Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
20193D system integration on 300 mm wafer level
Kilige, S.; Bartusseck, I.; Junige, M.; Neumann, V.; Reif, J.; Wenzel, C.; Böttcher, M.; Albert, M.; Wolf, M.J.; Bartha, J.W.
Journal Article
2017Atomic Layer Deposition (ALD) and characterization of Ti- and Co-based films for Lithium-Ion Batteries (LIB)
Hoßbach, C.; Neumann, V.; Reddy, K.D.S.; Bönhardt, S.; Stoeck, A.; Fischer, D.; Reif, J.; Shukla, S.; Zybell, S.; Albert, M.; Giebeler, L.; Bartha, J.W.
Poster
2017Modellierung und Simulation des Chemisch-mechanischen Planarisierens unter besonderer Berücksichtigung langreichweitiger Wechselwirkungen auf der Chipskala
Bott, Sascha
: Gerlach, G.; Bartha, J.W.; Heitmann, J.
Dissertation
2013Enhanced growth and Cu diffusion barrier properties of thermal ALD TaNC films in Cu/low-k interconnects
Wojcik, H.; Hossbach, C.; Kubasch, C.; Verdonck, P.; Barbarin, Y.; Merkel, U.; Bartha, J.W.; Hübner, R.; Engelmann, H.-J.; Friedemann, M.
Journal Article
2013A method for characterizing the pad surface texture and modeling its impact on the planarization in CMP
Vasilev, B.; Bott, S.; Rzehak, R.; Liske, R.; Bartha, J.W.
Journal Article
2013Pad roughness evolution during break-in and its abrasion due to the pad-wafer contact in oxide CMP
Vasilev, B.; Bott, S.; Rzehak, R.; Bartha, J.W.
Journal Article
2012Electrical evaluation of Ru-W(-N), Ru-Ta(-N) and Ru-Mn films as Cu diffusion barriers
Wojcik, H.; Kaltofen, R.; Merkel, U.; Krien, C.; Strehle, S.; Gluch, J.; Knaut, M.; Wenzel, C.; Preusse, A.; Bartha, J.W.; Geidel, M.; Adolphi, B.; Neumann, V.; Liske, R.; Munnik, F.
Journal Article, Conference Paper
2012Evaluation of direct patternable inorganic spin-on hard mask materials using electron beam lithography
Thrun, X.; Choi, K.H.; Freitag, M.; Grenville, A.; Gutsch, M.; Hohle, C.; Stowers, J.K.; Bartha, J.W.
Conference Paper, Journal Article
2012A feature scale Greenwood-Williamson model predicting pattern-size effects in CMP
Vasilev, B.; Bott, S.; Rzehak, R.; Kücher, P.; Bartha, J.W.
Journal Article
2011A CMP model including global distribution of pressure
Bott, S.; Rzehak, R.; Vasilev, B.; Kücher, P.; Bartha, J.W.
Journal Article
2011Comparison of PVD, PECVD and PEALD Ru-TaN films with high Ru concentration for direct Cu plating
Wojcik, H.; Merkel, U.; Bartha, J.W.; Li, J.; Lehninger, D.; Engelmann, H.J.; Popatov, P.; Gluch, J.; Knaut, M.; Strehle, S.; Wenzel, C.; Adolphi, B.; Neumann, V.; Liske, R.
Conference Paper
2011Greenwood-Williamson model combining pattern-density and pattern-size effects in CMP
Vasilev, B.; Rzehak, R.; Bott, S.; Kücher, P.; Bartha, J.W.
Journal Article
2011Investigations on Ru-Mn films as plateable Cu diffusion barriers
Wojcik, H.; Kaltofen, R.; Krien, C.; Merkel, U.; Wenzel, C.; Bartha, J.W.; Friedemann, M.; Adolphi, B.; Liske, R.; Neumann, V.; Geidel, M.
Conference Paper
2011Pad roughness effects on the planarization and material removal rate in CMP processes
Vasilev, B.; Bott, S.; Rzehak, R.; Kücher, P.; Bartha, J.W.
Conference Paper
2010Applications of microstructured silicon wafers as internal reflection elements in attenuated total reflection Fourier transform infrared spectroscopy
Schumacher, H.; Künzelmann, U.; Vasilev, B.; Eichhorn, K.-J.; Bartha, J.W.
Journal Article
2010Enhancing epitaxial SixC1-x deposition by adding Ge
Ostermay, I.; Kammler, T.; Bartha, J.W.; Kücher, P.
Journal Article
2010In situ reaction mechanism studies on ozone-based atomic layer deposition of Al2O3 and HfO2
Rose, M.; Niinistö, J; Endler, I.; Bartha, J.W.; Kücher, P.; Ritala, M.
Journal Article
2010Microstructure in copper interconnects - Influence of plating additive concentration
Neuner, J.; Zienert, I.; Peeva, A.; Preusse, A.; Kücher, P.; Bartha, J.W.
Conference Paper, Journal Article
2010SiGe channels for higher mobility CMOS devices
Naumann, A.; Kelwing, T.; Trentzsch, M.; Kronholz, S.; Kammler, T.; Flachowsky, S.; Herrmann, T.; Kücher, P.; Bartha, J.W.
Conference Paper
2010Temperature dependence of the sticking coefficient in atomic layer deposition
Rose, M.; Bartha, J.W.; Endler, I.
Journal Article
2009Atomic layer deposition of titanium dioxide thin films from Cp*Ti(OMe)3 and ozone
Rose, M.; Niinistö, J; Michalowski, P.; Gerlich, L.; Wilde, L.; Endler, I.; Bartha, J.W.
Journal Article
2009Fast backscattering parameter determination in e-beam lithography with a modified doughnut test
Keil, K.; Hauptmann, M.; Choi, K.H.; Kretz, J.; Eng, L.M.; Bartha, J.W.
Journal Article
2009Influence of additive coadsorption on copper superfill behavior
Liske, R.; Wehner, S.; Preusse, A.; Kuecher, P.; Bartha, J.W.
Journal Article
2009Method to determine the sticking coefficient of precursor molecules in atomic layer deposition
Rose, M.; Bartha, J.W.
Journal Article
2009Properties of plasma-enhanced atomic layer deposition-grown tantalum carbonitride thin films
Hossbach, C.; Teichert, S.; Thomas, J.; Wilde, L.; Wojcik, H.; Schmidt, D.; Adolphi, B.; Bertram, M.; Mühle, U.; Albert, M.; Menzel, S.; Hintze, B.; Bartha, J.W.
Journal Article
2008Electrochemical Cu deposition in sub-100-nm interconnects
Liske, R.; Preusse, A.; Wehner, S.; Kücher, P.; Bartha, J.W.
Conference Paper
2008Investigation of the relaxation behavior of Si1-xCx alloys during epitaxial UHV-CVD growth
Ostermay, I.; Kammler, T.; Naumann, A.; Bartha, J.W.; Kücher, P.
Journal Article
2008Novel enhanced stressors with graded encapsulated SiGe embedded in the source and drain areas
Naumann, A.; Kronholz, S.; Mowry, A.; Ostermay, I.; Bierstedt, H.; Trui, B.; Dittmar, K.; Kücher, P.; Bartha, J.W.; Kammler, T.
Journal Article
2005Hafnium oxide for optical applications deposited by different CMOS compatible methods
Albert, M.; Rößler, T.; Adolphi, B.; Bartha, J.W.; Grüger, H.; Kunath, C.; Sorge, S.
Conference Paper
2002Improvement of Ta-based thin-film barriers on copper by ion- implantation of nitrogen and oxygen
Wieser, E.; Peikert, M.; Wenzel, C.; Schreiber, J.; Bartha, J.W.; Bendjus, B.; Melov, V.V.; Reuther, H.; Mucklich, A.; Adolphi, B.; Fischer, D.
Journal Article
2002Integration of high dielectric Ba0.5Sr0.5TiO3 films into amorphous TaSiN barrier layer structures
Wenger, C.; Albert, M.; Adolphi, B.; Heuer, H.; Bartha, J.W.; Schlenkrich, F.
Journal Article