, A.; Schaber, U.; Bonfert, D.; Bock, K. | Conference Paper |
| 2009 | Investigation of solder joints by thermographical analysis
Svasta, P.; Ionescu, C.; Codreanu, N.D.; Bonfert, D. | Conference Paper |
| 2009 | Properties of conductive microstructures containing nano sized silver particles
Felba, J.; Nitsch, K.; Piasecki, T.; Tesarski, S.; Moscicki, A.; Kinart, A.; Bonfert, D.; Bock, K. | Conference Paper |
| 2009 | Pulsed behavior of polymer protection devices
Bonfert, D.; Gieser, H.; Bock, K.; Svasta, P.; Ionescu, C. | Conference Paper |
| 2009 | Pulsed stress behavior of PEDOT:PSS thin films
Bonfert, D.; Klink, G.; Bock, K.; Svasta, P.; Ionescu, C. | Conference Paper |
| 2008 | Pulsed stress behavior of flexible thick film resistors
Bonfert, D.; Wolf, H.; Gieser, H.; Klink, G.; Bock, K.; Svasta, P.; Ionescu, C. | Conference Paper |
| 2008 | Transient latch-up analysis of power control device with combined light emission and backside transient interferometric mapping methods
Heer, M.; Pogany, D.; Street, M.; Smith, I.; Riedlberger, F.; Bonfert, D.; Gieser, H.A. | Conference Paper |
| 2007 | High Current Pulse Stress on Flexible Thick Film Resistors
Bonfert, D.; Wolf, H.; Gieser, H.; Klink, G.; Hemmetzberger, D. | Conference Paper |
| 2007 | Transmission line pulse stress on thick film resistors
Bonfert, D.; Wolf, H.; Gieser, H.; Svasta, P.; Romanescu, A.; Cazacu, E. | Conference Paper |
| 2006 | ESD susceptibility of submicron air gaps
Wolf, H.; Gieser, H.; Bonfert, D.; Hauser, M. | Conference Paper, Journal Article |
| 2006 | ESD susceptibility of thick film chip resistors by means of transmission line pulsing
Bonfert, D.; Wolf, H.; Gieser, H.; Stocker, A. | Conference Paper |
| 2006 | Transient-induced latch-up test setup for wafer-level and package-level
Bonfert, D.; Gieser, H.; Wolf, H.; Frank, M.; Konrad, A.; Schulz, J. | Conference Paper, Journal Article |
| 2005 | 3D integration of CMOS transistors with ICV-SLID technology
Wieland, R.; Bonfert, D.; Klumpp, A.; Merkel, R.; Nebrich, L.; Weber, J.; Ramm, P. | Conference Paper, Journal Article |
| 2005 | High quality strained Si/SiGe substrates for CMOS and optical devices
Weber, J.; Nebrich, L.; Bensch, F.; Neumeier, K.; Vogg, G.; Wieland, R.; Bonfert, D.; Ramm, P. | Conference Paper |
| 2005 | Process integration of infrared-sensitive PIN photodiodes and CMOS transistors in a single-SiGe substrate
Nebrich, L.; Neumeier, K.; Stadler, A.; Weber, J.; Bensch, F.; Kreuzer, S.; Vogg, G.; Herrmann, K.; Klumpp, A.; Wieland, R.; Bonfert, D.; Soldner, W.; Ramm, P. | Conference Paper, Journal Article |
| 2002 | InterChip via technology by using copper for vertical system integration
Ramm, P.; Bonfert, D.; Ecke, R.; Iberl, F.; Klumpp, A.; Riedel, S.; Schulz, S.E.; Wieland, R.; Zacher, M.; Gessner, T. | Conference Paper |
| 2001 | Interchip Via Technology for Vertical System Integration
Ramm, P.; Bonfert, D.; Gieser, H.; Haufe, J.; Iberl, F.; Klumpp, A.; Kux, A.; Wieland, R. | Conference Paper |
| 1999 | Transient induced latch-up triggered by very fast pulses
Bonfert, D.; Gieser, H. | Conference Paper, Journal Article |
| 1999 | Transient-Induced Latch-Up Triggered by Very Fast Pulses
Bonfert, D.; Gieser, H. | Journal Article, Conference Paper |
| 1990 | Reliability investigations of thin film metallizations on AlN-ceramics
Bonfert, D.; Drost, A.; Feil, M. | Conference Paper |