Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Full wafer redistribution and wafer embedding as key technologies for a multi-scale neuromorphic hardware cluster
Zoschke, Kai; Güttler, M.; Böttcher, L.; Grübl, A.; Husmann, D.; Schemmel, J.; Meier, K.-H.; Ehrmann, O.
Conference Paper
2018Panel Level Packaging: A View Along the Process Chain
Braun, T.; Becker, K.-F.; Hölck, O.; Kahle, R.; Wöhrmann, M.; Böttcher, L.; Topper, M.; Stobbe, L.; Zedel, H.; Aschenbrenner, R.; Voges, S.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2017Modular power electronics, realized by PCB embedding technology
Böttcher, Lars; Karaszkiewicz, Stefan; Manessis, Dionysios; Ostmann, Andreas
Presentation
2017Trends in fan-out wafer and panel level packaging
Braun, T.; Becker, K.-F.; Wöhrmann, M.; Töpper, M.; Böttcher, L.; Aschenbrenner, R.; Lang, K.-D.
Conference Paper
2016Compact power electronic modules realized by PCB embedding technology
Löher, T.; Karaszkiewicz, S.; Böttcher, L.; Ostmann, A.
Conference Paper
2016Embedded die packages and modules for power electronics applications
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.
Conference Paper
2016Thermal benchmark of a classic and novel embedded high-power 3-phase inverter Bridge
Stahr, H.; Unger, M.; Nicolics, J.; Morianz, M.; Gross, S.; Böttcher, L.
Conference Paper
2015Characteristics and aging of PCB embedded power electronics
Randoll, R.; Asef, M.; Wondrak, W.; Böttcher, L.; Schletz, A.
Journal Article, Conference Paper
2015Development of advanced power modules for electric vehicle applications
Manessis, D.; Boettcher, L.; Ostmann, A.; Lang, K.-D.; Whalley, S.
Conference Paper
2015Embedded power modules - a new approach using Power Core and High Power PCB
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.
Conference Paper
2015Next generation high power electronic modules based on embedded power semiconductors
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Hoene, E.; Ostmann, A.
Journal Article
2014A 50 kW IGBT power module for automotive applications with extremely low DC-link inductance
Neeb, C.; Teichrib, J.; Doncker, R.W. de; Boettcher, L.; Ostmann, A.
Conference Paper
2014Embedding of power semiconductors for innovative packages and modules
Boettcher, L.; Manessis, D.; Karaszkiewicz, S.; Ostmann, A.
Conference Paper
2014Innovative and reliable power modules: A future trend and evolution of technologies
Neeb, C.; Boettcher, L.; Conrad, M.; Doncker, R.W. de
Journal Article
2014Next generation high power electronic module based on embedded power semiconductors
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Hoene, E.; Ostmann, A.
Conference Paper
2014Power electronics packages with embedded components - recent trends and developments
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.
Journal Article
2014Robust module integration of back contact cells by interconnection adapters
Ebert, M.; Seckel, M.; Böttcher, L.; Hendrichs, M.; Clement, F.; Dürr, I.; Biro, D.; Eitner, U.; Schneider-Ramelow, M.
Conference Paper
2013Development of embedded high power electronics modules for automotive applications
Böttcher, L.
Conference Paper
2013Power electronics packages with embedded components - recent trends and developments
Böttcher, Lars; Karaszkiewicz, Stefan; Manessis, Dionysios; Ostmann, Andreas
Conference Paper
2013Power modules with embedded chips for automotive applications
Ostmann, A.; Boettcher, L.; Hofmann, T.; Neeb, C.; Kuschke, R.; Manessis, D.; Lang, K.-D.
Conference Paper
2013Power modules with embedded components
Ostmann, A.; Boettcher, L.; Manessis, D.; Karaszkiewicz, S.; Lang, K.-D.
Conference Paper
2012Development of embedded power electronics modules
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.
Conference Paper
2012Embedded power electronics for automotive applications
Ostmann, A.; Hofmann, T.; Neeb, C.; Boettcher, L.; Manessis, D.; Lang, K.-D.
Conference Paper
2012Heterogenous integration - packaging on and in organic substrates
Becker, Karl-Friedrich; Braun, T.; Bauer, J.; Böttcher, L.; Ostmann, A.; Pahl, B.; Haberland, J.; Kallmayer, C.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2012Innovation driver of the next decade: Heterogeneous integration
Lang, Klaus-Dieter; Pötter, Harald; Aschenbrenner, Rolf; Becker, Karl-Friedrich; Boettcher, Lars; Ehrmann, Oswin; Wilke, Martin; Toepper, Michael
Journal Article
2012Innovation Driver of the Next Decade: Technology Follows Application
Lang, K.-D.; Pötter, H.; Aschenbrenner, R.; Becker, K.-F.; Boettcher, L.; Ehrmann, O.; Wilke, M.; Toepper, M.
Book Article
2012Large area mold embedding technology with PCB based redistribution
Braun, T.; Becker, K.-F.; Böttcher, L.; Ostmann, A.; Jung, E.; Voges, S.; Thomas, T.; Kahle, R.; Bader, V.; Bauer, J.; Aschenbrenner, R.; Schneider Ramelow, M.; Lang, K.-D.
Conference Paper
2012Leistungselektronik in Leiterplatten einbetten
Böttcher, Lars
Journal Article
2011Chip embedding technology developments leading to the emergence of miniaturized system-in-packages
Manessis, D.; Böttcher, L.; Karaszkiewicz, S.; Ostmann, A.; Aschenbrenner, R.; Lang, K.-D.
Conference Paper
2011Embedding technology for manufacturing of high density SiP
Böttcher, L.; Manessis, D.; Karaszkiewicz, S.; Ostmann, A.
Conference Paper
2011Fan-out and embedded panel discussion: Embedded technology and latest developments
Böttcher, L.
Conference Paper
2011Modular system packaging by embedding: Technologies, applications and perspectives
Böttcher, Lars; Manessis, D.; Karaszkiewicz, S.; Löher, T.; Ostmann, A.
Conference Paper
2011Non-destructive X-Ray mapping of strain & warpage of die in packaged chips
Stopford, J.; Henry, A.; Manessis, D.; Bennett, N.; Horan, K.; Allen, D.; Wittge, J.; Boettcher, L.; Cowley, A.; McNally, P.J.
Conference Paper
2011Potential of large area mold embedded packages with pcb based redistribution
Braun, Tanja; Becker, Karl-Friedrich; Böttcher, Lars; Ostmann, Andreas; Jung, Erik; Voges, Steve; Thomas, Tina; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Conference Paper
2011Realization of power modules by chip embedding technology
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.
Conference Paper
2011System Packaging by Embedding: Technologies, Examples and Perspectives
Löher, Thomas; Böttcher, Lars; Schütze, David; Karaszkiewicz, Stefan; Ostmann, Andreas; Aschenbrenner, Rolf
Conference Paper
2010Chip embedding technology developments leading to the emergence of miniaturized system-in-packages
Manessis, D.; Boettcher, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2010Effects of biomaterials for Lab-on-a-chip production on cell growth and expression of differentiated functions of leukemic cell lines
Destro, F.; Borgatti, M.; Iafelice, B.; Gavioli, R.; Braun, T.; Bauer, J.; Böttcher, L.; Jung, E.; Bocchi, M.; Guerrieri, R.; Gambari, R.
Journal Article
2010Implementation of chip embedding processes for the creation of miniaturized system-in-packages
Böttcher, Lars; Manessis, Dionysios; Ostmann, Andreas; Karaszkiewicz, Stefan; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2010Large area embedding for heterogeneous system integration
Braun, T.; Becker, K.-F.; Böttcher, L.; Bauer, J.; Thomas, T.; Koch, M.; Kahle, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.; Bründel, M.; Haag, J.F.; Scholz, U.
Conference Paper
2010Next generation system in a package manufacturing
Böttcher, Lars; Manessis, Dionysios; Karaszkiewicz, Stefan; Ostmann, Andreas; Reichl, Herbert
Conference Paper
2010Next Generation System in a Package Manufacturing by Embedded Chip Technologies
Böttcher, Lars; Manessis, Dionysios; Karaszkiewicz, Stefan; Ostmann, Andreas; Reichl, Herbert
Conference Paper, Journal Article
2009Biocompatible lab-on-substrate technology platform
Braun, T.; Böttcher, L.; Bauer, J.; Bocchi, M.; Faenza, A.; Guerrieri, R.; Gambari, R.; Becker, K.-F.; Jung, E.; Ostmann, A.; Koch, M.; Kahle, R.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2009Breakthroughs in chip embedding technologies leading to the emergence of further miniaturised system-in-packages
Manessis, D.; Böttcher, L.; Ostmann, A.; Karaszkiewicz, S.; Reichl, H.
Conference Paper
2009Chip embedding technology - New technological challenges for a reliable System-in-Package realization
Böttcher, L.; Manessis, D.; Ostmann, A.; Karaszkiewicz, S.; Reichl, H.
Conference Paper
2009Embedding technologies for an automotive radar system
Becker, K.-F.; Koch, M.; Kahle, R.; Braun, T.; Böttcher, L.; Ostmann, A.; Kostelnik, J.; Ebling, F.; Noack, E.; Sommer, J.P.; Richter, M.; Schneider, M.; Reichl, H.
Conference Paper
2009Embedding technology development for a 77 GHz automotive radar system
Becker, Karl-Friedrich; Koch, M.; Kahle, R.; Braun, T.; Böttcher, L.; Ostmann, A.; Kostelnik, J.; Ebling, F.; Noack, E.; Sommer, J.P.; Richter, M.; Schneider, M.; Reichl, H.
Conference Paper
2009Innovative approaches for realisation of embedded chip packages - technological challenges and achievements
Manessis, D.; Böttcher, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2009Innovative package realization by Chip Embedding Technologies
Böttcher, L.; Manessis, D.; Karaszkiewicz, S.; Ostmann, A.; Reichl, H.
Conference Paper
2009Lab-on-substrate technology platform
Braun, T.; Böttcher, L.; Bauer, J.; Jung, E.; Becker, K.-F.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Journal Article, Conference Paper
2009Microtechnology platform for cell cell interaction detection
Jung, E.; Manessis, D.; Neumann, A.; Böttcher, L.; Braun, T.; Bauer, J.; Reichl, H.
Conference Paper
2009Realisation of embedded-chip QFN packages - technological challenges and achievements
Ostmann, A.; Manessis, D.; Böttcher, L.; Karaszkiewicz, S.; Reichl, H.
Conference Paper
2009Verfahren zur Herstellung einer elektronischen Baugruppe und elektronische Baugruppe
Ostmann, A.; Manessis, D.; Böttcher, L.; Karaszkiewicz, S.
Patent
2008Design of 77 GHz interconnects for buried SiGe MMICs using novel system-in-package technology
Richter, M.D.; Becker, K.-F.; Böttcher, L.; Schneider, M.
Conference Paper
2008Design of 77 GHz interconnects for buried SiGe MMICs using novel system-in-package technology
Richter, M.D.; Becker, K.-F.; Böttcher, L.; Schneider, M.
Conference Paper
2008Embedded chip packages - technology and application
Böttcher, L.; Manessis, D.; Ostmann, A.; Karaszkiewicz, S.; Reichl, H.
Conference Paper
2008Embedding of chips for system in package realization - technology and applications
Boettcher, L.; Manessis, D.; Ostmann, A.; Karaszkiewicz, S.; Reichl, H.
Conference Paper
2008Highly integrated flexible electronic circuits and modules
Loher, T.; Seckel, M.; Pahl, B.; Böttcher, L.; Ostmann, A.; Reichl, H.
Conference Paper
2008KRAFAS - Einbetttechnologien für aktive Komponenten
Kostelnik, J.; Becker, K.-F.; Ebling, F.; Sommer, J.-P.; Noack, E.; Böttcher, L.
Journal Article
2008Lamination and laser structuring for a microwell array
Jung, E.; Manessis, D.; Neumann, A.; Böttcher, L.; Braun, T.; Bauer, J.; Reichl, H.; Iafelice, B.; Destro, F.; Gambari, R.
Journal Article
2008Manufacturing Concepts for Stretchable Electronic Systems
Ostmann, A.; Löher, T.; Seckel, M.; Böttcher, L.; Reichl, H.
Conference Paper
2008Realization of system-in-package modules by embedding of chips
Boettcher, L.; Manessis, D.; Ostmann, A.; Reichl, H.
Conference Paper
2007Aluminium printed circuit board technology for biomedical microdevices
Iafelice, B.; Destro, F.; Manessis, D.; Gazzola, D.; Jung, E.; Böttcher, L.; Borgatti, M.; Braun, T.; Bauer, J.; Gavioli, R.; Gambari, R.; Ostmann, A.; Guerrieri, R.
Conference Paper
2007Lamination and laser structuring for a DEP microwell array
Jung, E.; Manessis, D.; Neumann, A.; Böttcher, L.; Braun, T.; Bauer, J.; Reichl, H.
Conference Paper
2007Microtechnology for realization of dielectrophoresis enhanced microwells for biomedical applications
Braun, T.; Böttcher, L.; Bauer, J.; Manessis, D.; Jung, E.; Ostmann, A.; Becker, K.-F.; Aschenbrenner, R.; Reichl, H.; Guerrieri, R.; Gambari, R.
Conference Paper
2006A cost-effective alternative technology for wafer bumping - Electroless Ni/Au UBM deposition and ultra fine pitch printing of solder paste
Boettcher, L.; Ostmann, A.; Manessis, D.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2006Development of a 3D wafer-level re-routing, using dielectric lamination technology
Böttcher, L.; Ostmann, A.; Manessis, D.; Polityko, D.; Reichl, H.
Conference Paper
2006Morphology and growth kinetics of intermetallic compounds in solid-state interfacial reaction of electroless Ni-P with Sn-based lead-free solders
Huang, M.L.; Löher, T.; Manessis, D.; Böttcher, L.; Ostmann, A.; Reichl, H.
Journal Article
2006Qualitative evaluation of flip chip solder bumps produced by stencil printing of solder paste on various electroless nickel/gold metallizations
Manessis, D.; Böttcher, L.; Patzelt, R.; Ostmann, A.; Schild, B.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2006Verfahren zum Herstellen einer Durchkontaktierung zwischen zwei Oberflaechen eines Halbleitersubstrats
Böttcher, L.; Ostmann, A.; Manessis, D.
Patent
2005Development of 3-D redistribution and balling technologies for fabrication of vertical power devices
Böttcher, L.; Manessis, D.; Ostmann, A.; Reichl, H.; Whitmore, M.; Staddon, M.
Journal Article
2005Einbettung aktiver und passiver Komponenten in die Leiterplatte
Löher, T.; Pahl, B.; Haberland, J.; Vieroth, R.; Kallmeyer, C.; Neumann, A.; Böttcher, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Journal Article
2005Integration of active and passive components using chip in polymer technology
Böttcher, L.; Neumann, A.; Ostmann, A.; Reichl, H.
Conference Paper
2005Smart PCBs manufacturing technologies
Löher, T.; Neumann, A.; Böttcher, L.; Pahl, B.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Chip in polymer - Next step in miniaturization
Ostmann, A.; Neumann, A.; Jung, E.; Boettcher, L.; Reichl, H.
Journal Article
2002Realization of a stackable package using chip in polymer technology
Ostmann, A.; Neumann, A.; Weser, S.; Jung, E.; Böttcher, L.; Reichl, H.
Conference Paper