Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2017HED-TIE: A wafer-scale approach for fabricating hybrid electronic devices with trench isolated electrodes
Banerjee, S.; Bülz, D.; Solonenko, D.; Reuter, D.; Deibel, C.; Hiller, K.; Zahn, D.R.T.; Salvan, G.
Journal Article
2017Light-induced magnetoresistance in solution-processed planar hybrid devices measured under ambient conditions
Banerjee, S.; Bülz, D.; Reuter, D.; Hiller, K.; Zahn, D.R.T.; Salvan, G.
Journal Article
2015Preparation and characterization of silicon nanowires using SEM/FIB and TEM
Banerjee, Sayanti; Mühle, Uwe; Löffler, Markus; Heinzig, André; Trommer, Jens; Zschech, Ehrenfried
Journal Article, Conference Paper
2015Quantitative ultrasonic characterization of c-axis oriented polycrystalline AlN thin film for smart device application
Habib, A.; Shelke, A.; Vogel, M.; Brand, S.; Jiang, X.; Pietsch, U.; Banerjee, S.; Kundu, T.
Journal Article
2015TEM study of schottky junctions in reconfigurable silicon nanowire devices
Banerjee, Sayanti; Löffler, Markus; Mühle, Uwe; Berent, Katarzyna; Heinzig, A.; Trommer, J.; Weber, Walter; Zschech, Ehrenfried
Journal Article
2015TSCuPc/Au hybrid trench devices. A comparative study of solution processed and thermally evaporated molecular channels
Banerjee, S.; Bülz, D.; Reuter, D.; Hiller, K.; Gessner, T.; Salvan, G.; Zahn, D.R.T.
Abstract
2014In-situ investigations of individual nanowires within a FIB/SEM system
Löffler, Markus; Banerjee, Sayanti; Trommer, Jens; Heinzig, André; Weber, Walter; Zschech, Ehrenfried
Journal Article, Conference Paper
2014Organic lateral trench devices fabricated by trench technology
Banerjee, S.; Richter, P.; Buelz, D.; Reuter, D.; Hiller, K.; Gessner, T.; Zahn, D.R.T.; Salvan, G.
Abstract
2013Laterally stacked organic devices fabricated by trench technology
Reuter, D.; Banerjee, S.; Fronk, M.; Salvan, G.; Hiller, K.; Zahn, D.R.T.; Gessner, T.
Conference Paper