Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Digital Holographic Microscopy for 200 € Using Open-Source Hard- and Software
Beckmann, Tobias; Fratz, Markus; Schiller, Annelie; Bertz, Alexander; Carl, Daniel
Conference Paper
2019GPU-based digital image correlation system for real-time strain-controlled fatigue and strain field measurement
Blug, Andreas; Regina, David Joel; Eckmann, Stefan; Senn, Melanie; Eberl, Chris; Bertz, Alexander; Carl, Daniel
Conference Paper
2019Industrial applications of digital holography
Fratz, Markus; Beckmann, Tobias; Anders, Joachim; Bertz, Alexander; Bayer, Markus; Gießler, Thomas; Carl, Daniel
Conference Paper
2019Motion compensation for interferometric off-center measurements of rotating objects with varying radii
Schiller, Annelie; Beckmann, Tobias; Fratz, Markus; Bertz, Alexander; Carl, Daniel; Buse, Karsten
Journal Article
2019Multiwavelength digital holography in the presence of vibrations: Laterally resolved multi-step phase-shift extraction
Seyler, Tobias; Bienkowski, Lasse; Beckmann, Tobias; Fratz, Markus; Bertz, Alexander; Carl, Daniel
Conference Paper
2019Multiwavelength Holography: Height Measurements Despite Axial Motion of Several Wavelengths During Exposure
Schiller, Annelie; Beckmann, Tobias; Fratz, Markus; Bertz, Alexander; Carl, Daniel; Buse, Karsten
Conference Paper
2019Real-Time GPU-Based Digital Image Correlation Sensor for Marker-Free Strain-Controlled Fatigue Testing
Blug, Andreas; Regina, David Joel; Eckmann, Stefan; Senn, Melanie; Bertz, Alexander; Carl, Daniel; Eberl, Chris
Journal Article
2018Extending the depth of field beyond geometrical imaging limitations using phase noise as a focus measure in multiwavelength digital holography
Seyler, Tobias; Fratz, Markus; Beckmann, Tobias; Schiller, Annelie; Bertz, Alexander; Carl, Daniel
Journal Article
2018Extensive microstructural quality control inside a machine tool using multiwavelength digital holography
Seyler, Tobias; Fratz, Markus; Beckmann, Tobias; Bertz, Alexander; Carl, Daniel; Grün, Viktor; Börret, Rainer; Ströer, Felix; Seewig, Jörg
Conference Paper
2018Multiwavelength digital holography: Height measurements on linearly moving and rotating objects
Schiller, Annelie; Beckmann, Tobias; Fratz, Markus; Bertz, Alexander; Carl, Daniel; Buse, Karsten
Conference Paper
2018Vorrichtung zur Partikelanalyse
Beckmann, Tobias; Bertz, Alexander; Carl, Daniel; Jetter, Volker; Schütz, Jan
Patent
2017Digital holography on moving objects
Schiller, Annelie; Beckmann, Tobias; Fratz, Markus; Belzer, Dominik; Bertz, Alexander; Carl, Daniel; Buse, Karsten
Journal Article
2017Digital holography on moving objects. Multiwavelength height measurements on inclined surfaces
Schiller, Annelie; Beckmann, Tobias; Fratz, Markus; Belzer, Dominik; Bertz, Alexander; Carl, Daniel; Buse, Karsten
Conference Paper
2017Digital holography: Evolution from a research topic to a versatile tool for the inline 100% 3D quality control in industry
Fratz, Markus; Beckmann, Tobias; Schiller, Annelie; Seyler, Tobias; Bertz, Alexander; Carl, Daniel; Buse, Karsten
Conference Paper
2017Inline-Oberflächenprüfung von Bahnware
Blug, Andreas; Saum, Norbert; Bertz, Alexander; Hofmann, Andreas
Book Article
2017Marker-free GPU-based digital image correlation system for high-temperature strain-controlled fatigue measurements
Blug, Andreas; Regina, David Joel; Eckmann, Stefan; Senn, M.; Eberl, Christoph; Bertz, Alexander; Carl, Daniel
Presentation
2017Miniaturized multiwavelength digital holography sensor for extensive in-machine tool measurement
Seyler, Tobias; Fratz, Markus; Beckmann, Tobias; Bertz, Alexander; Carl, Daniel
Conference Paper
2016Geprüfte Oberflächen. Sub-µm Inline-3D-Oberflächenprüfung im Sekundentakt
Fratz, Markus; Beckmann, Tobias; Bertz, Alexander; Carl, Daniel
Journal Article
2016Multiwavelength digital holography with spatial phase shifting on moving objects
Schiller, Annelie F.; Beckmann, Tobias; Fratz, Markus; Belzer, Dominik; Bertz, Alexander; Carl, Daniel; Buse, Karsten
Conference Paper
2016Oberfläche so einzigartig wie der Fingerabdruck
Saum, Norbert; Förste, Alexander; Bertz, Alexander; Hofmann, Andreas; Carl, Daniel
Journal Article
2015Micro welding of aluminum for post process electrode gap reduction using femtosecond laser
Meinecke, C.; Mueller, M.; Rennau, M.; Bertz, A.; Ebert, R.; Reuter, D.; Exner, H.; Gessner, T.
Conference Paper
2015Technologieentwicklung einer post-process Elektrodenspaltverringerung zur Herstellung von hochauflösenden Sensorsystemen
Meinecke, C.; Mueller, M.; Rennau, M.; Reuter, D.; Ebert, R.; Bertz, A.; Exner, H.; Gessner, T.
Conference Paper
2014AIM technology and devices - from basic research to industrial proven MEMS platform
Bertz, A.; Reuter, D.; Nowack, M.
Book Article
2014High-speed deformation measurement using spatially phase-shifted speckle interferometry
Beckmann, Tobias; Fratz, Markus; Bertz, Alexander; Carl, Daniel
Conference Paper
2014Integration von MOS-Transistoren als Wandler für mechanische Spannungen
Schramm, M.; Haas, S.; Reuter, D.; Loebel, K.-U.; Heinz, S.; Bertz, A.; Horstmann, J.T.; Gessner, T.
Abstract
2014Technologieentwicklung, Herstellung und Charakterisierung von hochauflösenden Inertialsystemen
Meinecke, C.; Bertz, A.; Dittrich, C.; Schunke, S.; Kreutziger, P.; Gessner, T.
Conference Paper
2013Analysis of metal-metal contacts in RF MEMS switches
Kurth, S.; Voigt, S.; Haas, S.; Bertz, A.; Kaufmann, C.; Gessner, T.; Akiba, A.; Ikeda, K.
Conference Paper
2013Direct integration of field effect transistors as electro mechanical transducer for stress
Haas, S.; Reuter, D.; Bertz, A.; Gessner, T.; Schramm, M.; Loebel, K.-U.; Horstmann, J.T.
Conference Paper
2013Highly Reliable and Low Voltage Actuated Ohmic RF MEMS Switch with Wafer Level Packaging
Kurth, S.; Nowack, M.; Voigt, S.; Bertz, A.; Froemel, J.; Kaufmann, C.; Gessner, T.; Akiba, A.; Ikeda, K.
Book Article
2013Studies on the piezoresistive effect in MOS transistors for use in integrated MEMS sensors
Haas, S.; Schramm, M.; Loebel, K.-U.; Heinz, S.; Reuter, D.; Bertz, A.; Horstmann, J.T.; Gessner, T.
Conference Paper
2013Technologieentwicklung für optimiertes MEMS Packaging durch Si-TSV-Rückseitenkontaktierung
Meinecke, C.; Hofmann, L.; Bertz, A.; Gottfried, K.; Gessner, T.
Conference Paper
2013Verfahren zur Fixierung einer beweglichen Komponente eines mikromechanischen Bauelementes
Bertz, Andreas; Schulz, Stefan
Patent
2012Micro arc welding for electrode gap reduction of high aspect ratio microstructures
Nowack, M.; Leidich, S.; Reuter, D.; Kurth, S.; Kuechler, M.; Bertz, A.; Gessner, T.
Journal Article, Conference Paper
2012Out of plane capacitive transducer in air gap insulation microstructures technology for high precision monolithic 3-axis sensors
Reuter, D.; Nowack, M.; Shaporin, A.; Rockstroh, J.; Haas, S.; Bertz, A.; Mehner, J.; Gessner, T.
Conference Paper
2012Thermal nanoimprint resist for the fabrication of high-aspect-ratio patterns
Messerschmidt, M.; Schleunitz, A.; Spreu, C.; Werner, T.; Vogler, M.; Reuther, F.; Bertz, A.; Schift, H.; Grüzner, G.
Journal Article
2012Untersuchungen zum piezoresistiven Effekt in MOS-Transistoren für die Anwendung in integrierten MEMS-Sensoren
Haas, S.; Schramm, M.; Heinz, S.; Loebel, K.-U.; Reuter, D.; Bertz, A.; Gessner, T.; Horstmann, J.T.
Conference Paper
2011Autarkes Sensornetzwerk zur Überwachung von Hochspannungsleitungen
Voigt, S.; Nowack, M.; Bertz, A.; Leidich, S.; Meinig, M.; Kurth, S.; Gessner, T.; Grosser, V.; Braunschweig, M.; Krumm, R.
Conference Paper
2011HF-MEMS Schalter mit ohmschen Kontakt und lateraler Bewegungsrichtung
Leidich, S.; Kurth, S.; Nowack, M.; Bertz, A.; Froemel, J.; Kaufmann, C.; Gessner, T.
Conference Paper
2011Kapazitiver MEMS-Mischer und Signalfilter für wake up receiver
Kurth, S.; Voigt, S.; Leidich, S.; Nowack, M.; Bertz, A.; Gessner, T.
Conference Paper
2011Lokales Mikroschweißen als post-process Technologie zur permanenten Reduzierung des Elektrodenabstandes von HARMS
Nowack, M.; Leidich, S.; Reuter, D.; Kurth, S.; Kuechler, M.; Bertz, A.; Gessner, T.
Conference Paper
2011Novel post-process gap reduction technology of high aspect ratio microstructures utilizing micro welding
Nowack, M.; Leidich, S.; Reuter, D.; Kurth, S.; Kuchler, M.; Bertz, A.; Gessner, T.
Conference Paper
2011Reliability enhancement of Ohmic RF MEMS switches
Kurth, S.; Leidich, S.; Bertz, A.; Nowack, M.; Frömel, J.; Kaufmann, C.; Faust, W.; Gessner, T.; Akiba, A.; Ikeda, K.
Conference Paper
2010Challenges of smart system integration
Gessner, T.; Vogel, M.; Hiller, K.; Otto, T.; Bertz, A.; Billep, D.
Conference Paper
2010A fast and low actuation voltage MEMS switch for mm-wave and its integration
Akiba, A.; Mitarai, S.; Morita, S.; Ikeda, I.; Kurth, S.; Leidich, S.; Bertz, A.; Nowack, M.; Froemel, J.; Gessner, T.
Conference Paper
2010Fortschritte in der Anwendung des tiefen Siliziumätzens (DRIE).
Kuechler, M.; Hofmann, L.; Hahn, R.; Bertz, A.; Gessner, T.
Conference Paper
2010A novel three-axis AIM vibration sensor for high accuracy condition monitoring
Nowack, M.; Reuter, D.; Bertz, A.; Kuechler, M.; Aurich, T.; Dittrich, C.; Gessner, T.
Conference Paper
2010Smart Integrated Systems - Developments of Fraunhofer ENAS
Vogel, M.; Hiller, K.; Bertz, A.; Wiemer, M.; Gessner, T.
Book Article
2009Hermetic thin film encapsulation of mechanical transducers for smart label applications
Reuter, D.; Nowack, M.; Rennau, M.; Bertz, A.; Wiemer, M.; Kriebel, F.; Gessner, T.
Conference Paper
2009Integration of inertial MEMS sensors in active smart RFID labels for transport monitoring
Reuter, D.; Nowack, M.; Bertz, A.; Wiemer, M.; Semar, R.; Kriebel, F.; Hopp, K.-F.; Dittrich, S.; Thieme, T.
Conference Paper
2009Integration von MEMS-Inertialsensoren in Smart RFID Label zur Transportüberwachung empfindlicher Güter
Nowack, M.; Reuter, D.; Bertz, A.; Gessner, T.
Conference Paper
2009Plasmagestütztes Hochrateätzen von Silikatgläsern mit variablem Ätzprofil
Bertz, A.; Fendler, R.; Schuberth, R.; Werner, T.; Gessner, T.
Conference Paper
2009Smart systems integration by using micro and nano technologies
Gessner, T.; Wiemer, M.; Bertz, A.; Vogel, M.
Journal Article
2009Technologies and MEMS sensor solutions for smart integrated systems
Hiller, K.; Kurth, S.; Bertz, A.; Gessner, T.
Journal Article
2008Thin film encapsulation technology for harms using sacrificial CF-polymer
Reuter, D.; Bertz, A.; Nowack, A.; Gessner, T.
Conference Paper, Journal Article
2007Mikromechanische Schaltervorrichtung mit mechanischer Kraftverstärkung
Frömel, J.; Voigt, S.; Kurth, S.; Leidich, S.; Bertz, A.; Kaufmann, C.; Gessner, T.
Patent
2007Neue Technologie in der Herstellung - neue Chance am Markt
Thieme, T.; Bertz, A.; Gessner, T.; Dittrich, C.
Conference Paper
2007A new method for high-rate deep dry etching of silicate glass with variable ETCH profile
Bertz, A.; Fendler, R.; Schuberth, R.; Hentsch, W.; Gessner, T.
Conference Paper
2007Thin Film Encapsulation of High Aspect Ratio Microstructures using sacrificial CF-Polymer
Reuter, D.; Bertz, A.; Gessner, T.
Conference Paper
2007Thin Film Encapsulation of Microstructures using sacrificial CF-Polymer
Reuter, D.; Bertz, A.; Werner, T.; Nowack, M.; Gessner, T.
Conference Paper
2007Wafer-Level Active Testing of Capacitive Inertial Sensors
Nowack, M.; Reuter, D.; Rennau, M.; Bertz, A.; Gessner, T.
Conference Paper
2006In-process gap reduction of capacitive transducers
Reuter, D.; Bertz, A.; Billep, D.; Scheibner, D.; Dötzel, W.; Gessner, T.
Journal Article
2005Efficient and flexible high aspect ratio micromachining for the fabrication of low-g-sensors
Bertz, A.; Lohmann, C.; Reuter, D.; Geßner, T.
Abstract
2005Flexible Herstellung und Charakterisierung von Inertialsensoren basierend auf der AIM-Technologie
Lohmann, C.; Bertz, A.; Reuter, D.; Küchler, M.; Geßner, T.
Conference Paper
2005In-process gap reduction of capacitive transducers
Reuter, D.; Bertz, A.; Billep, D.; Scheibner, D.; Buschnakowski, S.; Doetzel, W.; Gessner, T.
Conference Paper
2005Selective adhesive bonding with SU-8 for zero-level-packaging
Reuter, D.; Bertz, A.; Schwenzer, G.; Gessner, T.
Conference Paper
2005Validierung der AIM Technologie: Darstellung der Leistungsfähigkeit anhand hergestellter Sensor- und Aktorstrukturen
Lohmann, C.; Bertz, A.; Reuter, D.; Küchler, M.; Geßner, T.
Conference Paper
2004High aspect ratio micromachining using the AIM technology
Lohmann, C.; Reuter, D.; Bertz, A.; Geßner, T.
Book Article
2004MEMS Metallization
Lohmann, C.; Gottfried, K.; Bertz, A.; Reuter, D.; Hiller, K.; Kuhn, M.; Gessner, T.
Conference Paper
2003Advanced silicon micromachining
Geßner, T.; Bertz, A.; Lohmann, C.; Kurth, S.; Hiller, K.
Journal Article
2003Development and characterization of a high aspect ratio vertical FET sensor for motion detection
Buschnakowski, S.; Bertz, A.; Bräuer, W.; Heinz, S.; Schuberth, R.; Ebest, G.; Gessner, T.
Conference Paper
2003Mechanical reliability of MEMS fabricated by a special technology using standard silicon wafers
Lohmann, C.; Bertz, A.; Küchler, M.; Reuter, D.; Gessner, T.
Conference Paper
2003A novel high aspect ratio technology for MEMS fabrication using standard silicon wafers
Lohmann, C.; Bertz, A.; Küchler, M.; Gessner, T.
Conference Paper
2003Selektives Niedertemperaturbonden mit SU-8 für Wafer-Level-Verkappung von mikromechanischen Strukturen
Reuter, D.; Frömel, J.; Schwenzer, G.; Bertz, A.; Geßner, T.
Conference Paper
2002A novel high aspect ratio technology for MEMS fabrication using standard silicon wafers
Bertz, A.; Küchler, M.; Knöfler, R.; Gessner, T.
Journal Article
2001Einsatzerfahrungen mit einer Multiplex-Ätzanlage für tiefes Siliziumätzen
Küchler, M.; Hiller, K.; Hahn, R.; Bertz, A.; Gessner, T.
Conference Paper
2001Monolithic integration of vibration sensors in near surface bulk silicon micromachining with microelectronics
Steiniger, D.; Bertz, A.; Gessner, T.
Conference Paper
2001Plasma deposited CF polymer films as ultra low k intermetal dielectric, film properties and application
Uhlig, M.; Bertz, A.; Werner, T.; Gessner, T.
Conference Paper
2001A single-crystal Si-resonator with on-chip readout amplifier in standard CMOS
Bertz, A.; Symanzik, H.; Steiniger, C.; Höffer, A.; Griesbach, K.; Stegemann, K.; Ebest, G.; Gessner, T.
Journal Article
2001Vertikal-Transistor mit beweglichen Gate und Verfahren zu dessen Herstelllung
Gessner, T.; Heinz, S.; Bertz, A.
Patent
2000High throughput, high quality dry etching of copper/barrier film stacks
Markert, M.; Bertz, A.; Gessner, T.; Ye, Y.; Zhao, A.; Ma, D.
Journal Article
1999Resonante Siliziumsensoren mit elektrostatischer Abstimmung für die Vibrationsanalyse
Wibbeler, J.; Küchler, M.; Steiniger, C.; Bertz, A.; Wolf, K.; Mehner, J.; Gessner, T.
Conference Paper
1999Untersuchungen zur Herstellung von lateralen Tastnadeln für die Rasterkraftmikroskopie
Knöfler, R.; Bertz, A.; Wolf, K.; Küchler, M.; Gessner, T.
Conference Paper