Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2014On the crack and delamination risk optimization of a Si-interposer for LED packaging
Auersperg, J.; Dudek, R.; Jordan, R.; Bochow-Neß, O.; Rzepka, S.; Michel, B.
Journal Article, Conference Paper
2013Comparison of acoustic sensor systems for quality analysis of asparagus using scanning laser vibrometry for visualization
Foerster, J.; Truppel, I.; Bochow-Ness, O.; Geyer, M.
Journal Article
2013On the crack and delamination risk optimization of a Si-interposer for LED packaging
Auersperg, J.; Dudek, R.; Jordan, R.; Bochow-Neß, O.; Rzepka, S.; Michel, B.
Conference Paper
2013Trends in der Systemintegration
Lang, Klaus-Dieter; Pötter, Harald; Bochow-Neß, Olaf; Becker, Karl-Friedrich; Wolf, M. Jürgen
Journal Article
2012Combined reliability testing: An approach to assure reliability under complex loading conditions
Wittler, O.; Jaeschke, J.; Bochow-Ness, O.; Middendorf, A.; Lang, K.-D.
Conference Paper
2012Investigation of pulse overload-behavior of a high-current connector with transient-thermo-electric FEM simulation
Bochow-Ness, O.; Grams, A.; Hoene, E.; Huber, S.; Lang, K.-D.; Potter, H.; Prewitz, T.; Wittier, O.; Wust, F.
Conference Paper
2012Transfer molding technology for smart power electronics modules - materials and processes
Becker, K.-F.; Joklitschke, D.; Braun, T.; Koch, M.; Schreier-Alt, T.; Bader, V.; Bauer, J.; Nowak, T.; Aschenbrenner, R.; Schneider-Ramelow, M.; Thomas, T.; Bochow-Ness, O.; Lang, K.-D.
Conference Paper
2012Transfer molding technology for smart power electronics modules: Materials and processes
Becker, K.-F.; Joklitschke, D.; Braun, T.; Koch, M.; Thomas, T.; Schreier-Alt, T.; Bader, V.; Bauer, J.; Nowak, T.; Bochow-Ness, O.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.
Journal Article
2010Modeling and Optimization of Energy Harvesting Systems with Regard to Availability of Power Supply and Minimization of Environmental Impacts
Benecke, S.; Middendorf, A.; Wüst, F.; Bochow-Neß, O.; Nissen, N.F.
Abstract
2009Sensitivity Analysis of Technological Fabrication Tolerances on the Lifetime of Flip-Chip Solder Joints
Eckert, T.; Kornelius, T.; Bochow-Ness, O.; Müller, W.H.; Reichl, H.
Conference Paper
2008Condition indicators for reliability monitoring of microsystems
Eckert, T.; Bochow-Ness, O.; Middendorf, A.; Tetzner, K.; Reichl, H.
Conference Paper
2008Condition monitoring of microsystems supporting sustainability
Bochow-Neß, O.; Eckert, T.; Nissen, N.F.; Jaeschke, J.; Middendorf, A.; Reichl, H.
Conference Paper
2008Sustainability by Using Used Assemblies in Automotive Electronics
Mente, T.; Schuch, B.; Ernst, C.; Schuster, A.; Böckhorst, S.; Friedrichs, L.; Halser, K.; Bochow-Neß, O.; Middendorf, A.
Conference Paper
2007Condition Indicators for Reliability Monitoring of Microsystems
Bochow-Ness, O.; Eckert, T.; Fujino, M.; Middendorf, A.; Reichl, H.
Conference Paper
2006Electronic systems from the perspective of sustainability and reliability
Oberender, C.; Middendorf, A.; Bochow-Neß, O.; Griese, H.-J.; Reichl, H.
Conference Paper