Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Characterization of low temperature Cu/In bonding for fine-pitch interconnects in three-dimensional integration
Panchenko, I.; Bickel, S.; Meyer, J.; Mueller, M.; Wolf, J.M.
Journal Article, Conference Paper
2018Cu-In Fine-Pitch-Interconnects with Enhanced Shear Strength
Bickel, S.; Höhne, R.; Panchenko, I.; Meyer, J.; Wolf, M.J.
Conference Paper
2017Accelerated SLID bonding for fine-pitch interconnects with porous microstructure
Meyer, J.; Panchenko, I.; Wambera, L.; Bickel, S.; Wahrmund, W.; Wolf, M.J.
Conference Paper
2017Cu-In-microbumps for low-temperature bonding of fine-pitch-interconnects
Bickel, S.; Panchenko, I.; Wahrmund, W.; Neumann, V.; Meyer, J.; Wolf, M.J.
Conference Paper
2017Low temperature Cu/In bonding for 3D integration
Panchenko, I.; Bickel, S.; Meyer, J.; Müller, M.; Wolf, J.M.
Conference Paper
2004LWA 2004, Lernen - Wissensentdeckung - Adaptivität. Workshopwoche der GI-Fachgruppen/Arbeitskreise
: Abecker, A.; Bickel, S.; Brefeld, U.; Drost, I.; Henze, N.; Herden, O.; Minor, M.; Scheffer, T.; Stojanovic, L.; Weibelzahl, S.
Conference Proceedings