Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019A novel low cost roll-to-roll manufacturing compatible ultra-thin chip integration and direct metal interconnection process for flexible hybrid electronics
Palavesam, Nagarajan; Hell, Waltraud; Drost, Andreas; Landesberger, Christof; Kutter, Christoph; Bock, Karlheinz
Conference Paper
2018Developments for highly reliable electronics - experiments on combined thermal and vibration loading
Meier, Karsten; Röllig, Mike; Bock, Karlheinz
Conference Paper
2018Dynamic Bending Reliability Analysis of Flexible Hybrid Integrated Chip-Foil Packages
Palavesam, Nagarajan; Yacoub-George, E.; Hell, W.; Landesberger, C.; Kutter, C.; Bock, K.
Conference Paper
2018Evaluation of Nanoparticle Inks on Flexible and Stretchable Substrates for Biocompatible Application
Schubert, Martin; Rebohle, Lars; Wang, Yakun; Fritsch, Marco; Bock, Karlheinz; Vinnichenko, Mykola; Schumann, Thomas
Conference Paper
2018Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly
Meier, K.; Metasch, R.; Roellig, M.; Bock, K.
Journal Article
2018Roll-to-roll processing of film substrates for hybrid integrated flexible electronics
Palavesam, Nagarajan; Marin, Sonia; Hemmetzberger, Dieter; Landesberger, Christof; Bock, Karlheinz; Kutter, Christoph
Journal Article
2018Setup für Ermüdungsversuche an elektronischen Komponenten unter kombinierten Temperatur- und Vibrationslasten
Meier, Karsten; Metasch, René; Röllig, Mike; Bock, K.
Conference Paper
2018Solder joint fatigue analysis under combined thermal and vibration loading
Meier, Karsten; Röllig, Mike; Liu, Y.; Bock, K.
Conference Paper
2017Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly
Meier, Karsten; Metasch, René; Röllig, Mike; Bock, Karlheinz
Conference Paper
2016Functionalization and large scale assembly of carbon nanotubes
Majumder, Anindya
: Cuniberti, Gianaurelio (1. Gutachter); Bock, Karlheinz (2. Gutachter); Opitz, Jörg (Betreuer)
Dissertation
2016Mechanical reliability analysis of ultra-thin chip-on-foil assemblies under different types of recurrent bending
Palavesam, N.; Bonfert, D.; Hell, W.; Landesberger, C.; Gieser, H.; Kutter, C.; Bock, K.
Conference Paper
2016Messvorrichtung und System zur Schmelzkurvenanalyse eines DNA Microarrays, sowie Verwendung eines Fluoreszenzdetektorarrays zur Analyse
Ohlander, Anna; Bock, Karlheinz; Ganka, Thomas
Patent
2016Novel processing scheme for embedding and interconnection of ultra-thin IC devices in flexible chip foil packages and recurrent bending reliability analysis
Landesberger, C.; Palavesam, N.; Hell, W.; Drost, A.; Faul, R.; Gieser, H.; Bonfert, D.; Bock, K.; Kutter, C.
Conference Paper
2016A novel test method for robustness assessment of very small, functional ultra-thin chips embedded in flexible foils
Palavesam, N.; Landesberger, C.; Kutter, C.; Bock, K.
Conference Paper
2016Plasmaätzen zur Herstellung von Siliziumdurchkontaktierungen mit kontrolliertem Seitenwinkel für die dreidimensionale Integration im Wafer Level Packaging
Wilke, Martin
: Dieckerhoff, S.; Lang, K.-D.; Bock, K.; Tillack, B.
Dissertation
2016Zuverlässigkeitsuntersuchungen an organischen Leiterplatten mit dickem Kupferkern für leistungselektronische Anwendungen
Meier, Karsten; Röllig, Mike; Bock, Karlheinz
Conference Paper
2015Electrical behaviour of Flip-Chip bonded thin silicon chip-on-foil assembly during bending
Palavesam, N.; Bonfert, D.; Hell, W.; Landesberger, C.; Gieser, H.; Kutter, C.; Bock, K.
Conference Paper
2015Finite element analysis of uniaxial bending of ultra-thin silicon dies embedded in flexible foil substrates
Palavesam, N.; Landesberger, C.; Kutter, C.; Bock, K.
Conference Paper
2015Homogeneous crystallization of micro-dispensed TIPS-pentacene using a two-solvent system to enable printed inverters on foil substrates
Bose, I.; Tetzner, K.; Borner, K.; Bock, K.
Journal Article
2015Leuchtvorrichtung, Vorrichtung mit einer Leuchtvorrichtung und Herstellungsverfahren
Bock, Karlheinz
Patent
2015Reliability study on SMD components on an organic substrate with a thick copper core for power electronics applications
Meier, Karsten; Röllig, Mike; Bock, K.
Conference Paper
2014Air-stable, high current density, solution-processable, amorphous organic rectifying diodes (ORDs) for low-cost fabrication of flexible passive low frequency RFID tags
Bose, I.; Tetzner, K.; Borner, K.; Bock, K.
Journal Article
2014Backside Thinning and Stress-Relief Techniques for Thin Silicon Wafers
Landesberger, C.; Paschke, C.; Spöhrle, H.-P.; Bock, K.
Book Article
2014DNA melting curve analysis on semi-transparent thin film microheater on flexible lab-on-foil substrate
Ohlander, A.; Hammerle, T.; Klink, G.; Zilio, C.; Damin, F.; Chiari, M.; Russom, A.; Bock, K.
Conference Paper
2014Foil-based DNA melting curve analysis platform for low-cost point-of-care molecular diagnostics
Ohlander, A.; Bauer, S.; Ramachandraiah, H.; Russom, A.; Bock, K.
Conference Paper
2014High-Accuracy Self-Alignment of Thin Silicon Dies on Plasma-Programmed Surfaces
Landesberger, C.; Hiroshima, M.; Weber, J.; Bock, K.
Book Article
2014Investigations of the fracture strength of thin silicon dies embedded in flexible foil substrates
Palavesam, N.; Landesberger, C.; Bock, K.
Conference Paper
2014Low cost, rigid to flex interposer using a spray coated intrinsically conductive polymer in a roll to-roll process
Bose, I.; Bonfert, D.; Heim, S.; Bock, K.
Conference Paper
2014Microfluidic Detection Module for DNA Analysis Using Integrated Micro Heaters and DNA Microarrays on Plastic Foil
Ohlander, A.; Bauer, S.; Bock, K.; Ramachandraiah, H.; Russom, A.
Conference Paper
2014Multifunctional system integration in flexible substrates
Bock, K.; Yacoub-George, E.; Hell, W.; Drost, A.; Wolf, H.; Bollmann, D.; Landesberger, C.; Klink, G.; Gieser, H.; Kutter, C.
Conference Paper
2014Organic field-effect transistors based on a liquid-crystalline polymeric semiconductor using SU-8 gate dielectrics on flexible substrates
Tetzner, K.; Bose, I.R.; Bock, K.
Journal Article
2014Photonic curing of sol-gel derived HfO2 dielectrics for organic field-effect transistors
Tetzner, K.; Schroder, K.A.; Bock, K.
Journal Article
2014Real-time monitoring of melting curves on DNA microarrays in plastic lab-on-foil system using silicon photomultiplier detectors
Ohlander, A.; Ganka, T.; Binder, T.; Wiest, F.; Russom, A.; Bock, K.
Conference Paper
2014Reliability characterization of blind-hole vias for a system-in-foil
Lorenz, E.; Niemann, N.; Koyuncu, M.; Bock, K.
Conference Paper
2014Simple cost effective and network compatible readout for capacitive and resistive (chemical) sensors
Nastasi, Giuseppe Antonio Maria; Scuderi, Antonino; Endres, Hanns-Erik; Hell, Waltraud; Bock, Karlheinz
Journal Article, Conference Paper
2013"Sensor-filter" - intelligent micro filter system in foil technology
Alberti, M.; Meixner, L.; Rückerl, A.; Eder, M.; Endres, H.-E.; Bock, K.
Journal Article, Conference Paper
2013Broadband interconnect design for silicon-based system-in-package applications up to 170 GHz
Topak, E.; Choi, J.-Y.; Merkle, T.; Koch, S.; Saito, S.; Landesberger, C.; Faul, R.; Bock, K.
Conference Paper
2013Electrical stress on transparent conductive oxide layer
Bonfert, D.; Hemmetzberger, D.; Klink, G.; Bock, K.; Svasta, P.; Ionescu, C.
Conference Paper
2013Genotyping of single nucleotide polymorphisms by melting curve analysis using thin film semi-transparent heaters integrated in a lab-on-foil system
Ohlander, A.; Zilio, C.; Hammerle, T.; Zelenin, S.; Klink, G.; Chiari, M.; Bock, K.; Russom, A.
Journal Article
2013Heterointegration technologies for high frequency modules based on film substrates
Bock, K.; Yacoub-George, E.; Wolf, H.; Landesberger, C.; Klink, G.; Gieser, H.
Conference Paper
2013Performance spread reduction in organic field-effect transistors using semiconducting liquid-crystal polymers
Tetzner, K.; Duffy, W.; Bock, K.
Journal Article
2013A robustness study on self-alignment of thin-si dies using surface tension
Hiroshima, M.; Arita, K.; Haji, H.; Landesberger, C.; Bock, K.
Journal Article
2013Sensing properties of carbon nanotube based thick film layers on foils
Bonfert, D.; Hemmetzberger, D.; Klink, G.; Bock, K.; Svasta, P.; Ionescu, C.
Conference Paper
2012"Sensor-filter" - intelligent micro filter system in foil technology
Alberti, Martin; Meixner, Leonhard; Rückerl, Andres; Eder, Maximilian; Endres, Hanns-Erik; Bock, Karlheinz
Journal Article, Conference Paper
2012Ageing behavior of printed flexible resistors by thermal, mechanical and electrical stresses
Bonfert, D.; Hemmetzberger, D.; Klink, G.; Bock, K.
Conference Paper
2012Electrical stress on intrinsically conductive polymer layer
Bonfert, D.; Hemmetzberger, D.; Klink, G.; Bock, K.; Svasta, P.; Ionescu, C.
Conference Paper
2012Experimental method for low-temperature sintering of nano-Ag inks using electrical excitation
Urbanski, K.J.; Falat, T.; Felba, J.; Moscicki, A.; Smolarek, A.; Bonfert, D.; Bock, K.
Conference Paper
2012Flexible sensors for an indoor air quality sensor system
Endres, Hanns-Erik; Rose, Klaus; Scherbaum, Katja; Faul, Robert; Hell, Waltraud; Bock, Karlheinz
Conference Paper
2012Plasma dicing enables high accuracy self-alignment of thin silicon dies for 3D-device-integration
Landesberger, C.; Scherbaum, S.; Weber, J.; Bock, K.; Hiroshima, M.; Oberhofer, B.
Conference Paper
2012Temporary bonding: Electrostatic
Landesberger, C.; Klumpp, A.; Bock, K.
Book Article
2012Vor-Ort-Diagnostik
Bock, K.
Journal Article
2011Electrical stress on film resistive structures on different substrates
Bonfert, D.; Klink, G.; Bock, K.; Svasta, P.; Ionescu, C.
Conference Paper
2011Electrical stress on thin film TaN resistive structures
Bonfert, D.; Gieser, H.; Bock, K.; Svasta, P.; Ionescu, C.
Conference Paper
2011Influence of wafer grinding and etching techniques on the fracture strength of thin silicon substrates
Landesberger, C.; Paschke, C.; Bock, K.
Conference Paper
2011Large area multilayer foil assembly for flexible electronic systems
Yacoub-George, E.; Ohlander, A.; Meixner, L.; Bollmann, D.; Faul, R.; Landesberger, C.; Bock, K.
Conference Paper
2011Modular solid state technologies for a multi-functional system integration
Bock, K.
Conference Paper
2011Polymer opto-electronic-fluidic detection module on plastic film substrates
Ohlander, A.; Burghart, M.; Strohhöfer, C.; Bollmann, D.; Landesberger, C.; Klink, G.; Bock, K.
Conference Paper
2011Roll-to-roll hot embossing of microstructures
Velten, T.; Bauerfeld, F.; Schuck, H.; Scherbaum, S.; Landesberger, C.; Bock, K.
Conference Paper
2010Assembly of a polymer lab-on-chip device for impedimetric measurements of D-dimers in whole blood
Ohlander, A.; Strohhöfer, C.; Bock, K.; Scot, S.M.; Ali, Z.; Musil, P.; Kyselovic, J.
Conference Paper
2010Development of pH-sensitive indicator dyes for the preparation of micro-patterned optical sensor layers
Trupp, S.; Alberti, M.; Carofiglio, T.; Lubian, E.; Lehmann, H.; Heuermann, R.; Yacoub-George, E.; Bock, K.; Mohr, G.J.
Journal Article
2010Electrical stress on film resistive structures on flexible substrates
Bonfert, D.; Klink, G.; Gieser, H.; Bock, K.; Svasta, P.; Ionescu, C.
Conference Paper
2010Influence of nano silver filler content on properties of ink-jet printed structures for microelectronics
Falat, T.; Felba, J.; Moscicki, A.; Smolarek, A.; Bock, K.; Bonfert, D.
Conference Paper
2010Mikrofluidikmodul und Verfahren zur Herstellung desselben
Ohlander, A.; Bock, K.; Klink, G.; Strohhöfer, C.; Burghart, M.
Patent
2010Mobile electrostatic carrier (MEC) evaluation for a GaAs wafer backside manufacturing process
Stieglauer, H.; Nösser, J.; Miller, A.; Lanz, M.; Öttlin, D.; Jonsson, G.; Behammer, D.; Landesberger, C.; Spöhrle, H.-P.; Bock, K.
Conference Paper
2010Optical sensor layers for amines and pH compatible with reel to reel fabrication technologies
Mohr, G.J.; Trupp, S.; Alberti, M.; Yacoub-George, E.; Bock, K.
Conference Paper
2010Polymer electronics towards system integration
Bonfert, D.; Klink, G.; Bock, K.
Conference Paper
2010Pulsed stress behavior of platinum thin films
Bonfert, D.; Gieser, H.; Bock, K.; Svasta, P.; Ionescu, C.
Conference Paper
2010Rapid prototyping of electronic modules combining aerosol printing and ink jet printing
Gieser, H.A.; Bonfert, D.; Hengelmann, H.; Wolf, H.; Bock, K.; Zollmer, V.; Werner, C.; Domann, G.; Bahr, J.; Ndip, I.; Curran, B.; Oehler, F.; Milosiu, H.
Conference Paper
2010Roll-to-roll hot embossing of microstructures
Velten, T.; Bauerfeld, F.; Schuck, H.; Scherbaum, S.; Landesberger, C.; Bock, K.
Conference Paper
2010Self-assembly and self-interconnection of thin RFID devices on plasma-programmed foil substrates
Landesberger, C.; Yacoub-George, E.; Hell, W.; Bock, K.
Conference Paper
2010Substrate handling techniques for thin wafer processing
Landesberger, C.; Scherbaum, S.; Bock, K.
Book Article
2010Ultra-thin wafer fabrication through dicing-by-thinning
Landesberger, C.; Scherbaum, S.; Bock, K.
Book Article
2009Biomolecular self-assembly of micrometer sized silica beads on patterned glass substrates
Alberti, M.; Yacoub-George, E.; Hell, W.; Landesberger, C.; Bock, K.
Journal Article
2009Biosensor for calcium based on a hydrogel optical waveguide with integrated sensor proteins
Förster, T.; Strohhöfer, C.; Bock, K.; Kasak, P.; Danko, M.; Kronekova, Z.; Nedelcev, T.; Krupa, I.; Lacik, I.
Conference Paper
2009Capacitive coupled TLP (CC-TLP) and the correlation with the CDM
Wolf, H.; Gieser, H.; Bock, K.; Duvvury, C.; Jahanzeb, A.; Lin, Y.-Y.
Conference Paper
2009Electrostatic carrier technique for thin wafer processing
Landesberger, C.; Wieland, R.; Ramm, P.; Bock, K.
Journal Article
2009Electrostatic wafer handling for thin wafer processing
Landesberger, C.; Wieland, R.; Klumpp, A.; Ramm, P.; Drost, A.; Schaber, U.; Bonfert, D.; Bock, K.
Conference Paper
2009Elektronische Systemintegration auf Kunststofffolien
Klink, G.; Bock, K.
Journal Article
2009Integration of two classes of organic electronic devices into one system
Liu, J.; Engquist, I.; Berggren, M.; Norberg, P.; Lögdlund, M.; Nordlinder, S.; Sawatdee, A.; Nilsson, D.; Gold, H.; Stadlober, B.; Haase, A.; Kaker, E.; König, M.; Klink, G.; Bock, K.; Blaudeck, T.; Geyer, U.; Baumann, R.
Conference Paper
2009Investigating the ESD robustness of RF circuits and elements by transmission line pulsing
Wolf, H.; Gieser, H.; Bock, K.
Conference Paper
2009Masterstruktur zum Prägen und/oder Bedrucken eines Grundmaterials, Vorrichtung zum kontinuierlichen Prägen und/oder Bedrucken eines Grundmaterials und Verfahren zum Herstellen einer Masterstruktur zum Prägen und/oder Bedrucken eines Grundmaterials
Landesberger, C.; Richter, M.; Bock, K.
Patent
2009Micro-contact printing of OTFT on polymer foils
König, M.; Bock, K.; Klink, G.
Conference Paper
2009Organischer Feldeffekttransistor und Verfahren zur Herstellung desselben
Bock, K.; Tetzner, K.
Patent
2009Properties of conductive microstructures containing nano sized silver particles
Felba, J.; Nitsch, K.; Piasecki, T.; Tesarski, S.; Moscicki, A.; Kinart, A.; Bonfert, D.; Bock, K.
Conference Paper
2009Pulsed behavior of polymer protection devices
Bonfert, D.; Gieser, H.; Bock, K.; Svasta, P.; Ionescu, C.
Conference Paper
2009Pulsed stress behavior of PEDOT:PSS thin films
Bonfert, D.; Klink, G.; Bock, K.; Svasta, P.; Ionescu, C.
Conference Paper
2009study of organic material FETs by combined static and noise measurements
Yong, X.; Minari, T.; Tsukagoshi, K.; Bock, K.; Fadlallah, M.; Ghibaudo, G.; Chroboczek, J.A.
Conference Paper
2008Einrichtungsgegenstand mit einem Mehrschichtsystem zur Bereitstellung einer elektrischen Funktionalitaet
Bock, K.; Schunck, S.
Patent
2008Groflächige Elektronik-Integration
Bock, K.
Conference Paper
2008Heterointegration of Complete Systems Based on Polytronics
Bock, K.; Nissen, N.F.; Müller, J.
Conference Paper
2008Heterointegration technologies for system in a foil
Bock, K.
Conference Paper
2008Micro-fabrication technologies for organic and large area electronics (OLAE) systems integration on foil
Bock, K.
Conference Paper
2008Microfluidics on foil
Velten, T.; Schuck, H.; Richter, M.; Klink, G.; Bock, K.; Malek, C.K.; Roth, S.; Scho, H.; Bolt, P.J.
Journal Article
2008Multi-Funktionale Systemintegration auf Foliensubstraten - Plagiat- und Produktschutz durch Foliensysteme
Bock, K.
Conference Paper
2008Organic and Large Area Electronics (OLAE) Integration
Bock, K.
Conference Paper
2008Organic and Large Area Electronics Systems Hetero-Integration Platform?
Bock, K.
Conference Paper
2008Plastic based system components and technology for (bio-)chemical sensors
Endres, H.-E.; Klink, G.; Bock, K.
Conference Paper
2008Pulsed stress behavior of flexible thick film resistors
Bonfert, D.; Wolf, H.; Gieser, H.; Klink, G.; Bock, K.; Svasta, P.; Ionescu, C.
Conference Paper
2008Reliability of polymer electronics on plastic film
Klink, G.; Strohhöfer, C.; Bock, K.
Conference Paper
2008Selective one-step plasma patterning process for fluidic self-assembly of silicon chips
Bock, K.; Scherbaum, S.; Yacoub-George, E.; Landesberger, C.
Conference Paper
2007Automated 10-channel capillary chip immunodetector for biological agents detection
Yacoub-George, E.; Hell, W.; Meixner, L.; Wenninger, F.; Bock, K.; Lindner, P.; Wolf, H.; Kloth, T.; Feller, K.A.
Journal Article
2007Carrier techniques for thin wafer processing
Landesberger, C.; Scherbaum, S.; Bock, K.
Conference Paper
2007Handling ultra-thin wafers
Landesberger, C.; Scherbaum, S.; Bollmann, D.; Bock, K.
Journal Article
2007Heterointegrationstechnologien für polytronische Systeme
Bock, K.
Conference Paper
2007Investigations of the influence of dicing techniques on the strength properties of thin silicon
Schönfelder, S.; Ebert, M.; Landesberger, C.; Bock, K.; Bagdahn, J.
Journal Article
2007Large area cost-efficient electronics systems integration
Bock, K.; Klink, G.; Strohhöfer, C.; Hemmetzberger, D.; Feil, M.
Conference Paper
2007Roll-to-roll microfabrication of polymer microsystems
Strohhöfer, C.; Klink, G.; Feil, M.; Drost, A.; Bollmann, D.; Hemmetzberger, D.; Bock, K.
Journal Article
2007Roll-to-roll microfabrication of polymer systems
Strohhöfer, C.; Klink, G.; Feil, M.; Drost, A.; Bollmann, D.; Hemmetzberger, D.; Bock, K.
Journal Article
2007Technologies for functional hetero-system integration on foil
Bock, K.; Adler, C.; Bollmann, D.; Klink, G.; Feil, M.; Strohhöfer, C.
Conference Paper
200610-Kanal-Immunosensor zum automatisierten Schnellnachweis von Bakterien, Viren und Toxinen
Yacoub-George, E.; Hell, W.; Meixner, L.; Wenninger, F.; Bock, K.; Lindner, P.; Wolf, H.; Kloth, T.; Feller, K.A.
Conference Paper
2006Condition monitoring using electrochemical sensors
Endres, H.-E.; Bock, K.
Conference Paper
2006Design of complex circuits for OFET-technologies on flexible substrates
Todt, U.; Bunk, G.; Amelung, J.; Vogel, U.; Klink, G.; Bock, K.-H.
Conference Paper
2006Design procedure and mask generation for OFET-technologies on rigid and flexible substrates
Todt, U.; Bunk, G.; Vogel, U.; Amelung, J.; Klink, G.; Bock, K.-H.
Conference Paper
2006An energy-autarkic micro sensor system
Wenninger, F.; Haberger, K.; Bock, K.; Netsch, L.
Conference Paper
2006Handling and processing of thin semiconductor substrates
Landesberger, C.; Bollmann, D.; Drost, A.; Schaber, U.; Bock, K.
Conference Paper
2006Impedanzspektroskopie und multivariate Signalverarbeitung für planare chemische Sensoren
Endres, H.-E.; Bock, K.
Journal Article
2006A new method of flip chip assembly using a light silver filled glue
Feil, M.; König, M.; Bock, K.
Conference Paper
2006Polymer Electronic Circuits Based on Reel-to-Reel Photolithography
Klink, G.; Drost, A.; Hammerl, E.; Hemmetzberger, D.; Strohhöfer, C.; Bock, K.
Conference Paper
2006Polytronik - Elektronik von der Rolle
Bock, K.; Klink, G.; Bannert, M.; Slama, A.
Book Article
2006Therapeutical immunization of EAV-infected horses by DNA-Vaccination
Giese, M.; Liebert, U.G.; Schneider, T.; Bock, K.; Zahn, N.; Uhlig, A.; Schusser, G.F.
Journal Article, Conference Paper
2006Verfahren zum Herstellen einer Leiterstruktur auf einem Substrat
Koenig, M.; Bock, K.
Patent
2005Characterization of electrostatic carrier substrates to be used as a support for thin semiconductor wafers
Bock, K.; Landesberger, C.; Bleier, M.; Bollmann, D.; Hemmetzberger, D.
Conference Paper
2005Condition monitoring with electrochemical sensors
Endres, H.-E.; Bock, K.
Conference Paper
2005Investigations of strength properties of ultra-thin silicon
Schönfelder, S.; Bagdahn, J.; Ebert, M.; Petzold, M.; Bock, K.; Landesberger, C.
Conference Paper
2005Multiparameter Diagnose für humane Antikörper
Neumeier, K.; Bock, K.; Meixner, L.; Pringsheim, E.; Scheithauer, W.; Wackerle, M.; Wenninger, F.; Backert, G.; Reißenweber, D.; Straner, V.; Wolfbeis, O.; Halm, B.; Motz, M.; Pfrepper, K.I.; Lindner, P.; Wolf, H.
Conference Paper
2005Organic electronics - towards a cost-efficient heterointegration platform for multi-functional systems
Bock, K.
Conference Paper
2005Organics Device based Circuit Manufacture In a Cost-Efficient Reel to Reel Process Environment
Bock, K.
Conference Paper
2005Polymer electronics systems - polytronics
Bock, K.
Journal Article
2005Polytronics - Electronics and systems on flexible substrates
Bock, K.
Conference Paper
2005Processing of thin substrates by means of electrostatic carriers
Landesberger, C.; Bollmann, D.; Bock, K.; Drost, A.; Schaber, U.
Conference Paper
2005Reel-to-reel fabrication of integrated circuits based on soluble polymer semiconductor
Klink, G.; Hammerl, E.; Drost, A.; Hemmetzberger, D.; Bock, K.
Conference Paper
2005Studies of fine pitch patterning by reel-to-reel processes for flexible electronic systems
Drost, A.; Klink, G.; Feil, M.; Bock, K.
Conference Paper
2005SYSTEM ZUR FERTIGUNG VON ELEKTRISCHEN UND INTEGRIERTEN SCHALTKREISEN
Koenig, M.; Bock, K.
Patent
2005Thin Wafer Stacking for Infrared Sensor Applications
Scherbaum, S.; Simon, T.; Ziegler, J.; Bock, K.
Conference Paper
2005Verfahren und Vorrichtung zum Herstellen eines Systems mit einer an einer vorbestimmten Stelle einer Oberflaeche eines Substrats aufgebrachten Komponente
Bock, K.
Patent
2004The challenge of ultra thin chip assembly
Feil, M.; Adler, C.; Hemmetzberger, D.; König, M.; Bock, K.
Conference Paper
2004Polytronic systems fabricated in roll-to-roll
Bock, K.
Conference Paper
2004Polytronics: Technology trends and environmental issues
Bock, K.; Burghart, M.; Klink, G.; Pötter, H.; Müller, J.; Hagelüken, M.
Conference Paper
2004Trends in RF & Wireless Packaging
Bock, K.; Wolf, J.; Reichl, H.
Conference Paper
2003Concepts for production of low cost microsystems using reel to reel processes
Feil, M.; Bock, K.; Endres, H.-E.; Richter, M.
Conference Paper
2003Evaluation of reel-to-reel processes for polymer electronics
Burghart, M.; Liemann, G.; Klink, G.; Bock, K.
Conference Paper
2003New manufacturing concepts for ultra-thin silicon and gallium arsenide substrates
Bock, K.; Bleier, M.; Köthe, O.; Landesberger, C.
Conference Paper
2003Polymer und Elektronik: Polytronic
Bock, K.
Journal Article
2003Polymerelektronik - Ziele und Entwicklungen
Klink, G.; Burghart, M.; Bock, K.
Journal Article
2003Verbundvorrichtung und Verfahren zur Herstellung derselben
Bock, K.; Koenig, M.
Patent
2002Packaging for MEMS devices - Stumbling block or enabling solution?
Jung, E.; Wiemer, M.; Grosser, V.; Bock, K.; Wolf, J.
Journal Article, Conference Paper
2002Packaging technologies for flexible systems
Kallmayer, C.; Bock, K.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1999Investigation into socketed CDM (SDM) tester parasitics
Chaine, M.; Verhaege, K.; Avery, L.; Kelly, M.; Gieser, H.; Bock, K.; Henry, L.G.; Meuse, T.; Brodbeck, T.; Barth, J.
Journal Article