Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Radiation testing of optical coatings: Better testing with simulations
Kuhnhenn, Jochen; Steffens, Michael; Baum, Max
Conference Paper
20183D-Packaging-Technologien zur Herstellung intelligenter medizinischer Implantate
Wuensch, D.; Schroeder, T.; Baum, M.; Hiller, K.; Forke, R.; Wiemer, M.; Weidenmueller, J.; Dogan, O.; Goertz, M.
Conference Paper
2018Bidirectional data transmission for battery-less medical implants
Dogan, Özgü; Hennig, Andreas; Stanitzki, Alexander; Baum, Mario; Grabmaier, Anton
Abstract
2018Evaluation of Ag-sinter and CuSn-TLP based joining technologies on lead frame
Otto, A.; Schroeder, T.; Dudek, R.; Wang, W.-S.; Baum, M.; Wiemer, M.; Doering, R.; Kurian, J.J.; Murayama, K.; Oi, K.; Koyama, T.; Rzepka, S.
Conference Paper
2018Implantable multi-sensor system for hemodynamic controlling
Weidenmüller, Jens; Dogan, Özgü; Stanitzki, Alexander; Baum, Mario; Schröder, Tim; Wünsch, Dirk; Görtz, Michael; Grabmaier, Anton
Journal Article
2018An Improved Design for 2D Arrays of Capacitive Micromachined Ultrasound Transducers: Modeling, Fabrication, and Characterization
Baum, M.; Saeidi, N.; Vogel, K.; Schroeder, T.; Selvam, K.G.M.; Wiemer, M.; Otto, T.
Conference Paper
2018Parylene as a Dielectric Material for Electronic Applications in Space
Selbmann, F.; Baum, M.; Wiemer, M.; Joseph, Y.; Otto, T.
Conference Paper
2018Proton testing of the NXP P4080 processor at the COSY accelerator
Höffgen, Stefan; Liebender, Mirko; Baum, Max; Carl, Christopher; Felden, Olaf; Kündgen, Tobias; Lennartz, Wilhelm; Metzger, Stefan; Plettner, Samuel; Schön, Friedrich
Conference Paper
2018Strukturierungsverfahren
Fader, Robert; Lorenz, Jürgen; Rommel, Mathias; Baum, Mario; Danylyuk, Serhiy; Gillner, Arnold; Stollenwerk, Jochen; Bläsi, Benedikt
Book Article
20173D packaging for an implantable hemodynamic control system
Schroeder, T.; Baum, M.; Wuensch, D.; Wiemer, M.; Otto, T.
Journal Article, Conference Paper
20173D packaging technologies for smart medical implants
Schröder, Tim; Wünsch, Dirk; Baum, Mario; Hiller, Karla; Wiemer, Maik; Otto, Thomas; Weidenmüller, Jens; Dogan, Özgü; Utz, Alexander; Görtz, Michael
Conference Paper
2017Control of chiral magnetism through electric fields in multiferroic compounds above the long-range multiferroic transition
Stein, J.; Baum, Max; Holbein, S.; Finger, T.; Cronert, T.; Tölzer, C.; Fröhlich, T.; Biesenkamp, S.; Schmalzl, K.; Steffens, P.; Lee, C.H.; Braden, M.
Journal Article
2017Implantable hemodynamic controlling system with a highly miniaturized two axis acceleration sensor
Baum, Mario; Wünsch, Dirk; Hiller, Karla; Forke, Roman; Schröder, Tim; Weidlich, Sebastian; Hahn, Susann; Reuter, Danny; Wiemer, Maik; Weidenmüller, Jens; Dogan, Özgü; Görtz, Michael; Otto, Thomas
Conference Paper
2017Implantable multi sensor system for hemodynamic controlling
Weidenmüller, Jens; Dogan, Özgü; Stanitzki, Alexander; Baum, Mario; Schröder, Tim; Wünsch, Dirk; Görtz, Michael; Grabmaier, Anton
Conference Paper
2017Investigations on Parylene C for its integrability into MEMS
Selbmann, F.; Baum, M.; Hecker, C.; Roscher, F.; Enderlein, T.; Wiemer, M.; Joseph, Y.; Otto, T.
Conference Paper
2017Proton dosimetry at the accelerator COSY for radiation effect testing
Baum, Max; Felden, Olaf; Weinand, Udo; Höffgen, Stefan; Kuhnhenn, Jochen; Metzger, Stefan
Poster
2017Sensor components of a miniaturized implant for haemodynamic controlling
Weidenmüller, Jens; Dogan, Özgü; Stanitzki, Alexander; Baum, Mario; Wünsch, Dirk; Wiemer, Maik; Görtz, Michael
Journal Article, Conference Paper
2017Temporary wafer bonding - key technology for MEMS devices
Wuensch, D.; Purwin, L.; Büttner, L.; Martinka, R.; Schubert, I.; Junghans, R.; Baum, M.; Wiemer, M.; Otto, T.
Conference Paper
20163D integration technologies for MEMS
Geßner, T.; Hofmann, L.; Wang, W.-S.; Baum, M.; Seifert, T.; Wiemer, M.; Schulz, S.
Conference Paper
2016Centrifugation of micro particles and self-assembly of nano particles by capillary bridging for 3D thermal interconnects
Hofmann, C.; Baum, M.; Wang, W.-S.; Wiemer, M.
Conference Paper
2016Concept for a miniaturized cardiovascular multi sensor implant
Dogan, Özgü; Weidenmüller, Jens; Gembaczka, Pierre; Stanitzki, Alexander; Wünsch, Dirk; Baum, Mario; Wiemer, Maik; Görtz, Michael
Abstract
2016Deposition of parylene C and characterization of its hermeticity for the encapsulation of MEMS and medical devices
Selbmann, F.; Baum, M.; Wiemer, M.; Gessner, T.
Conference Paper
2016A highly miniaturized two-axis acceleration sensor for implantable hemody-namic controlling system
Wünsch, Dirk; Hiller, Karla; Forke, Roman; Baum, Mario; Wiemer, Maik; Geßner, Thomas; Görtz, Michael; Weidenmüller, Jens; Dogan, Özgü
Abstract
2016Investigation of surface pre-treatment methods for wafer-level Cu-Cu thermo-compression bonding
Tanaka, K.; Wang, W.-S.; Baum, M.; Froemel, J.; Hirano, H.; Tanaka, S.; Wiemer, M.; Otto, T.
Journal Article
2016Parylene C Deposition and Characterization of its Barrier Properties for the Encapsulation of MEMS for Medical Applications
Selbmann, F.; Baum, M.; Wiemer, M.; Gessner, T.
Conference Paper
2016Re-building the underfill: Performance of percolating fillers at package scale
Zschenderlein, U.; Baum, M.; Schlottig, G.; Schindler-Saefkow,F.; Kumar, S.G.; Wang, W.-S.; Brunschwiler, T.; Wunderle, B.
Conference Paper
2016Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K
Brunschwiler, T.; Zürcher, J.; Zimmermann, S.; Burg, B.R.; Schlottig, G.; Chen, X.; Sinha, T.; Baum, M.; Hofmann, C.; Pantou, R.; Achen, A.; Zschenderlein, U.; Kumar, S.; Wunderle, B.; Haupt, M.; Schindler-Saefkow, F.; Strässle, R.
Conference Paper
2015Aerosol jet printing of nano particle based electrical chip interconnects
Seifert, T.; Baum, M.; Roscher, F.; Wiemer, M.; Gessner, T.
Journal Article, Conference Paper
2015Assessment of mechanisms driving non-linear dose-response relationships in genotoxicity testing
Guerard, M.; Baum, M.; Bitsch, Annette; Eisenbrand, G.; Elhajouji, A.; Epe, B.; Habermeyer, M.; Kaina, B.; Martus, H.J.; Pfuhler, S.; Schmitz, C.; Sutter, A.; Thomas, A.D.; Ziemann, Christina; Froetschl, R.
Journal Article
2015Control of multiferroic domains by external electric fields in TbMnO₃
Stein, J.; Baum, Max; Holbein, S.; Cronert, T.; Hutanu, V.; Komarek, A.C.; Braden, M.
Journal Article
2015Low-temperature wafer bonding using solid-liquid inter-diffusion mechanism
Froemel, J.; Baum, M.; Wiemer, M.; Gessner, T.
Journal Article
2015Magnetic structure and multiferroic coupling in pyroxene NaFeSi2O6
Baum, Max; Komarek, A.C.; Holbein, S.; Fernández-Díaz, M.T.; André, G.; Hiess, A.; Sidis, Y.; Steffens, P.; Becker, P.; Bohatý, L.; Braden, M.
Journal Article
2015Mechanical characterization of sintered nanoparticles for advanced electrical and thermal joints
Zschenderlein, U.; Suresh, K.; Baum, M.; Wunderle, B.
Conference Paper
2015Nanoparticle assembly and sintering towards all-copper flip chip interconnects
Zürcher, J.; Yu, K.; Schlottig, G.; Baum, M.; Taklo, M.M.V.; Wunderle, B.; Warszyński, P.; Brunschwiler, T.
Conference Paper
2015Novel compliant fine pitch interconnect using Metal Coated Polymer Spheres
Wright, D.N.; Taklo, M.M.V.; Baum, M.; Hofmann, C.; Kristiansen, H.
Conference Paper
2015Self-assembly of micro- and nano-particles by centrifugal forces and capillary bridging for 3D thermal interconnects
Hofmann, C.; Baum, M.; Bodny, F.; Wiemer, M.; Gessner, T.; Brunschwiler, T.; Zürcher, J.; Burg, B.R.; Zimmermann, S.
Conference Paper
2015Strukturierungs- und Aufbautechnologien von 3-dimensional integrierten fluidischen Mikrosystemen
Baum, M.
Dissertation
2015TrackSort: Predictive tracking for sorting uncooperative bulk materials
Pfaff, F.; Baum, M.; Noack, B.; Hanebeck, U.D.; Gruna, Robin; Längle, Thomas; Beyerer, Jürgen
Conference Paper
2014Characterization of particle beds in percolating thermal underfills based on centrifugation
Zimmermann, S.; Brunschwiler, T.; Zuercher, J.; Burg, B.; Hong, G.; Poulikakos, D.; Baum, M.; Hofmann, C.
Conference Paper
2014Functional nano patterns realized by aligned nano imprint lithography
Baum, M.; Besser, J.; Wiemer, M.; Thanner, C.; Kreindl, G.; Wimplinger, M.; Gessner, T.
Conference Paper
2014Implantable MEMS sensors and medical MEMS packaging issues for future implants
Baum, M.; Haubold, M.; Wiemer, M.; Gessner, T.
Conference Paper, Journal Article
2014Improvement of copper bonding by analyzing the mechanical properties of the bond interface
Vogel, K.; Baum, M.; Roscher, F.; Wiemer, M.; Gessner, T.
Book Article
2014Solid Liquid Inter-Diffusion Bonding at Low Temperature
Frömel, J.; Baum, M.; Wiemer, M.; Gessner, T.
Conference Paper
2014Thermocompression bonding of semiconductor wafers
Frömel, J.; Baum, M.; Wiemer, M.
Book Article
2014Wafer bonding technologies for 3D integration
Baum, M.; Hofmann, C.; Besser, J.; Vogel, K.; Wiemer, M.; Gessner, T.
Conference Paper
20133D integration technologies for MEMS based on copper TSVs and copper-to-copper metal thermo compression bonding
Hofmann, L.; Baum, M.; Schulz, S.E.; Wiemer, M.; Geßner, T.
Conference Paper
2013Aluminum-germanium wafer bonding of (AlGaIn)N thin-film light-emitting diodes
Goßler, C.; Kunzer, M.; Baum, M.; Wiemer, M.; Moser, R.; Passow, T.; Köhler, K.; Schwarz, U.T.; Wagner, J.
Journal Article
2013Biocompatibility evaluation of MEMS packaging materials for implantable devices
Baum, M.; Haubold, M.; Besser, J.; Wiemer, M.; Gessner, T.
Journal Article, Conference Paper
2013Development and characterisation of 3D integration technologies for MEMS based on copper filled TSVs and copper-to-copper metal thermo compression bonding
Baum, M.; Hofmann, L.; Wiemer, M.; Schulz, S.E.; Gessner, T.
Conference Paper
2013Fabrication of subwavelength holes using nanoimprint lithography
Weiss, A.; Besser, J.; Baum, M.; Saupe, R.; Otto, T.; Gessner, T.
Conference Paper
2013Integrated smart systems for theranostic applications
Haubold, M.; Baum, M.; Wiemer, M.; Gessner, T.
Journal Article, Conference Paper
2013Laser melting of nanoparticulate transparent conductive oxide thin films
Baum, M.; Polster, S.; Jank, M.P.M.; Alexeev, I.; Frey, L.; Schmidt, M.
Journal Article
2013TSVs mit hohem Aspektverhältnis und Kupfer-Bonden für MEMS
Hofmann, L.; Baum, M.; Gottfried, K.; Schulz, S.E.; Wiemer, M.; Gessner, T.
Conference Paper
2012Development of transfer Electrostatic Carriers (T-ESC®) for thin 300mm wafer handling using seal glass bonding technology
Balaj, I.; Raschke, R.; Baum, M.; Uhlig, S.; Wiemer, M.; Gessner, T.; Grafe, J.
Conference Paper
2012Efficient laser induced consolidation of nanoparticulate ZnO thin films with reduced thermal budget
Baum, M.; Polster, S.; Jank, M.P.M.; Alexeev, I.; Frey, L.; Schmidt, M.
Journal Article
2012Evaluation of tracking methods for maritime surveillance
Fischer, Yvonne; Baum, M.; Flohr, F.; Hanebeck, U.D.; Beyerer, Jürgen
Conference Paper
2012Festigkeitsanalyse an thermokompressionsgebondeten Sensorstrukturen in Abhängigkeit von der Oberflächenvorbehandlung
Vogel, K.; Baum, M.; Roscher, F.; Kinner, R.; Rank, H.; Mayer, T.; Wiemer, M.; Gessner, T.
Conference Paper
2012Laser micromachining and micro hot embossing for highly integrated lab-on-chip systems
Enderlein, T.; Baum, M.; Nestler, J.; Otto, T.; Besser, J.; Wiemer, M.; John, B.; Hänel, J.; Gessner, T.
Conference Paper
2012Micro hot embossing and micro laser welding technologies for fluidic applications
Baum, M.; Besser, J.; John, B.; Keiper, B.; Hänel, J.; Wiemer, M.; Gessner, T.
Conference Paper
2012Sensormodul und Verfahren zum Herstellen eines Sensormoduls
Roscher, F.; Baum, M.; Wiemer, M.; Geßner, T.; Gebhardt, C.
Patent
2012Si interposer technologies for three dimensional AMR sensor systems
Raukopf, S.; Gebhardt, C.; Roscher, F.; Baum, M.; Kinner, R.; Wiemer, M.; Gessner, T.
Conference Paper
2012Thermal and UV nanoimprint lithography for applications from the micro to the nano scale
Besser, J.; Baum, M.; Wiemer, M.; Gessner, T.; Sanchez-Ordonez,S.; Thanner, C.; Vetter, C.
Conference Paper
2011Aluminum-germanium wafer bonding of (AlGaIn)N thin film light-emitting diodes
Gossler, C.; Kunzer, M.; Baum, M.; Wiemer, M.; Moser, R.; Passow, T.; Koehler, K.; Schwarz, U.T.; Wagner, J.
Abstract
2011CMP process development and adaption for wafer bonding
Schubert, I.; Gottfried, K.; Wuensch, D.; Baum, M.; Martinka, R.
Conference Paper
2011FEM simulation and its application in MEMS design
Jia, C.; Reuter, D.; Wen, Z.; Baum, M.; Wiemer, M.; Gessner, T.
Conference Paper
2011Investigations of thermocompression bonding with thin metal layers
Froemel, J.; Baum, M.; Wiemer, M.; Roscher, F.; Haubold, M.; Jia, C.; Gessner, T.
Conference Paper
2011Low temperature wafer bonding technologies
Haubold, M.; Baum, M.; Schubert, I.; Leidich, S.; Wiemer, M.; Gessner, T.
Conference Paper
2011Mechanical and electrical packaging technologies by the application of functional layers at micro and nano scale
Haubold, M.; Baum, M.; Wiemer, M.; Gessner, T.
Conference Paper
2011Metal thermo compression bonding at wafer level and its capabilities for 3D integration
Baum, M.; Roscher, F.; Froemel, J.; Jia, C.; Rank, H.; Hausner, R.; Reichenbach, R.; Wiemer, M.; Gessner, T.
Conference Paper
2011Nano patterned surfaces and their influence on living cells
Baum, M.; Besser, J.; Vetter, C.; Sanchez Ordonez, S.; Wang, X.; Harazim, S.; Schmidt, O.; Wiemer, M.; Gessner, T.
Conference Paper, Journal Article
2011New generation of electrostatic carrier technology (T-ESC) for reversible thin wafer clamping with seal glass bonding
Balaj, I.; Raschke, R.; Baum, M.; Uhlig, S.; Wiemer, M.; Gessner, T.
Abstract
2011Si interposer technologies for three dimensional sensor systems
Roscher, F.; Baum, M.; Gebhardt, C.; Raukopf, S.; Wiemer, M.; Gessner, T.
Conference Paper
2010Data association in a world model for autonomous systems
Baum, M.; Gheta, I.; Belkin, A.; Beyerer, J.; Hanebeck, U.D.
Conference Paper
2010Eutectic wafer bonding for 3D integration
Baum, M.; Jia, C.; Haubold, M.; Wiemer, M.; Schneider, A.; Rank, H.; Trautmann, A.; Gessner, T.
Conference Paper
2010Extended object and group tracking: A comparison of random matrices and random hypersurface models
Baum, M.; Feldmann, F.; Fränken, D.; Hanebeck, U. D.; Koch, W.
Conference Paper
2010Mikrostrukturierung von dünnen Kunststofffolien durch Heißprägen
Baum, M.; Vetter, C.; Haehnel, M.; Hänel, J.; Wiemer, M.; Geßner, T.
Conference Paper
2010Nanofabrication of reactive structure for low temperature bonding
Lin, Y.; Bräuer, J.; Hofmann, L.; Baum, M.; Frömel, J.; Wiemer, M.; Esashi, M.; Gessner, T.
Conference Paper
2010Three pillar information management system for modeling the environment of autonomous systems
Gheta, I.; Baum, M.; Belkin, A.; Beyerer, J.; Hanebeck, U.D.
Conference Paper
2009Characterization of eutectic wafer bonding using gold and silicon
Lin, Y.; Baum, M.; Haubold, M.; Frömel, J.; Wiemer, M.; Gessner, T.; Esashi, M.
Conference Paper
2009Development and evaluation of AuSi eutectic wafer bonding
Lin, Y.; Baum, M.; Haubold, M.; Frömel, J.; Wiemer, M.; Gessner, T.; Esashi, M.
Conference Paper
2009Electrochemical deposition of reactive nanoscale metallization systems for low temperature bonding in 3D integration
Hofmann, L.; Braeuer, J.; Baum, M.; Schulz, S.E.; Gessner, T.
Conference Paper
2009Mikrosensoren überwachen Endoprothesen
Baum, M.; Boese-Landgraf, J.; Gessner, T.
Conference Paper
2009Mikrostruktur, Verfahren zu deren Herstellung, Vorrichtung zum Bonden einer Mikrostruktur und Mikrosystem
Baum, M.; Bräuer, J.; Gessner, T.; Hofmann, L.; Froemel, J.; Letsch, H.; Wiemer, M.
Patent
2009Reaktives Mikrofügen unter Ausnutzung nanoskaliger Effekte
Bräuer, J.; Baum, M.; Wiemer, M.; Gessner, T.
Conference Paper
2009Smart integrated systems: From components to products
Gessner, T.; Baum, M.; Gessner, W.; Lugert, G.
Book Article
2009Solid-Liquid-Interdiffusion Bonding für 3D-Integration und Wafer-Level-Packaging
Baum, M.; Hofmann, L.; Wiemer, M.; Gessner, T.
Conference Paper
2009Using of reactive multilayer systems for room temperature bonding of micro components
Bräuer, J.; Baum, M.; Wiemer, M.; Gessner, T.
Conference Paper
2008Fabrication of magnetic polymer membranes with microfluidic functionality
Morschhauser, A.; Nestler, J.; Baum, M.; Schüller, M.; Jänig, O.; Otto, T.; Gessner, T.
Conference Paper
2008Lasermikrostrukturierung von dünnen Polymersubstraten
Hänel, J.; Keiper, B.; Baum, M.
Journal Article
2008Micro machining technologies for non silicon materials
Baum, M.; Rota, A.; Salk, N.; Otto, T.; Gessner, T.
Conference Paper
2008Mikrofluidische Schnittstellen durch Laserstrukturierung
Baum, M.; Keiper, B.; Hänel, J.; Otto, T.; Gessner, T.
Journal Article
2008Mikropumpe und Verfahren zum Pumpen eines Fluids
Otto, T.; Schüller, M.; Nestler, J.; Gessner, T.; Baum, M.; Morschhauser, A.
Patent
2008Spectroscopic ellipsometry study of thin diffusion barriers of TaN and Ta for Cu interconnects in integrated circuits
Baum, M.; Letsch, H.; Shaporin, A.V.; Otto, T.; Gessner, T.
Conference Paper
2007Development and characterization of Cu to Cu bonding technology
Baum, M.; Letsch, H.; Shaporin, A.V.; Otto, T.; Gessner, T.
Conference Paper
2007Integrated polymer multimode waveguides for microfluidic sensing applications
Otto, T.; Nestler, J.; Baum, M.; Schroeder, H.; Ebling, F.; Bruch, R.; Gessner, T.
Conference Paper
2007Das intelligente Produkt gewinnt
Baum, M.; Gessner, T.
Journal Article
2007Mikrostrukturierung von Kunststoffen durch Heißprägen und Laserablation
Baum, M.; Mann, M.; Ebling, F.; Keiper, B.; Haenel, J.; Otto, T.; Gessner, T.
Conference Paper
2007Siliziumätzen schafft Sensibilität
Baum, M.; Gessner, T.
Journal Article
2007Smart Hip Joint Implants
Baum, M.; Schaufuß, J.; Boese-Landgraf, J.; Otto, T.; Gessner, T.
Conference Paper
2006Gelenkprothese und Verfahren zum Messen einer Abnutzung in dieser Gelenkprothese
Baum, M.; Hientzsch, M.
Patent
2006Smart Systems Integration - Eine Herausforderung für zukünftige Mikro- und Nanotechnologien
Gessner, T.; Baum, M.; Hiller, K.; Mehner, J.; Wiemer, M.; Otto, T.; Saupe, R.; Nestler, J.
Conference Paper
2005Improved silicon master tools for hot embossing
Baum, M.; Nestler, J.; Rost, D.; Weissmantel, S.; Otto, T.; Reisse, G.; Gessner, T.
Conference Paper
2005Mikrofluidische Vorrichtung fuer die optische Analyse
Otto, T.; Nestler, J.; Baum, M.; Gessner, T.
Patent
2005Verschleißmonitoring bei Hüftgelenkendoprothesen durch integrierte Mikrosensorik
Baum, M.; Hientzsch, M.; Boese-Landgraf, J.; Otto, T.; Gessner, T.
Conference Paper
2004Potentials for Microsystems in Biotechnology and Healthcare
Nestler, J.; Baum, M.; Otto, T.; Geßner, T.
Conference Paper, Journal Article
2003Harmonic Analysis of Microbeams with PZT on-Chip Actuating and Sensing
Zhou, J.; Baum, M.; Schmiedel, R.; Huang, Y.; Ruan, G.; Geßner, T.
Conference Paper, Journal Article