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| 2013 | Panel level packaging - a manufacturing solution for cost-effective systems
Aschenbrenner, Rolf; Becker, K.-F.; Braun, T.; Ostmann, A. | Conference Paper |
| 2011 | Immersion silver as universal surface finish for COB technology
Göhre, J.; Schneider-Ramelow, M.; Becker, K.-F.; Hutter, M. | Conference Paper |
| 2011 | Through mold vias for stacking of mold embedded packages
Braun, T.; Becker, K.-F.; Voges, S.; Thomas, T.; Kahle, R.; Bader, V.; Bauer, J.; Piefke, K.; Krüger, R.; Aschenbrenner, R.; Lang, K.-D. | Conference Paper |
| 2011 | Transfer molding technology for smart power electronics modules - materials and processes
Becker, K.-F.; Joklitschke, D.; Braun, T.; Koch, M.; Schreier-Alt, T.; Bader, V.; Bauer, J.; Nowak, T.; Aschenbrenner, R.; Schneider-Ramelow, M.; Thomas, T.; Bochow-Ness, O.; Lang, K.-D. | Conference Paper |
| 2010 | Contactless handling and precision positioning of smallest components for assembly of microelectronics
Braun, T.; Bauer, J.; Becker, K.-F.; Kahle, R.; Jung, E.; Koch, M.; Mollath, G.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2010 | Contactless material deposition by jetting for heterogeneous system integration
Becker, K.-F.; Kurz, A.; Reichl, H.; Koch, M.; Bauer, J.; Braun, T. | Conference Paper |
| 2010 | Immersion Ag als Au-drahtbondbares und COB-geeignetes Universal-Finish für die multi-funktionale Leiterplatte
Schneider-Ramelow, M.; Göhre, J.-M.; Becker, K.-F.; Hutter, M. | Journal Article, Conference Paper |
| 2010 | KRAFAS - Projektergebnisse der innovativen Einbetttechnologien CID und CHIP+ für den Einsatz in automobilen Radarsensoren
Kostelnik, Jan; Ebling, F.; Becker, K.-F.; Kahle, R.; Kugler, A.; Sommer, J.-P.; Noack, E.; Richter, M.D.; Schneider, M. | Conference Paper |
| 2010 | Large area embedding for heterogeneous system integration
Braun, T.; Becker, K.-F.; Böttcher, L.; Bauer, J.; Thomas, T.; Koch, M.; Kahle, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.; Bründel, M.; Haag, J.F.; Scholz, U. | Conference Paper |
| 2010 | Nano- und micro sized filler particles for improved humidity resistance of encapsulants
Braun, T.; Bauer, J.; Georgi, L.; Becker, K.-F.; Koch, M.; Thomas, T.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2010 | Precision material deposition for SiP manufacturing using jetting processes
Becker, K.-F.; Kurz, A.; Reichl, H.; Koch, M.; Bauer, J.; Braun, T. | Conference Paper |
| 2010 | Reliability study of the stud bump bonding flip chip technology on molded interconnect devices
Dressler, M.; Wunderle, B.; Becker, K.-F.; Reichl, H. | Conference Paper |
| 2010 | Water diffusion in micro- and nano-particle filled encapsulants
Braun, T.; Georgi, L.; Bauer, J.; Koch, M.; Becker, K.-F.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2009 | Application of interfacial fracture mechanics approach for obtaining design rules for flip chip interconnections
Dressler, M.; Becker, K.-F.; Wunderle, B.; Auersperg, J.; Reichl, H. | Conference Paper, Journal Article |
| 2009 | Biocompatible lab-on-substrate technology platform
Braun, T.; Böttcher, L.; Bauer, J.; Bocchi, M.; Faenza, A.; Guerrieri, R.; Gambari, R.; Becker, K.-F.; Jung, E.; Ostmann, A.; Koch, M.; Kahle, R.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2009 | Embedding technologies for an automotive radar system
Becker, K.-F.; Koch, M.; Kahle, R.; Braun, T.; Böttcher, L.; Ostmann, A.; Kostelnik, J.; Ebling, F.; Noack, E.; Sommer, J.P.; Richter, M.; Schneider, M.; Reichl, H. | Conference Paper |
| 2009 | Embroidered interconnections and encapsulation for electronics in textiles for wearable electronics applications
Linz, T.; Vieroth, R.; Dils, C.; Koch, M.; Braun, T.; Becker, K.-F.; Kallmayer, C.; Hong, S.-M. | Conference Paper |
| 2009 | Flip chips on PCB - from single chip encapsulation to systems in package
Schreier-Alt, T.; Braun, T.; Becker, K.-F.; Rebholz, C.; Wunderle, B.; Reichl, H. | Journal Article |
| 2009 | Interconnects for Buried W-Band MMICs Using Novel System-in-Package Technology
Richter, M.D.; Becker, K.-F.; Bottcher, L.; Schneider, M. | Conference Paper |
| 2009 | Lab-on-substrate technology platform
Braun, T.; Böttcher, L.; Bauer, J.; Jung, E.; Becker, K.-F.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Journal Article, Conference Paper |
| 2009 | Plastic packaging for high temperature applications
Braun, T.; Becker, K.-F.; Bauer, J.; Koch, M.; Bader, V.; Kahle, R.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2009 | Smart sensor systems - packaging technologies for multi-sensory consumer applications
Jung, E.; Becker, K.-F.; Braun, T.; Aschenbrenner, R. | Conference Paper |
| 2009 | Thermo-mechanical reliability during technology development of power chip-on-board assemblies with encapsulation
Wunderle, B.; Becker, K.-F.; Sinning, R.; Wittler, O.; Schacht, R.; Walter, H.; Schneider-Ramelow, M.; Halser, K.; Simper, N.; Michel, B.; Reichl, H. | Journal Article |
| 2009 | Verfahren und Anordnung zur Herstellung einer Niedertemperaturkontaktierung für mikroelektronische Aufbauten
Bauer, J.; Becker, K.-F.; Kahle, R. | Patent |
| 2008 | Berührungslose Bestückverfahren - Neue Ansätze für die AVT von Mikrosystemen
Becker, K.-F.; Fiedler, S.; Bauer, J.; Kolesnik, I.; Jung, E.; Mollath, G.; Schreck, G.; Reichl, H. | Journal Article |
| 2008 | Contactless component handling on PCB using EWOD principles
Braun, T.; Becker, K.-F.; Koch, M.; Lienemann, J.; Kahle, R.; Bauer, J.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2008 | Design of 77 GHz interconnects for buried SiGe MMICs using novel system-in-package technology
Richter, M.D.; Becker, K.-F.; Böttcher, L.; Schneider, M. | Conference Paper |
| 2008 | Design of 77 GHz interconnects for buried SiGe MMICs using novel system-in-package technology
Richter, M.D.; Becker, K.-F.; Böttcher, L.; Schneider, M. | Conference Paper |
| 2008 | Embroidered interconnections and encapsulation for electronics in textiles for wearable electronics applications
Linz, T.; Vieroth, R.; Dils, C.; Koch, M.; Braun, T.; Becker, K.-F.; Kallmayer, C.; Hong, S.-M. | Conference Paper |
| 2008 | KRAFAS - Einbetttechnologien für aktive Komponenten
Kostelnik, J.; Becker, K.-F.; Ebling, F.; Sommer, J.-P.; Noack, E.; Böttcher, L. | Journal Article |
| 2008 | Micro to nano - scaling packaging technologies for future microsystems
Braun, T.; Becker, K.-F.; Bauer, J.; Hausel, F.; Pahl, B.; Wittler, O.; Mrossko, R.; Jung, E.; Ostmann, A.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2008 | Nano-particle enhanced encapsulants for improved humidity resistance
Braun, T.; Hausel, F.; Bauer, J.; Wittler, O.; Mrossko, R.; Bouazza, M.; Becker, K.-F.; Oestermann, U.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2008 | Nano-Particle Filled Epoxy Resins with Improved Diffusion Barrier Functionality
Braun, T.; Hausel, F.; Bauer, J.; Wittler, O.; Mrossko, R.; Bouazza, M.; Becker, K.-F.; Oestermann, U.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H. | Journal Article, Conference Paper |
| 2008 | Neue Verfahren und Werkstoffe für Halbleiterkomponenten
Pötter, H.; Becker, K.-F.; Hampicke, M.; Lang, K.-D.; Schmitz, S.; Töpper, M. | Journal Article |
| 2008 | Numerical Simulation and Micro Deformation Measurements for Sensor Design in Automotive Technology
Sommer, J.-P.; Noack, E.; Michel, B.; Becker, K.-F. | Conference Paper |
| 2008 | Reliable Encapsulation of Microsystems for Automotive Use
Becker, K.-F.; Braun, T.; Koch. M.; Bauer, J.; Wunderle, B.; Sommer, J.-P.; Aschenbrenner, R.; Reichl, H. | Conference Paper, Journal Article |
| 2008 | Zuverlässigkeit von Aufbauten mit in die Leiterplatte integrierten Bauelementen
Sommer, J.-P.; Michel, B.; Noack, E.; Seiler, B.; Becker, K.-F.; Neumann, A. | Conference Paper |
| 2007 | Microtechnology for realization of dielectrophoresis enhanced microwells for biomedical applications
Braun, T.; Böttcher, L.; Bauer, J.; Manessis, D.; Jung, E.; Ostmann, A.; Becker, K.-F.; Aschenbrenner, R.; Reichl, H.; Guerrieri, R.; Gambari, R. | Conference Paper |
| 2007 | New sensor packaging concept for avionic application
Aschenbrenner, R.; Jung, E.; Braun, T.; Oestermann, U.; Bauer, J.; Becker, K.-F.; Reichl, H. | Conference Paper |
| 2007 | Non-destructive failure analysis and modeling of encapsulated miniature SMD ceramic chip capacitors under thermal and mechanical loading
Wunderle, B.; Braun, T.; May, D.; Mazloum, A.; Bouazza, M.; Walter, H.; Wittier, O.; Schacht, R.; Becker, K.-F.; Schneider-Ramelow, M.; Michel, B.; Reichl, H. | Conference Paper |
| 2007 | Overmolded FC-SiP for miniaturized devices
Jung, E.; Koch, M.; Becker, K.-F.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2007 | Rapid interface reliability testing of flip chip encapsulants
Rau, I.; Becker, K.-F.; Wunderle, B.; Reichl, H. | Conference Paper |
| 2007 | Schaltanordnung und Verfahren zu deren Herstellung
Jung, E.; Becker, K.-F.; Wunderle, B. | Patent |
| 2007 | Verfahren zur Herstellung einer elektronischen Baugruppe
Kostelnik, J.; Schaaf, U.; Kugler, A.; Becker, K.-F.; Neumann, A. | Patent |
| 2007 | Verfahren zur Herstellung einer elektronischen Baugruppe sowie elektronische Baugruppe
Kugler, A.; Liebing, G.; Becker, K.-F. | Patent |
| 2006 | Biocompatible hybrid flip-chip microsystem integration for next generation wireless neural interfaces
Töpper, M.; Klein, M.; Buschick, K.; Glaw, V.; Orth, K.; Ehrmann, O.; Hutter, M.; Oppermann, H.; Becker, K.-F.; Braun, T.; Ebling, F.; Reichl, H.; Kim, S.; Tathireddy, P.; Chakravarty, S.; Solzbacher, F. | Conference Paper |
| 2006 | Development of a nano-structure based interconnection technology
Aschenbrenner, R.; Fiedler, S.; Löher, T.; Pahl, B.; Becker, K.-F.; Reichl, H. | Presentation |
| 2006 | High-temperature reliability of flip chip assemblies
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2006 | Identifying the reliability affecting parameters of SBB flip chip interconnections for automotive applications
Dreßler, M.; Rohde, H.; Liebing, G.; Becker, K.-F.; Wunderle, B.; Auersperg, J.; Reichl, H. | Conference Paper |
| 2006 | Improved reliability of leadfree flip chip assemblies using direct underfilling by transfer molding
Braun, T.; Wunderle, B.; Becker, K.-F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2006 | Influence of assembly process - material properties and geometry on the reliability of flip chip interconnections on MID for automotive applications
Dreßler, M.; Rohde, H.; Liebing, G.; Becker, K.-F.; Wunderle, B.; Reichl, H. | Conference Paper |
| 2006 | Nano-structured interconnects for system integration
Aschenbrenner, R.; Fiedler, S.; Löher, T.; Pahl, B.; Becker, K.-F.; Reichl, H. | Conference Paper |
| 2006 | Rapid tooling for high reliability transfer molded devices
Becker, K.-F.; Koch, M.; Gramckow, J.; Braun, T.; Bader, V.; Jung, E.; Lang, K.-D.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | Chip in duromer technology for system in package realization
Becker, K.-F.; Braun, T.; Neumann, A.; Ostmann, A.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | Development of a scalelable interconnection technology for nano packaging
Becker, K.-F.; Löher, T.; Pahl, B.; Wittler, O.; Jordan, R.; Bauer, J.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | Duromer MID technology for system-in-package generation
Becker, K.-F.; Braun, T.; Neumann, A.; Ostmann, A.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.; Jung, E. | Journal Article |
| 2005 | Film coating - large area encapsulation process for electronics packaging
Becker, K.-F.; Braun, T.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | Film coatings as an encapsulation process for polymer electronics
Becker, K.-F.; Braun, T.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | High temperature potential of flip chip assemblies for automotive applications
Braun, T.; Becker, K.-F.; Sommer, J.-P.; Löher, T.; Schottenloher, K.; Kohl, R.; Pufall, R.; Bader, V.; Koch, M.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | A new wafer level packaging approach: Encapsulation, metallization and laser structuring for advanced system in package manufacturing
Becker, K.-F.; Braun, T.; Neumann, A.; Ostmann, A.; Coko, E.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2005 | Reliability potential of epoxy based encapsulants for automotive applications
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper, Journal Article |
| 2004 | Evolution of WLP: From Redristribution to 3-D Packaging and MEMS Packaging
Töpper, M.; Glaw, V.; Zoschke, K.; Jung, E.; Becker, K.-F.; Ehrmann, O.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2004 | Modelling and application of silicon microphone systems
Mammen, H.-T.; Stürmer, U.; Koch, M.; Köhne, H.; Becker, K.-F.; John, W.; Reichl, H. | Conference Paper |
| 2004 | Optimizing Processes and Materials for Flip Chip Reliability
Becker, K.-F.; Adams, T. | Journal Article |
| 2004 | Stackable system-on-packages with integrated components
Becker, K.-F.; Jung, E.; Ostmann, A.; Braun, T.; Neumann, A.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2003 | Flip chip technology for high temperature automotive applications
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2003 | Packaging of micro devices for automotive applications
Jung, E.; Großer, V.; Becker, K.-F.; Koch, M. | Conference Paper |
| 2003 | Vom Wafer zum System-in-Package
Braun, T.; Becker, K.-F.; Ostmann, A. | Journal Article |
| 2003 | Wafer level encapsulation for system in package generation
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Manessis, D.; Neumann, A.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2002 | Wafer level encapsulation - a transfer molding approach to system in package generation
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Oystermann, U.; Manessis, D.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2001 | Accelerated testing of flip chip packages under dynamic load
Rau, I.; Miessner, R.; Liebing, G.; Becker, K.-F. | Conference Paper |
| 2001 | Advanced flip chip encapsulation: Transfer molding process for simultaneous underfiling and postencapsulation
Becker, K.-F.; Braun, T.; Koch, M.; Ansorge, F.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2001 | Maßgeschneiderte Systemlösungen durch Packaging
Aschenbrenner, R.; Ostmann, A.; Becker, K.-F.; Jung, E.; Kallmeyer, C. | Journal Article |
| 2001 | Plastic encapsulation technologies - Processes and characterization
Ansorge, F.; Becker, K.-F.; Braun, T.; Jung, E.; Misawa, D. | Conference Paper |
| 2001 | Processing design rules for reliable reflowable underfill application
Kallmayer, C.; Becker, K.-F.; Jung, E.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2001 | Test boards simplify flip chip underfill processing
Becker, K.-F.; Adams, T. | Journal Article |
| 2000 | Aufbau-, Verbindungs- und Verkapselungstechnik in der Mechatronik. Neuartige Systemlösungen
Ansorge, F.; Becker, K.-F.; Großer, V.; Michel, B.; Braun, T. | Journal Article |
| 2000 | BGA packaging technology for rapid prototyping supported by advanced analytics
Becker, K.-F.; Ansorge, F.; Aschenbrenner, R.; Krause, F.; Kämpfe, B.; Reichl, H. | Conference Paper |
| 2000 | Dynamic mechanical analysis (DMA) of an highly-filled epoxy resin in thin layers
Braun, T.; Mießner, R.; Becker, K.-F. | Conference Paper |
| 2000 | Integration of micro-mechatronics in automotive applications
Ansorge, F.; Becker, K.-F.; Michel, B.; Leutenbauer, R.; Großer, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2000 | Integration of micro-mechatronics in automotive applications using environmentally accepted materials
Ansorge, F.; Becker, K.-F.; Michel, B.; Leutenbauer, R.; Großer, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2000 | Mechatronic solutions for modular MEMS
Amiri Jam, K.; Hillmann, V.; Braun, T.; Becker, K.-F.; Ansorge, F.; Großer, V.; Reichl, H. | Conference Paper |
| 2000 | Numerical and experimental investigations of large IC flip chip attach
Schubert, A.; Dudek, R.; Leutenbauer, R.; Coskina, P.; Becker, K.-F.; Kloeser, J.; Michel, B.; Reichl, H.; Baldwin, D.; Qu, J.; Sitaraman, S.; Wong, C.P.; Tummala, R. | Conference Paper |
| 2000 | Study on reflowable underfill materials for different flip chip processes
Kallmayer, C.; Becker, K.-F.; Jung, E.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1999 | Entwicklung eines CSP auf Waferebene
Simon, J.; Auersperg, J.; Becker, K.-F.; Busse, E.; Heinricht, K.; Kallmayer, C.; Schütt, J.; Töpper, M.; Reichl, H. | Book Article |
| 1999 | Flip chip solder joint reliability
Schubert, A.; Dudek, R.; Vogel, D.; Becker, K.-F.; Kloeser, J.; Michel, B.; Reichl, H. | Conference Paper |
| 1998 | Characterization of adhesive materials for high circuit density applications
Aschenbrenner, R.; Mießner, R.; Becker, K.-F.; Reichl, H. | Conference Paper |
| 1998 | Influences of flip chip layout on the underfilling process
Becker, K.-F.; Schaub, M.; Mießner, R.; Ansorge, F.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1998 | Reliability aspects of molded BGA's related to material properties
Ehrlich, R.; Becker, K.-F.; Badri Ghavifekr, H.; Ansorge, F.; Aschenbrenner, R.; Reichl, H.; Sawai, K.; Tanaka, A.; Kumano, K.; Tenya, Y.; Chichon, M.; Hosokawa, H. | Conference Paper |
| 1997 | Characterization of microsystem and packaging components by acoustic microscopy
Vogel, D.; Becker, K.-F.; Zakel, E. | Conference Paper |
| 1997 | Influences on the reliability of underfilled flip chips
Becker, K.-F.; Jiang, H.; Ansorge, F.; Jung, E.; Zakel, E.; Reichl, H. | Conference Paper |
| 1997 | Recent progress in encapsulation technology and reliability investigation of mechatronic, CSP and BGA packages using flip chip interconnection technology
Ansorge, F.; Becker, K.-F.; Azdasht, G.; Ehrlich, R.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1997 | Recent progress in flexible molding and reliability investigation of CSP and BGA-packages using advanced interconnection technology
Becker, K.-F.; Ansorge, F.; Ehrlich, R.; Azdasht, G.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |