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| 2019 | Digital Holographic Microscopy for 200 € Using Open-Source Hard- and Software
Beckmann, Tobias; Fratz, Markus; Schiller, Annelie; Bertz, Alexander; Carl, Daniel | Conference Paper |
| 2019 | GPU-based digital image correlation system for real-time strain-controlled fatigue and strain field measurement
Blug, Andreas; Regina, David Joel; Eckmann, Stefan; Senn, Melanie; Eberl, Chris; Bertz, Alexander; Carl, Daniel | Conference Paper |
| 2019 | Industrial applications of digital holography
Fratz, Markus; Beckmann, Tobias; Anders, Joachim; Bertz, Alexander; Bayer, Markus; Gießler, Thomas; Carl, Daniel | Conference Paper |
| 2019 | Motion compensation for interferometric off-center measurements of rotating objects with varying radii
Schiller, Annelie; Beckmann, Tobias; Fratz, Markus; Bertz, Alexander; Carl, Daniel; Buse, Karsten | Journal Article |
| 2019 | Multiwavelength digital holography in the presence of vibrations: Laterally resolved multi-step phase-shift extraction
Seyler, Tobias; Bienkowski, Lasse; Beckmann, Tobias; Fratz, Markus; Bertz, Alexander; Carl, Daniel | Conference Paper |
| 2019 | Multiwavelength Holography: Height Measurements Despite Axial Motion of Several Wavelengths During Exposure
Schiller, Annelie; Beckmann, Tobias; Fratz, Markus; Bertz, Alexander; Carl, Daniel; Buse, Karsten | Conference Paper |
| 2019 | Real-Time GPU-Based Digital Image Correlation Sensor for Marker-Free Strain-Controlled Fatigue Testing
Blug, Andreas; Regina, David Joel; Eckmann, Stefan; Senn, Melanie; Bertz, Alexander; Carl, Daniel; Eberl, Chris | Journal Article |
| 2018 | Extending the depth of field beyond geometrical imaging limitations using phase noise as a focus measure in multiwavelength digital holography
Seyler, Tobias; Fratz, Markus; Beckmann, Tobias; Schiller, Annelie; Bertz, Alexander; Carl, Daniel | Journal Article |
| 2018 | Extensive microstructural quality control inside a machine tool using multiwavelength digital holography
Seyler, Tobias; Fratz, Markus; Beckmann, Tobias; Bertz, Alexander; Carl, Daniel; Grün, Viktor; Börret, Rainer; Ströer, Felix; Seewig, Jörg | Conference Paper |
| 2018 | Multiwavelength digital holography: Height measurements on linearly moving and rotating objects
Schiller, Annelie; Beckmann, Tobias; Fratz, Markus; Bertz, Alexander; Carl, Daniel; Buse, Karsten | Conference Paper |
| 2018 | Vorrichtung zur Partikelanalyse
Beckmann, Tobias; Bertz, Alexander; Carl, Daniel; Jetter, Volker; Schütz, Jan | Patent |
| 2017 | Digital holography on moving objects
Schiller, Annelie; Beckmann, Tobias; Fratz, Markus; Belzer, Dominik; Bertz, Alexander; Carl, Daniel; Buse, Karsten | Journal Article |
| 2017 | Digital holography on moving objects. Multiwavelength height measurements on inclined surfaces
Schiller, Annelie; Beckmann, Tobias; Fratz, Markus; Belzer, Dominik; Bertz, Alexander; Carl, Daniel; Buse, Karsten | Conference Paper |
| 2017 | Digital holography: Evolution from a research topic to a versatile tool for the inline 100% 3D quality control in industry
Fratz, Markus; Beckmann, Tobias; Schiller, Annelie; Seyler, Tobias; Bertz, Alexander; Carl, Daniel; Buse, Karsten | Conference Paper |
| 2017 | Inline-Oberflächenprüfung von Bahnware
Blug, Andreas; Saum, Norbert; Bertz, Alexander; Hofmann, Andreas | Book Article |
| 2017 | Marker-free GPU-based digital image correlation system for high-temperature strain-controlled fatigue measurements
Blug, Andreas; Regina, David Joel; Eckmann, Stefan; Senn, M.; Eberl, Christoph; Bertz, Alexander; Carl, Daniel | Presentation |
| 2017 | Miniaturized multiwavelength digital holography sensor for extensive in-machine tool measurement
Seyler, Tobias; Fratz, Markus; Beckmann, Tobias; Bertz, Alexander; Carl, Daniel | Conference Paper |
| 2016 | Geprüfte Oberflächen. Sub-µm Inline-3D-Oberflächenprüfung im Sekundentakt
Fratz, Markus; Beckmann, Tobias; Bertz, Alexander; Carl, Daniel | Journal Article |
| 2016 | Multiwavelength digital holography with spatial phase shifting on moving objects
Schiller, Annelie F.; Beckmann, Tobias; Fratz, Markus; Belzer, Dominik; Bertz, Alexander; Carl, Daniel; Buse, Karsten | Conference Paper |
| 2016 | Oberfläche so einzigartig wie der Fingerabdruck
Saum, Norbert; Förste, Alexander; Bertz, Alexander; Hofmann, Andreas; Carl, Daniel | Journal Article |
| 2015 | Micro welding of aluminum for post process electrode gap reduction using femtosecond laser
Meinecke, C.; Mueller, M.; Rennau, M.; Bertz, A.; Ebert, R.; Reuter, D.; Exner, H.; Gessner, T. | Conference Paper |
| 2015 | Technologieentwicklung einer post-process Elektrodenspaltverringerung zur Herstellung von hochauflösenden Sensorsystemen
Meinecke, C.; Mueller, M.; Rennau, M.; Reuter, D.; Ebert, R.; Bertz, A.; Exner, H.; Gessner, T. | Conference Paper |
| 2014 | AIM technology and devices - from basic research to industrial proven MEMS platform
Bertz, A.; Reuter, D.; Nowack, M. | Book Article |
| 2014 | High-speed deformation measurement using spatially phase-shifted speckle interferometry
Beckmann, Tobias; Fratz, Markus; Bertz, Alexander; Carl, Daniel | Conference Paper |
| 2014 | Integration von MOS-Transistoren als Wandler für mechanische Spannungen
Schramm, M.; Haas, S.; Reuter, D.; Loebel, K.-U.; Heinz, S.; Bertz, A.; Horstmann, J.T.; Gessner, T. | Abstract |
| 2014 | Technologieentwicklung, Herstellung und Charakterisierung von hochauflösenden Inertialsystemen
Meinecke, C.; Bertz, A.; Dittrich, C.; Schunke, S.; Kreutziger, P.; Gessner, T. | Conference Paper |
| 2013 | Analysis of metal-metal contacts in RF MEMS switches
Kurth, S.; Voigt, S.; Haas, S.; Bertz, A.; Kaufmann, C.; Gessner, T.; Akiba, A.; Ikeda, K. | Conference Paper |
| 2013 | Direct integration of field effect transistors as electro mechanical transducer for stress
Haas, S.; Reuter, D.; Bertz, A.; Gessner, T.; Schramm, M.; Loebel, K.-U.; Horstmann, J.T. | Conference Paper |
| 2013 | Highly Reliable and Low Voltage Actuated Ohmic RF MEMS Switch with Wafer Level Packaging
Kurth, S.; Nowack, M.; Voigt, S.; Bertz, A.; Froemel, J.; Kaufmann, C.; Gessner, T.; Akiba, A.; Ikeda, K. | Book Article |
| 2013 | Studies on the piezoresistive effect in MOS transistors for use in integrated MEMS sensors
Haas, S.; Schramm, M.; Loebel, K.-U.; Heinz, S.; Reuter, D.; Bertz, A.; Horstmann, J.T.; Gessner, T. | Conference Paper |
| 2013 | Technologieentwicklung für optimiertes MEMS Packaging durch Si-TSV-Rückseitenkontaktierung
Meinecke, C.; Hofmann, L.; Bertz, A.; Gottfried, K.; Gessner, T. | Conference Paper |
| 2013 | Verfahren zur Fixierung einer beweglichen Komponente eines mikromechanischen Bauelementes
Bertz, Andreas; Schulz, Stefan | Patent |
| 2012 | Micro arc welding for electrode gap reduction of high aspect ratio microstructures
Nowack, M.; Leidich, S.; Reuter, D.; Kurth, S.; Kuechler, M.; Bertz, A.; Gessner, T. | Journal Article, Conference Paper |
| 2012 | Out of plane capacitive transducer in air gap insulation microstructures technology for high precision monolithic 3-axis sensors
Reuter, D.; Nowack, M.; Shaporin, A.; Rockstroh, J.; Haas, S.; Bertz, A.; Mehner, J.; Gessner, T. | Conference Paper |
| 2012 | Thermal nanoimprint resist for the fabrication of high-aspect-ratio patterns
Messerschmidt, M.; Schleunitz, A.; Spreu, C.; Werner, T.; Vogler, M.; Reuther, F.; Bertz, A.; Schift, H.; Grüzner, G. | Journal Article |
| 2012 | Untersuchungen zum piezoresistiven Effekt in MOS-Transistoren für die Anwendung in integrierten MEMS-Sensoren
Haas, S.; Schramm, M.; Heinz, S.; Loebel, K.-U.; Reuter, D.; Bertz, A.; Gessner, T.; Horstmann, J.T. | Conference Paper |
| 2011 | Autarkes Sensornetzwerk zur Überwachung von Hochspannungsleitungen
Voigt, S.; Nowack, M.; Bertz, A.; Leidich, S.; Meinig, M.; Kurth, S.; Gessner, T.; Grosser, V.; Braunschweig, M.; Krumm, R. | Conference Paper |
| 2011 | HF-MEMS Schalter mit ohmschen Kontakt und lateraler Bewegungsrichtung
Leidich, S.; Kurth, S.; Nowack, M.; Bertz, A.; Froemel, J.; Kaufmann, C.; Gessner, T. | Conference Paper |
| 2011 | Kapazitiver MEMS-Mischer und Signalfilter für wake up receiver
Kurth, S.; Voigt, S.; Leidich, S.; Nowack, M.; Bertz, A.; Gessner, T. | Conference Paper |
| 2011 | Lokales Mikroschweißen als post-process Technologie zur permanenten Reduzierung des Elektrodenabstandes von HARMS
Nowack, M.; Leidich, S.; Reuter, D.; Kurth, S.; Kuechler, M.; Bertz, A.; Gessner, T. | Conference Paper |
| 2011 | Novel post-process gap reduction technology of high aspect ratio microstructures utilizing micro welding
Nowack, M.; Leidich, S.; Reuter, D.; Kurth, S.; Kuchler, M.; Bertz, A.; Gessner, T. | Conference Paper |
| 2011 | Reliability enhancement of Ohmic RF MEMS switches
Kurth, S.; Leidich, S.; Bertz, A.; Nowack, M.; Frömel, J.; Kaufmann, C.; Faust, W.; Gessner, T.; Akiba, A.; Ikeda, K. | Conference Paper |
| 2010 | Challenges of smart system integration
Gessner, T.; Vogel, M.; Hiller, K.; Otto, T.; Bertz, A.; Billep, D. | Conference Paper |
| 2010 | A fast and low actuation voltage MEMS switch for mm-wave and its integration
Akiba, A.; Mitarai, S.; Morita, S.; Ikeda, I.; Kurth, S.; Leidich, S.; Bertz, A.; Nowack, M.; Froemel, J.; Gessner, T. | Conference Paper |
| 2010 | Fortschritte in der Anwendung des tiefen Siliziumätzens (DRIE).
Kuechler, M.; Hofmann, L.; Hahn, R.; Bertz, A.; Gessner, T. | Conference Paper |
| 2010 | A novel three-axis AIM vibration sensor for high accuracy condition monitoring
Nowack, M.; Reuter, D.; Bertz, A.; Kuechler, M.; Aurich, T.; Dittrich, C.; Gessner, T. | Conference Paper |
| 2010 | Smart Integrated Systems - Developments of Fraunhofer ENAS
Vogel, M.; Hiller, K.; Bertz, A.; Wiemer, M.; Gessner, T. | Book Article |
| 2009 | Hermetic thin film encapsulation of mechanical transducers for smart label applications
Reuter, D.; Nowack, M.; Rennau, M.; Bertz, A.; Wiemer, M.; Kriebel, F.; Gessner, T. | Conference Paper |
| 2009 | Integration of inertial MEMS sensors in active smart RFID labels for transport monitoring
Reuter, D.; Nowack, M.; Bertz, A.; Wiemer, M.; Semar, R.; Kriebel, F.; Hopp, K.-F.; Dittrich, S.; Thieme, T. | Conference Paper |
| 2009 | Integration von MEMS-Inertialsensoren in Smart RFID Label zur Transportüberwachung empfindlicher Güter
Nowack, M.; Reuter, D.; Bertz, A.; Gessner, T. | Conference Paper |
| 2009 | Plasmagestütztes Hochrateätzen von Silikatgläsern mit variablem Ätzprofil
Bertz, A.; Fendler, R.; Schuberth, R.; Werner, T.; Gessner, T. | Conference Paper |
| 2009 | Smart systems integration by using micro and nano technologies
Gessner, T.; Wiemer, M.; Bertz, A.; Vogel, M. | Journal Article |
| 2009 | Technologies and MEMS sensor solutions for smart integrated systems
Hiller, K.; Kurth, S.; Bertz, A.; Gessner, T. | Journal Article |
| 2008 | Thin film encapsulation technology for harms using sacrificial CF-polymer
Reuter, D.; Bertz, A.; Nowack, A.; Gessner, T. | Conference Paper, Journal Article |
| 2007 | Mikromechanische Schaltervorrichtung mit mechanischer Kraftverstärkung
Frömel, J.; Voigt, S.; Kurth, S.; Leidich, S.; Bertz, A.; Kaufmann, C.; Gessner, T. | Patent |
| 2007 | Neue Technologie in der Herstellung - neue Chance am Markt
Thieme, T.; Bertz, A.; Gessner, T.; Dittrich, C. | Conference Paper |
| 2007 | A new method for high-rate deep dry etching of silicate glass with variable ETCH profile
Bertz, A.; Fendler, R.; Schuberth, R.; Hentsch, W.; Gessner, T. | Conference Paper |
| 2007 | Thin Film Encapsulation of High Aspect Ratio Microstructures using sacrificial CF-Polymer
Reuter, D.; Bertz, A.; Gessner, T. | Conference Paper |
| 2007 | Thin Film Encapsulation of Microstructures using sacrificial CF-Polymer
Reuter, D.; Bertz, A.; Werner, T.; Nowack, M.; Gessner, T. | Conference Paper |
| 2007 | Wafer-Level Active Testing of Capacitive Inertial Sensors
Nowack, M.; Reuter, D.; Rennau, M.; Bertz, A.; Gessner, T. | Conference Paper |
| 2006 | In-process gap reduction of capacitive transducers
Reuter, D.; Bertz, A.; Billep, D.; Scheibner, D.; Dötzel, W.; Gessner, T. | Journal Article |
| 2005 | Efficient and flexible high aspect ratio micromachining for the fabrication of low-g-sensors
Bertz, A.; Lohmann, C.; Reuter, D.; Geßner, T. | Abstract |
| 2005 | Flexible Herstellung und Charakterisierung von Inertialsensoren basierend auf der AIM-Technologie
Lohmann, C.; Bertz, A.; Reuter, D.; Küchler, M.; Geßner, T. | Conference Paper |
| 2005 | In-process gap reduction of capacitive transducers
Reuter, D.; Bertz, A.; Billep, D.; Scheibner, D.; Buschnakowski, S.; Doetzel, W.; Gessner, T. | Conference Paper |
| 2005 | Selective adhesive bonding with SU-8 for zero-level-packaging
Reuter, D.; Bertz, A.; Schwenzer, G.; Gessner, T. | Conference Paper |
| 2005 | Validierung der AIM Technologie: Darstellung der Leistungsfähigkeit anhand hergestellter Sensor- und Aktorstrukturen
Lohmann, C.; Bertz, A.; Reuter, D.; Küchler, M.; Geßner, T. | Conference Paper |
| 2004 | High aspect ratio micromachining using the AIM technology
Lohmann, C.; Reuter, D.; Bertz, A.; Geßner, T. | Book Article |
| 2004 | MEMS Metallization
Lohmann, C.; Gottfried, K.; Bertz, A.; Reuter, D.; Hiller, K.; Kuhn, M.; Gessner, T. | Conference Paper |
| 2003 | Advanced silicon micromachining
Geßner, T.; Bertz, A.; Lohmann, C.; Kurth, S.; Hiller, K. | Journal Article |
| 2003 | Development and characterization of a high aspect ratio vertical FET sensor for motion detection
Buschnakowski, S.; Bertz, A.; Bräuer, W.; Heinz, S.; Schuberth, R.; Ebest, G.; Gessner, T. | Conference Paper |
| 2003 | Mechanical reliability of MEMS fabricated by a special technology using standard silicon wafers
Lohmann, C.; Bertz, A.; Küchler, M.; Reuter, D.; Gessner, T. | Conference Paper |
| 2003 | A novel high aspect ratio technology for MEMS fabrication using standard silicon wafers
Lohmann, C.; Bertz, A.; Küchler, M.; Gessner, T. | Conference Paper |
| 2003 | Selektives Niedertemperaturbonden mit SU-8 für Wafer-Level-Verkappung von mikromechanischen Strukturen
Reuter, D.; Frömel, J.; Schwenzer, G.; Bertz, A.; Geßner, T. | Conference Paper |
| 2002 | A novel high aspect ratio technology for MEMS fabrication using standard silicon wafers
Bertz, A.; Küchler, M.; Knöfler, R.; Gessner, T. | Journal Article |
| 2001 | Einsatzerfahrungen mit einer Multiplex-Ätzanlage für tiefes Siliziumätzen
Küchler, M.; Hiller, K.; Hahn, R.; Bertz, A.; Gessner, T. | Conference Paper |
| 2001 | Monolithic integration of vibration sensors in near surface bulk silicon micromachining with microelectronics
Steiniger, D.; Bertz, A.; Gessner, T. | Conference Paper |
| 2001 | Plasma deposited CF polymer films as ultra low k intermetal dielectric, film properties and application
Uhlig, M.; Bertz, A.; Werner, T.; Gessner, T. | Conference Paper |
| 2001 | A single-crystal Si-resonator with on-chip readout amplifier in standard CMOS
Bertz, A.; Symanzik, H.; Steiniger, C.; Höffer, A.; Griesbach, K.; Stegemann, K.; Ebest, G.; Gessner, T. | Journal Article |
| 2001 | Vertikal-Transistor mit beweglichen Gate und Verfahren zu dessen Herstelllung
Gessner, T.; Heinz, S.; Bertz, A. | Patent |
| 2000 | High throughput, high quality dry etching of copper/barrier film stacks
Markert, M.; Bertz, A.; Gessner, T.; Ye, Y.; Zhao, A.; Ma, D. | Journal Article |
| 1999 | Resonante Siliziumsensoren mit elektrostatischer Abstimmung für die Vibrationsanalyse
Wibbeler, J.; Küchler, M.; Steiniger, C.; Bertz, A.; Wolf, K.; Mehner, J.; Gessner, T. | Conference Paper |
| 1999 | Untersuchungen zur Herstellung von lateralen Tastnadeln für die Rasterkraftmikroskopie
Knöfler, R.; Bertz, A.; Wolf, K.; Küchler, M.; Gessner, T. | Conference Paper |