Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2015Fügeverfahren, Material- oder Phasentransformationsverfahren, Sicherungsverfahren, Fügemittel und Sicherheitssystem unter Verwendung reaktiver Materialsysteme
Bräuer, Jörg; Besser, Jan; Roscher, Frank; Seifert, Tobias; Wiemer, Maik
Patent
2015Subwavelength Grating Reflectors for Fabrication Cost Reduction of Fabry-Perot Infrared Filters
Rupprecht, J.; Kurth, S.; Hiller, K.; Seifert, M.; Besser, J.; Meinig, M.; Ebermann, M.; Neumann, N.; Gessner, T.
Conference Paper, Journal Article
2014Fügen mit iRMS: Eine neue Raumtemperatur - Aufbau- und Verbindungstechnik in der Informationstechnik
Bräuer, J.; Besser, J.; Schneider, W.; Wiemer, M.; Gessner, T.
Conference Paper
2014Functional nano patterns realized by aligned nano imprint lithography
Baum, M.; Besser, J.; Wiemer, M.; Thanner, C.; Kreindl, G.; Wimplinger, M.; Gessner, T.
Conference Paper
2014Investigation of reactive and nano scale material systems for room-temperature reactive wafer bonding
Bräuer, J.; Besser, J.; Wiemer, M.; Gessner, T.
Book Article
2014Reactive bonding with integrated reactive and nano scale energetic material systems (iRMS): State-of-the-art and future development trends
Braeuer, J.; Besser, J.; Hertel, S.; Masser, R.; Schneider, W.; Wiemer, M.; Gessner, T.
Conference Paper
2014Subwavelength grating reflectors in MEMS tunable Fabry-Perot infrared filters with large aperture
Kurth, S.; Hiller, K.; Meinig, M.; Besser, J.; Seifert, M.; Ebermann, M.; Neumann, N.; Schlachter, F.; Gessner, T.
Conference Paper
2014Wafer bonding technologies for 3D integration
Baum, M.; Hofmann, C.; Besser, J.; Vogel, K.; Wiemer, M.; Gessner, T.
Conference Paper
2013Biocompatibility evaluation of MEMS packaging materials for implantable devices
Baum, M.; Haubold, M.; Besser, J.; Wiemer, M.; Gessner, T.
Journal Article, Conference Paper
2013Fabrication of subwavelength holes using nanoimprint lithography
Weiss, A.; Besser, J.; Baum, M.; Saupe, R.; Otto, T.; Gessner, T.
Conference Paper
2012Integrated nano scale multilayer systems for reactive bonding in microsystems technology
Braeuer, J.; Besser, J.; Wiemer, M.; Gessner, T.
Conference Paper
2012Investigation of different nano scale energetic material systems for reactive wafer bonding
Braeuer, J.; Besser, J.; Tomoscheit, E.; Klimm, D.; Anbumani, S.; Wiemer, M.; Gessner, T.
Conference Paper
2012Laser micromachining and micro hot embossing for highly integrated lab-on-chip systems
Enderlein, T.; Baum, M.; Nestler, J.; Otto, T.; Besser, J.; Wiemer, M.; John, B.; Hänel, J.; Gessner, T.
Conference Paper
2012Micro hot embossing and micro laser welding technologies for fluidic applications
Baum, M.; Besser, J.; John, B.; Keiper, B.; Hänel, J.; Wiemer, M.; Gessner, T.
Conference Paper
2012Novel nano-scale energetic systems for low-temperature and stress-free joining of dissimilar materials
Bräuer, J.; Besser, J.; Wiemer, M.; Gessner, T.
Conference Paper
2012A novel technique for MEMS packaging: Reactive bonding with integrated material systems
Braeuer, J.; Besser, J.; Wiemer, M.; Gessner, T.
Journal Article, Conference Paper
2012Thermal and UV nanoimprint lithography for applications from the micro to the nano scale
Besser, J.; Baum, M.; Wiemer, M.; Gessner, T.; Sanchez-Ordonez,S.; Thanner, C.; Vetter, C.
Conference Paper
2012Using of Different Nano Scale Energetic Material Systems for Reactive Bonding
Braeuer, J.; Besser, J.; Wiemer, M.; Gessner, T.
Abstract
20113D Integration for MEMS devices using photosenitive glass
Wuensch, D.; Hofmann,Ch.; Besser, J.; Schubert, I.; Gottfried, K.; Wiemer, M.; Gessner, T.
Conference Paper
2011Developement trends in the field of wafer bonding technologies
Wiemer, M.; Braeuer, J.; Besser, J.; Wuensch, D.
Conference Paper
2011Elektrochemische Abscheidung von Pd/Zn-Multilagen für das Fügen mit reaktiven Materialsystemen
Besser, J.; Bräuer, J.; Wiemer, M.; Geßner, T.
Conference Paper
2011Nano patterned surfaces and their influence on living cells
Baum, M.; Besser, J.; Vetter, C.; Sanchez Ordonez, S.; Wang, X.; Harazim, S.; Schmidt, O.; Wiemer, M.; Gessner, T.
Conference Paper, Journal Article
2011Nano scale AL/PD multilayer systems for reactive bonding in microsystems technology
Braeuer, J.; Besser, J.; Wiemer, M.; Gessner, T.
Abstract
2011Room-temperature reactive bonding by using nano scale multilayer systems
Braeuer, J.; Besser, J.; Wiemer, M.; Gessner, T.
Conference Paper
2011Room-temperature reactive bonding: An overview of integrated nano scale multilayer systems
Braeuer, J.; Besser, J.; Wiemer, M.; Gessner, T.
Conference Paper
2009Trends in 3D Integration of MEMS and Electronics
Wiemer, M.; Braeuer, J.; Besser, J.; Gessner, T.
Conference Paper
1998Mögliche Ausprägungen der Kooperation in Forschung und Entwicklung
Besser, J.; Niemeier, J.
Book Article
1998Die Situation bei Informationsflüssen und Schnittstellen
Just, H.-J.; Besser, J.; Niemeier, J.
Book Article
1998Die Umsetzung eines verbesserten Informations- und Steuerungskonzeptes
Just, H.-J.; Besser, J.; Niemeier, J.
Book Article
1996Information - die Basis zur Produktentwicklung
Niemeier, J.; Kleinsorge, P.; Besser, J.; Just, H.-J.
Book Article