Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018The influence of environmental conditions on the properties of housing materials for power electronics
Böttge, B.; Bernhardt, R.; Klengel, S.; Wels, S.; Claudi, A.
Conference Paper
2018Material Characterization of Advanced Cement-Based Encapsulation Systems for Efficient Power Electronics with Increased Power Density
Böttge, B.; Naumann, F.; Behrendt, S.; Scheibel, M.G.; Kässner, S.; Klengel, S.; Petzold, M.; Nickel, K.G.; Hejtmann, G.; Miric, A.-Z.; Eisele, R.
Conference Paper
2018Non-destructive Assessment of the Porosity in Silver (Ag) Sinter Joints Using Acoustic Waves
Brand, S.; Böttge, B.; Kögel, M.; Naumann, F.; Zijl, J.; Kersjes, S.; Behrens, T.; Altmann, F.
Conference Paper
2016Failure analysis and material characterization in power electronics packaging
Boettge, B.; Schak, M.; Klengel, R.; Schischka, J.; Klengel, S.
Conference Paper
2014Challenges and solutions in preparation for high resolution failure analysis of power electronics
Klengel, R.; Klengel, S.; Böttge, B.
Conference Paper
2013Analysis of the plastic deformation in aluminium metallizations of Al2O3 - based DAB substrates
Poller, T.; Lutz, J.; Boettge, B.; Knoll, H.
Conference Paper
2013Packaging material issues in high temperature power electronics
Boettge, B.; Naumann, F.; Klengel, R.; Klengel, S.; Petzold, M.
Conference Paper
2012Failure mechanisms and mechanical characterization of reactive bonded interfaces
Boettge, B.; Schippel, F.; Naumann, F.; Berthold, L.; Lorenz, G.; Gerbach, R.; Bagdahn, J.; Petzold, M.
Conference Paper, Journal Article
2012Microstructural and mechanical characterization of ceramic substrates with different metallization for power applications
Böttge, B.; Klengel, S.; Schischka, J.; Lorenz, G.; Knoll, H.
Conference Paper
2011High resolution microstructural investigation of leadfree Aluminium-Germanium and Aluminum-Germanium-Copper alloys for high temperature silicon die attach
Klengel, S.; Böttge, B.; Petzold, M.; Schneider, W.
Conference Paper
2010Fabrication and characterization of reactive nanoscale multilayer systems for low-temperature bonding in microsystem technology
Boettge, B.; Braeuer, J.; Wiemer, M.; Petzold, M.; Bagdahn, J.; Gessner, T.
Journal Article
2010Reaktives Bonden für spannungsarmes Fügen in der Mikrosystemtechnik
Boettge, B.; Braeuer, J.; Wiemer, M.; Petzold, M.
Journal Article
2010Selbstausbreitende exotherme Reaktionen als interne Wärmequelle für die Aufbau- und Verbindungstechnik von Mikrosystemen
Bräuer, J.; Böttge, B.; Wiemer, M.; Petzold, M.; Gessner, T.
Conference Paper
2010Temperature dependent fracture toughness of glass frit bonding layers
Nötzold, K.; Dresbach, C.; Graf, J.; Böttge, B.
Conference Paper, Journal Article
2009Characterization of reactive nano scale multilayer foils for microsystem applications
Boettge, B.; Teuscher, N.; Schischka, J.; Krause, M.; Richter, S.; Heilmann, A.; Petzold, M.; Bagdahn, J.
Conference Paper
2009Temperature dependent fracture toughness of glass frit bonding layers
Nötzold, K.; Dresbach, C.; Graf, J.; Böttge, B.
Conference Paper
2008Mechanical characterization and micro structure diagnostics of glass frit bonded interfaces
Boettge, B.; Dresbach, C.; Graff, A.; Petzold, M.; Bagdahn, J.
Conference Paper