Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Future Packaging Technologies in Power Electronic Modules
Bayer, C.F.
Presentation
2019Optimization of Ag-Ag Direct Bonding for Wafer-Level Power Electronics Packaging via Design of Experiments
Yu, Z.; Wang, S.; Letz, S.; Bayer, C.F.; Häußler, F.; Schletz, A.; Suganuma, K.
Conference Paper
2019Parylene Coatings in Power Electronic Modules
Diepgen, A.; Zimmermann, V.; Bayer, C.F.; Zhou, Y.; Forster, C.; Wilbers, P.; Leib, J.; Schletz, A.; Virtanen, S.; März, M.
Presentation
2019Stackable SiC Embedded Ceramic Packages for High Voltage and High Temperature Power Electronics Applications
Bach, Linh; Dirksen, D.; Blechinger, C.; Endres, T.M.; Bayer, C.F.; Schletz, A.; März, M.
Conference Paper
2018Ceramic Embedding as Packaging Solution for Future Power Electronic Applications
Bach, H.L.; Endres, T.M.; Dirksen, D.; Zischler, S.; Bayer, C.F.; Schletz, A.; März, M.
Conference Paper
2018Elektrochemische Korrosion auf keramischen Substraten für leistungselektronische Module
Bayer, C.F.
Journal Article
2018Highly reliable power modules by pressureless sintering
Waltrich, U.; Bayer, C.F.; Zötl, S.; Tokarski, A.; Zischler, S.; Schletz, A.; März, M.
Conference Paper
2016Enhancement of the partial discharge inception voltage of ceramic substrates for power modules by trench coating
Waltrich, U.; Bayer, C.F.; Reger, M.; Meyer, A.; Tang, X.; Schletz, A.
Conference Paper