Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2015Failure analysis strategies for multistacked memory devices with TSV interconnects
Altmann, F.; Grosse, C.; Naumann, F.; Beyersdorfer, J.; Veches, T.
Conference Paper
2013Sample preparation strategies for fast and effective failure analysis of 3D devices
Kwakman, L.; Straw, M.; Coustillier, G.; Sentis, M.; Beyersdorfer, J.; Schischka, J.; Naumann, F.; Altmann, F.
Conference Paper
2012Cross section analysis of Cu filled TSVs based on high throughput plasma-FIB milling
Altmann, F.; Beyersdorfer, J.; Schischka, J.; Krause, M.; Franz, G.; Kwakman, L.
Conference Paper
2012Enhanced failure analysis on open TSV interconnects
Altmann, F.; Schmidt, C.; Beyersdorfer, J.; Simon-Najasek, M.; Große, C.; Schrank, F.; Kraft, J.
Conference Paper
2012Low temperature fusion wafer bonding quality investigation for failure mode analysis
Dragoi, V.; Czurratis, P.; Brand, S.; Beyersdorfer, J.; Patzig, C.; Krugers, J.; Schrank, F.; Siegert, J.; Petzold, M.
Conference Paper, Journal Article