Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2010Ceramic substrates with aluminum metallization for power application
Knoll, H.; Weidenauer, W.; Ingram, P.; Bennemann, S.; Brand, S.; Petzold, M.
Conference Paper
2010Fehlermechanismen an Leiterplattenmetallisierungen für bleifrei gelötete Packageaufbauten
Bennemann, S.; Simon, M.; Petzold, M.; Altmann, F.
Conference Paper
2010High resolution analysis of intermetallic compounds in microelectronic interconnects using Electron Backscatter Diffraction and Transmission Electron Microscopy
Krause, M.; März, B.; Bennemann, S.; Petzold, M.
Conference Paper
2010Microstructure and mechanical properties of laser ablation cleaned NiP platings for aluminum wire bonding
Bennemann, S.; Dresbach, C.; Lorenz, G.; Berthold, L.; Petzold, M.
Conference Paper
2009Advanced failure analysis methods and microstructural investigations of wire bond contacts for current microelectronic system
Klengel, R.; Bennemann, S.; Petzold, M.
Conference Paper
2007The size effect on the creep properties of SnAgCu-solder alloys
Wiese, S.; Roellig, M.; Mueller, M.; Wolter, K.-J.; Bennemann, S.; Petzold, M.
Conference Paper
2006Analytical and mechanical methods for material property investigations of SnAgCu-solder
Petzold, M.; Bennemann, S.; Graff, A.; Krause, M.; Müller, M.; Wiese, S.; Wolter, K.-J.
Conference Paper
2006Compositional effects on the creep properties of SnAgCu solder
Wiese, S.; Krämer, F.; Müller, M.; Röllig, M.; Wolter, K.-J.; Krause, M.; Bennemann, S.; Petzold, M.
Conference Paper
2006A SEM and TEM study of the interconnect microstructure and reliability for a new XFLGA package
Bennemann, S.; Graff, A.; Schischka, J.; Petzold, M.; Theuss, H.; Dangelmaier, J.; Pressel, K.
Conference Paper