Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system
Adamietz, Raphael; Desmulliez, Marc P.Y.; Pavuluri, Sumanth Kumar; Tilford, Tim; Bailey, Chris; Schreier-Alt, Thomas; Warmuth, Jens
Journal Article
2018Design, manufacture and test for reliable 3D printed electronics packaging
Tilford, Tim; Stoyanov, Stoyan; Braun, Jessica; Janhsen, Jan Christoph; Burgard, Matthias; Birch, Richard; Bailey, Chris
Journal Article
2012Encapsulation of microelectronic components using open-ended microwave oven
Pavuluri, Sumanth Kumar; Ferenets, Marju; Goussetis, George; Desmulliez, Marc P.Y.; Tilford, Tim; Adamietz, Raphael; Müller, Guido; Eicher, Frank; Bailey, Chris
Journal Article
2012A microwave curing system for microelectronics assembly
Adamietz, Raphael; Tilford, Tim; Ferenets, Marju; Pavuluri, Sumanth Kumar; Desmulliez, Marc P.Y.; Bailey, Chris
Conference Paper
2011Assessment of the accuracy of cure kinetics models and fitting approaches utilised in analysis of microelectronics encapsulation materials
Tilford, Tim; Ferenets, Marju; Adamietz, Raphael; Pavuluri, Sumanth Kumar; Desmulliez, Marc P.Y.; Bailey, Chris
Conference Paper
2011Post cure behaviour of encapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator
Pavuluri, Sumanth Kumar; Desmulliez, Marc P.Y.; Goussetis, George; Arrighi, Valeria; Johnston, K.; Adamietz, Raphael; Tilford, Tim; Bailey, Chris
Conference Paper
2010Advances in the design and test of a novel open ended microwave oven
Pavuluri, Sumanth Kumar; Tilford, Tim; Goussetis, George; Desmulliez, Marc P.Y.; Ferenets, Marju; Adamietz, R.; Eicher, F.; Bailey, Chris
Conference Paper
2010Experimental investigation of open-ended microwave oven assisted encapsulation process
Pavuluri, Sumanth Kumar; Ferenets, Marju; Goussetis, George; Desmulliez, Marc P.Y.; Tilford, Tim; Adamietz, Raphael; Müller, Guido; Eicher, Frank; Bailey, Chris
Conference Paper
2010Numerical analysis of microwave underfill cure in ball-grid packages
Tilford, Tim; Ferenets, Marju; Adamietz, Raphael; Pavuluri, Sumanth Kumar; Morris, James E.; Desmulliez, Marc P.Y.; Bailey, Chris
Conference Paper
2010Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages
Tilford, Tim; Ferenets, Marju; Adamietz, Raphael; Pavuluri, Sumanth Kumar; Morris, James E.; Desmulliez, Marc P.Y.; Bailey, Chris
Conference Paper
2010On the integration of microwave curing systems into microelectronics assembly processes
Adamietz, Raphael; Müller, Guido; Othman, Nabih; Eicher, Frank; Tilford, Tim; Ferenets, Marju; Pavuluri, Sumanth Kumar; Desmulliez, Marc P.Y.; Bailey, Chris
Conference Paper
2010On the Numerical Analysis of Microwave Processes in Microsystems Packaging Applications
Tilford, Tim; Ferenets, Marju; Pavuluri, Sumanth Kumar; Müller, Guido; Adamietz, Raphael; Bailey, Chris; Desmulliez, Marc P.Y.
Conference Paper