Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2013Advanced characterization of glass frit bonded micro-chevron-test samples based on scanning acoustic microscopy
Naumann, F.; Brand, S.; Bernasch, M.; Tismer, S.; Czurratis, P.; Wünsch, D.; Petzold, M.
Journal Article
2013Fracture mechanics life-time modeling of low temperature Si fusion bonded interfaces used for 3D MEMS device integration
Naumann, F.; Bernasch, M.; Siegert, J.; Carniello, S.; Petzold, M.
Conference Paper
2012A study of factors influencing micro-chevron-testing of glass frit bonded interfaces
Naumann, F.; Bernasch, M.; Brand, S.; Wünsch, D.; Vogel, K.; Czurratis, P.; Petzold, M.
Conference Paper, Journal Article
2008Laser transmission bonding of silicon-to-silicon and silicon-to-glass for wafer level packaging and microsystems
Sari, F.; Wiemer, M.; Bernasch, M.; Bagdahn, J.
Conference Paper
2008A standard method for measuring wafer bond strength for MEMS applications
Allen, R.A.; Marshall, J.; Baylies, W.; Read, D.; Delrio, F.; Turner, K.T.; Bernasch, M.; Bagdahn, J.
Conference Paper
2006Comparison of the mechanical properties of low temperature bonded test samples
Bagdahn, J.; Bernasch, M.; Fischer, C.; Wiemer, M.
Conference Paper
2006Influence of the frequency on fatigue of directly wafer-bonded silicon
Bagdahn, J.; Bernasch, M.; Petzold, M.
Journal Article
2006Room temperature bonding of nanostructured silicon wafers and mechanical characterization
Stubenrauch, M.; Fischer, M.; Bernasch, M.; Bagdahn, J.
Conference Paper
2006Strength characterization of directly bonded silicon
Wiemer, M.; Fischer, C.; Bernasch, M.; Bagdahn, J.
Conference Paper
2002Influence of the frequency on fatique of directly wafer-bonded silicon
Bagdahn, J.; Bernasch, M.; Petzold, M.
Conference Paper