Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2010Carrierless design for handling and processing of ultrathin wafers
Bieck, F.; Spiller, S.; Molina, F.; Töpper, M.; Lopper, C.; Kuna, I.; Seng, T.C.; Tabuchi, T.
Conference Paper
2010Integration of carrierless ultrathin wafers into a TSV process flow
Bieck, F.; Spiller, S.; Molina, F.; Töpper, M.; Lopper, C.; Kuna, I.; Fischer, T.; Röder, J.; Dietrich, L.; Tabuchi, T.
Conference Paper
2010Tapered through-silicon-via interconnects for wafer-level packaging of sensor devices
Leib, J.; Bieck, F.; Hansen, U.; Looi, K.-K.; Ngo, H.-D.; Seidemann, V.; Shariff, D.; Studzinski, D.; Suthiwongsunthorn, N.; Tan, K.; Wilke, R.; Yam, K.-L.; Töpper, M.
Journal Article