Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. | | |
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| 2015 | Failure analysis strategies for multistacked memory devices with TSV interconnects
Altmann, F.; Grosse, C.; Naumann, F.; Beyersdorfer, J.; Veches, T. | Conference Paper |
| 2013 | Sample preparation strategies for fast and effective failure analysis of 3D devices
Kwakman, L.; Straw, M.; Coustillier, G.; Sentis, M.; Beyersdorfer, J.; Schischka, J.; Naumann, F.; Altmann, F. | Conference Paper |
| 2012 | Cross section analysis of Cu filled TSVs based on high throughput plasma-FIB milling
Altmann, F.; Beyersdorfer, J.; Schischka, J.; Krause, M.; Franz, G.; Kwakman, L. | Conference Paper |
| 2012 | Enhanced failure analysis on open TSV interconnects
Altmann, F.; Schmidt, C.; Beyersdorfer, J.; Simon-Najasek, M.; Große, C.; Schrank, F.; Kraft, J. | Conference Paper |
| 2012 | Low temperature fusion wafer bonding quality investigation for failure mode analysis
Dragoi, V.; Czurratis, P.; Brand, S.; Beyersdorfer, J.; Patzig, C.; Krugers, J.; Schrank, F.; Siegert, J.; Petzold, M. | Conference Paper, Journal Article |