Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Advanced performance testing of anti-soiling coatings - Pt.I: Sequential laboratory test methodology covering the physics of natural soiling processes
Ilse, K.; Khan, M.Z.; Voicu, N.; Naumann, V.; Hagendorf, C.; Bagdahn, J.
Journal Article
2019Advanced performance testing of anti-soiling coatings - Pt.II: Particle-size dependent analysis for physical understanding of dust removal processes and determination of adhesion forces
Ilse, K.; Khan, M.Z.; Voicu, N.; Naumann, V.; Hagendorf, C.; Bagdahn, J.
Journal Article
2018Comparing indoor and outdoor soiling experiments for different glass coatings and microstructural analysis of particle caking processes
Ilse, K.K.; Rabanal, J.; Schönleber, L.; Khan, M.Z.; Naumann, V.; Hagendorf, C.; Bagdahn, J.
Journal Article
2018Comprehensive analysis of soiling and cementation processes on PV modules in Qatar
Ilse, K.K.; Figgis, B.W.; Werner, M.; Naumann, V.; Hagendorf, C.; Pöllmann, H.; Bagdahn, J.
Journal Article
2018Fundamentals of soiling processes on photovoltaic modules
Ilse, K.K.; Figgis, B.W.; Naumann, V.; Hagendorf, C.; Bagdahn, J.
Journal Article
2017Verfahren zur Stabilisierung der Konversionseffizienz von Siliziumsolarzellen
Lausch, Dominik; Gläser, Marcus; Bagdahn, Jörg
Patent
2016Microstructural analysis of the cementation process during soiling on glass surfaces in arid and semi-arid climates
Ilse, K.; Werner, M.; Naumann, V.; Figgis, B.W.; Hagendorf, C.; Bagdahn, J.
Journal Article
2016Optimized tab width in half-cell modules
Hanifi, H.; Dassler, D.; Schneider, J.; Turek, M.; Schindler, S.; Bagdahn, J.
Journal Article, Conference Paper
2015High-resolution structural investigation of passivated interfaces of silicon solar cells
Richter, S.; Kaufmann, K.; Naumann, V.; Werner, M.; Graff, A.; Grosser, S.; Moldovan, A.; Zimmer, M.; Rentsch, J.; Bagdahn, J.; Hagendorf, C.
Journal Article
2015Photovoltaikzellen-Module. Prüfgerät erkennt den PID-Effekt bereits auf Zellenebene
Bagdahn, J.; Naumann, V.; Lausch, D.; Hagendorf, C.
Journal Article
2014Explanation of potential-induced degradation of the shunting type by Na decoration of stacking faults in Si solar cells
Naumann, V.; Lausch, D.; Hähnel, A.; Bauer, J.; Breitenstein, O.; Graff, A.; Werner, M.; Swatek, S.; Großer, S.; Bagdahn, J.; Hagendorf, C.
Journal Article
2014Potential-Induced Degradation (PID): Introduction of a novel test approach and explanation of increased depletion region recombination
Lausch, D.; Naumann, V.; Breitenstein, O.; Bauer, J.; Graff, A.; Bagdahn, J.; Hagendorf, C.
Journal Article
2014Sodium outdiffusion from stacking faults as root cause for the recovery process of potential-induced degradation (PID)
Lausch, D.; Naumann, V.; Graff, A.; Hähnel, A.; Breitenstein, O.; Hagendorf, C.; Bagdahn, J.
Conference Paper, Journal Article
2014Verfahren zur Prüfung der Anfälligkeit für potentialinduzierte Degradation bei Komponenten von Solarmodulen
Naumann, Volker; Lausch, Dominik; Hagendorf, Christian; Bagdahn, Jörg
Patent
2013Kerfless wafering for silicon wafers by using a reusable metal layer
Schoenfelder, S.; Breitenstein, O.; Rissland, S.; Donno, R. de; Bagdahn, J.
Journal Article, Conference Paper
2013Microstructural analysis of crystal defects leading to potential-induced degradation (PID) of Si solar cells
Naumann, V.; Lausch, D.; Großer, S.; Werner, M.; Swatek, S.; Hagendorf, C.; Bagdahn, J.
Journal Article, Conference Paper
2013The role of stacking faults for the formation of shunts during potential-induced degradation of crystalline Si solar cells
Naumann, V.; Lausch, D.; Graff, A.; Werner, M.; Swatek, S.; Bauer, J.; Hähnel, A.; Breitenstein, O.; Großer, S.; Bagdahn, J.; Hagendorf, C.
Journal Article
2013Systematic investigation of cracks in encapsulated solar cells after mechanical loading. Review
Sander, M.; Dietrich, S.; Pander, M.; Ebert, M.; Bagdahn, J.
Journal Article
2013Zuverlässigkeitsuntersuchungen für Solarzellen basierend auf Elektrolumineszenz-Rissfortschrittsanalysen an speziellen Prüfkörpern
Sander, M.; Dietrich, S.; Pander, M.; Ebert, M.; Bagdahn, J.
Conference Paper
2012Failure mechanisms and mechanical characterization of reactive bonded interfaces
Boettge, B.; Schippel, F.; Naumann, F.; Berthold, L.; Lorenz, G.; Gerbach, R.; Bagdahn, J.; Petzold, M.
Conference Paper, Journal Article
2012Investigations on cracks in embedded solar cells after thermal and mechanical loading
Sander, M.; Dietrich, S.; Pander, M.; Ebert, M.; Thormann, S.; Wendt, J.; Bagdahn, J.
Conference Paper
2012Micro structural root cause analysis of potential induced degradation in c-Si solar cells
Naumann, V.; Hagendorf, C.; Grosser, S.; Werner, M.; Bagdahn, J.
Journal Article, Conference Paper
2012Strength of thin silicon wafers with via holes
Schoenfelder, S.; Kaule, F.; Oswald, M.; Bagdahn, J.; Petzold, M.
Conference Paper
2011The influence of transport operations on the wafer strength and breakage rate
Köpge, Ringo; Schönfelder, Stephan; Giesen, Tim; Fischmann, Christian; Verl, Alexander; Bagdahn, Jörg
Conference Paper
2011Investigations on crack development and crack growth in embedded solar cells
Sander, M.; Dietrich, S.; Pander, M.; Schweizer, S.; Ebert, M.; Bagdahn, J.
Conference Paper
2011Mechanical characterisation and modelling of thin chips
Schoenfelder, S.; Bagdahn, J.; Petzold, M.
Book Article
2011Reduction of soldering induced stresses in solar cells by microstructural optimization of copper-ribbons
Meier, R.; Pander, M.; Klengel, R.; Dietrich, S.; Klengel, S.; Ebert, M.; Bagdahn, J.
Conference Paper
2011Systematische Untersuchung der Rissentstehung und des Rissfortschritts in eingebetteten Solarzellen
Sander, M.; Henke, B.; Schweizer, S.; Dietrich, S.; Pander, M.; Ebert, M.; Bagdahn, J.
Conference Paper
2010Characterization of PV Modules by Combination of Mechanical and Electrical Analysis Methods
Sander, M.; Henke, B.; Schweizer, S.; Ebert, M.; Bagdahn, J.
Conference Paper
2010Characterization of PV modules by combining results of mechanical and electrical analysis methods
Sander, M.; Henke, B.; Schwarz, H.; Dietrich, S.; Schweizer, S.; Ebert, M.; Bagdahn, J.
Conference Paper
2010Fabrication and characterization of reactive nanoscale multilayer systems for low-temperature bonding in microsystem technology
Boettge, B.; Braeuer, J.; Wiemer, M.; Petzold, M.; Bagdahn, J.; Gessner, T.
Journal Article
2010Identification of mechanical defects in MEMS using dynamic measurements for application in production monitoring
Gerbach, R.; Ebert, M.; Brokmann, G.; Hein, T.; Bagdahn, J.
Journal Article
2010Infrared birefringence imaging of residual stress and bulk defects in multicrystalline silicon
Ganapati, V.; Schoenfelder, S.; Castellanos, S.; Oener, S.; Koepge, R.; Sampson, A.; Marcus, M.A.; Lai, B.; Morhenn, H.; Hahn, G.; Bagdahn, J.; Buonassisi, T.
Journal Article
2010Investigations of laser and design parameters of via holes on mechanical strength of metal wrap through solar cells
Schoenfelder, S.; Oswald, M.; Fischer, C.; Zühlke, H.-U.; Berbig, C.; Geppert, T.; Wütherich, T.; Krokoszinski, H.-J.; Bagdahn, J.
Conference Paper
2010Mechanical behavior and lamination issues of solar modules containing elastomeric and amorphous encapsulates
Schulze, S.H.; Ehrich, C.; Ebert, M.; Bagdahn, J.
Conference Paper
2010Numerical simulations of thermo-mechanical stresses during the casting of multi-crystalline silicon ingots
Oswald, M.; Turek, M.; Bagdahn, J.
Conference Paper
2010PV module defect detection by combination of mechanical and electrical analysis methods
Sander, M.; Henke, B.; Schweizer, S.; Ebert, M.; Bagdahn, J.
Conference Paper
2010Reliability of copper-ribbons in photovoltaic modules under thermo-mechanical loading
Meier, R.; Kraemer, F.; Wiese, S.; Wolter, K.-J.; Bagdahn, J.
Conference Paper
2010Semiconductor Wafer Bonding 11: Preface
Colinge, C.; Bagdahn, J.; Baumgart, H.; Hobart, K.; Moriceau, H.; Suga, T.
Journal Article, Conference Paper
2010Thermal cycling induced load on copper-ribbons in crystalline photovoltaic modules
Meier, R.; Kraemer, F.; Wiese, S.; Wolter, K.-J.; Bagdahn, J.
Conference Paper
2009Characterization of reactive nano scale multilayer foils for microsystem applications
Boettge, B.; Teuscher, N.; Schischka, J.; Krause, M.; Richter, S.; Heilmann, A.; Petzold, M.; Bagdahn, J.
Conference Paper
2009Constitutive behaviour of copper ribbons used in solar cell assembly processes
Wiese, S.; Meier, R.; Kraemer, F.; Bagdahn, J.
Conference Paper
2009Identification of mechanical defects in MEMS using dynamic measurements for application in the production monitoring
Gerbach, R.; Ebert, M.; Brokmann, G.; Hein, T.; Bagdahn, J.
Conference Paper
2009Local electronic properties and microstructure of individual laser-fired contacts
Naumann, V.; Hagendorf, C.; Werner, M.; Henke, B.; Schmidt, C.; Nekarda, J.-F.; Bagdahn, J.
Conference Paper
2009Tensile testing of individual ultrathin electrospun poly(L-lactic acid) fibers
Jaeger, D.; Schischka, J.; Bagdahn, J.; Jaeger, R.
Journal Article
2008Development of a model for simulating stress distributions and transport phenomena in electro-spun scaffolds
Jaeger, D.; Henrichs, B.; Schischka, J.; Bagdahn, J.; Moseler, M.; Jaeger, R.
Conference Paper
2008Development of test procedures for polymer material characterization in view of long-term durability of PV-modules
Schulze, S.-H.; Dietrich, S.; Ebert, M.; Bagdahn, J.
Conference Paper
2008Fast characterization of silicon membrane structures by laser-doppler vibrometry
Gerbach, R.; Ebert, M.; Bagdahn, J.
Conference Paper
2008High-cycle fatigue and strengthening in polycrystalline silicon
Boroch, R.E.; Müller-Fiedler, R.; Bagdahn, J.; Gumbsch, P.
Journal Article
2008Laser transmission bonding of silicon-to-silicon and silicon-to-glass for wafer level packaging and microsystems
Sari, F.; Wiemer, M.; Bernasch, M.; Bagdahn, J.
Conference Paper
2008Mechanical characterization and micro structure diagnostics of glass frit bonded interfaces
Boettge, B.; Dresbach, C.; Graff, A.; Petzold, M.; Bagdahn, J.
Conference Paper
2008Mechanical strength of mono- and multicrystalline wafers
Schönfelder, S.; Bohne, A.; Bagdahn, J.
Conference Paper
2008Solarmodul sowie Verfahren zur Herstellung eines Solarmoduls
Busch, M.; Bagdahn, J.
Patent
2008A standard method for measuring wafer bond strength for MEMS applications
Allen, R.A.; Marshall, J.; Baylies, W.; Read, D.; Delrio, F.; Turner, K.T.; Bernasch, M.; Bagdahn, J.
Conference Paper
2008Verfahren zur mechanischen Charakterisierung von Produktionsmaschinen fuer sproedbrechende Materialien
Kray, D.; Bagdahn, J.; Schoenfelder, S.
Patent
2007Bonding and reliability for 3D mechanical, optical and fluidic systems
Wiemer, M.; Bagdahn, J.; Beckert, E.; Eichler, M.; Hollaender, A.; Vogel, D.
Conference Paper
2007Characterization of strength properties of thin polycrystalline silicon films for MEMS applications
Boroch, R.; Wiaranowski, J.; Mueller-Fiedler, R.; Ebert, M.; Bagdahn, J.
Journal Article
2007Comparison of test methods for strength characterization of thin solar wafer
Schönfelder, S.; Bohne, A.; Bagdahn, J.
Conference Paper
2007Dynamic analyses of membranes and thin films on wafer level
Gerbach, R.; Naumann, F.; Ebert, M.; Bagdahn, J.; Klattenhoff, J.; Rembe, C.
Conference Paper
2007Investigations of the influence of dicing techniques on the strength properties of thin silicon
Schönfelder, S.; Ebert, M.; Landesberger, C.; Bock, K.; Bagdahn, J.
Journal Article
2007Measurement of dynamic properties of MEMS and the possibilities of parameter identification by simulation
Ebert, M.; Naumann, F.; Gerbach, R.; Bagdahn, J.
Conference Paper
2007Waferbond technologies and quality assesment
Wiemer, M.; Froemel, J.; Bagdahn, J.; Knechtel, R.
Conference Paper
2006Comparison of the mechanical properties of low temperature bonded test samples
Bagdahn, J.; Bernasch, M.; Fischer, C.; Wiemer, M.
Conference Paper
2006Drop simulation and stress analysis of MEMS devices
Hauck, T.; Li, G.; McNeill, A.; Knoll, H.; Ebert, M.; Bagdahn, J.
Conference Paper
2006Fracture mechanical life-time investigation of glass-frit bonded MEMS sensors
Petzold, M.; Dresbach, C.; Ebert, M.; Bagdahn, J.; Wiemer, M.; Glien, K.; Graf, J.; Müller-Fiedler, R.; Höfer, H.
Conference Paper
2006Identification of geometrical parameters of MEMS from measured resonant frequencies
Gerbach, R.; Ebert, M.; Bagdahn, J.; Hering, S.
Conference Paper
2006Influence of moulding process on strength of glass frit bonded structures
Ebert, M.; Bagdahn, J.; Knechtel, R.
Conference Paper
2006Influence of the frequency on fatigue of directly wafer-bonded silicon
Bagdahn, J.; Bernasch, M.; Petzold, M.
Journal Article
2006Influence of the thickness of silicon dies on strength
Schönfelder, S.; Ebert, M.; Bagdahn, J.
Conference Paper
2006Mechanical properties of glass frit bonded micro packages
Dresbach, C.; Krombholz, A.; Ebert, M.; Bagdahn, J.
Conference Paper, Journal Article
2006Numerical identification of geometric parameters from dynamic measurement of grinded membranes on wafer level
Ebert, M.; Gerbach, R.; Bagdahn, J.; Michael, S.; Hering, S.
Conference Paper
2006Room temperature bonding of nanostructured silicon wafers and mechanical characterization
Stubenrauch, M.; Fischer, M.; Bernasch, M.; Bagdahn, J.
Conference Paper
2006Simulation of aggregating beads in microfluidics on high performance computers with a fluid particle method
Glatzel, T.; Ebert, M.; Bagdahn, J.; Hering, S.
Conference Paper
2006Strength characterization of directly bonded silicon
Wiemer, M.; Fischer, C.; Bernasch, M.; Bagdahn, J.
Conference Paper
2006Strength characterization of laser diced silicon for application in solar industry
Schönfelder, S.; Bagdahn, J.; Baumann, S.; Kray, D.; Mayer, K.; Willeke, G.; Becker, M.; Christiansen, S.
Conference Paper
2006A test structure for characterization of the interface energy of anodically bonded silicon-glass wafers
Knechtel, R.; Knaup, M.; Bagdahn, J.
Conference Paper, Journal Article
2005Fracture and delamination of thin multilayers on ultra-thin silicon
Kravchenko, G.; Bagdahn, J.
Conference Paper
2005Investigations of strength properties of ultra-thin silicon
Schönfelder, S.; Bagdahn, J.; Ebert, M.; Petzold, M.; Bock, K.; Landesberger, C.
Conference Paper
2005Konzepte für die Sicherung von Festigkeit und Zuverlässigkeit von Komponenten der Siliziummikromechanik
Bagdahn, J.; Petzold, M.
Conference Paper
2005Mechanical failure behavior of glass frit bondet structures
Ebert, M.; Dresbach, C.; Krombholz, A.; Bagdahn, J.; Glien, K.; Graf, J.; Müller-Fiedler, R.; Hofer, H.
Conference Paper
2005Mechanical reliability of directly bonded silicon MEMS components
Bagdahn, J.; Wiemer, M.; Petzold, M.
Conference Paper
2005NON-destructive strength testing of anodic bonded glass-silicon wafer compounds
Knechtel, R.; Knaup, M.; Bagdahn, J.; Wiemer, M.
Conference Paper
2005Reliability of wafer bonding in microsystem technologies
Bagdahn, J.
Conference Paper
2005Sicherung der Ausbeute und Zuverlässigkeit industriell gefertigter direkt wafergebondeter mikromechanischer Sensoren
Bagdahn, J.; Wiemer, M
Report
2005Strength analysis of etched silicon pressure sensors
Ebert, M.; Knaup, M.; Stelzer, T.; Bagdahn, J.; Bartuch, H.; Brokmann, G.
Conference Paper
2004Debonding of wafer-bonded interfaces for handling and transfer applications
Bagdahn, J.; Petzold, M.
Book Article
2004Determination of residual stress in glass frit bonded MEMS by finite element analysis
Ebert, M.; Bagdahn, J.
Conference Paper
2004Fatigue testing of polysilicon - a review
Sharpe, W.N.; Bagdahn, J.
Journal Article
2004Strength and reliability properties of glass frit bondet micro packages
Glien, K.; Graf, J.; Müller-Fiedler, R.; Höfer, H.; Ebert, M.; Bagdahn, J.
Conference Paper
2004Strength and reliability testing for silicon based MEMS
Petzold, M.; Bagdahn, J.; Katzer, D.
Book Article
2003Debonding of directly wafer-bonded silicon after high temperature process steps
Bagdahn, J.; Knoll, H.; Petzold, M.; Wiemer, M.; Frömel,J.
Abstract
2003A failure criterion for interface notches in silicon/glass anodic bonds
Knaup, M.; Busch, M.; Bagdahn, J.; Maschke, H.-G.
Conference Paper
2003Fatigue of polycrystalline silicon under long-term cyclic loading
Bagdahn, J.; Sharpe, W.N.
Journal Article
2003Fracture strength of polysilicon at stress concentrations
Bagdahn, J.; Sharpe, W.N.; Jadaan, O.
Journal Article
2003A new approach for handling and transferring of thin semiconductor materials
Bagdahn, J.; Knoll, H.; Wiemer, M.; Petzold, M.
Journal Article
2003Probabilistic Weibull behavior and mechanical properties of MEMS brittle materials
Jadaan, O.M.; Nemeth, N.N.; Bagdahn, J.; Sharpe, W.N.
Journal Article
2003Tensil testing of MEMS materials recent progress
Sharpe, W.N.; Bagdahn, J.; Jackson, K.; Coles, G.
Journal Article
2002Fatique of materials used in microelectromechanical systems (MEMS)
Sharpe, W.N.; Bagdahn, J.
Conference Paper
2002Fracture strength of polysilicon thin films at stress concentration
Bagdahn, J.; Sharpe, W.N.
Conference Paper
2002Influence of the frequency on fatique of directly wafer-bonded silicon
Bagdahn, J.; Bernasch, M.; Petzold, M.
Conference Paper
2002Reliability of polysilicon under long-term cyclic loading
Bagdahn, J.; Sharpe, W.N.
Conference Paper
2002Strength and long-term reliability testing of wafer-bonded MEMS
Petzold, M.; Katzer, D.; Wiemer, M.; Bagdahn, J.
Conference Paper
2001Einsatz von Niedertemperaturbondverfahren für die Fertigung von Sensoren
Wiemer, M; Otto, T.; Gessner, T.; Hiller, K.; Kapser, K.; Seidel, H.; Bagdahn, J.; Petzold, M.
Conference Paper
2001Fatigue of directly wafer-bonded silicon under static and cyclic loading
Bagdahn, J.; Petzold, M.
Journal Article
2001Implementation of a low temperature wafer bonding process for acceleration sensors
Wiemer, M.; Otto, T.; Gessner, T.; Hiller, K.; Kapser, K.; Seidel, H.; Bagdahn, J.; Petzold, M.
Conference Paper
2001Lifetime properties of wafer-bonded components under static and cyclic loading
Bagdahn, J.; Petzold, M.
Conference Paper
2001Measurement of the local strength distribution of directly bonded silicon wafers using the micro-chevron-test
Bagdahn, J.; Petzold, M.; Plößl, A.; Wiemer, M.
Conference Paper
2001A new approach for handling and transferring of thin semiconductor materials
Bagdahn, J.; Katzer, D.; Petzold, M.; Wiemer, M.; Alexe, M.; Dragoi, V.; Gösele, U.
Conference Paper
2001Strength and fatigue investigations of polycrystalline silicon
Bagdahn, J.; Sharpe, W.N.; Schischka, J.; Petzold, M.
Conference Paper
2001Strength assessment of wafer-bonded micromechanical components using the micro-chevron-test
Petzold, M.; Knoll, H.; Bagdahn, J.
Conference Paper
2001Transfer and handling of thin semiconductor materials by a combination of wafer bonding and controlled crack propagation
Bagdahn, J.; Katzer, D.; Petzold, M.; Wiemer, M.; Alexe, M.; Dragoi, V.; Gösele, U.
Conference Paper
2000Investigation of bonding behaviour of different borosilicate glasses
Wiemer, M; Hiller, K.; Gessner, T.; Kloss, T.; Schneider, K.; Leipold-Haas, U.; Bagdahn, J.; Petzold, M.
Conference Paper
2000Lifetime investigations of directly wafer-bonded samples under static and cyclic loading
Bagdahn, J.; Petzold, M.; Sommer, E.
Conference Paper
2000Strength analysis of a micromechanical acceleration sensor by fracture mechanical approaches
Bagdahn, J.; Petzold, M.; Seidel, H.
Conference Paper
1999Quality and mechanical reliability assessment of wafer-bonded micromechanical components
Petzold, M.; Bagdahn, J.; Katzer, D.
Journal Article
1998The interface of silicon samples joined at room temperature by wafer direct bonding in ultrahigh vacuum
Plößel, A.; Scholz, R.; Bagdahn, J.; Stenzel, H.; Tu, K.N.; Gösele, U.
Conference Paper
1998Mechanical reliability of silicon wafer-bonded components
Bagdahn, J.; Katzer, D.; Petzold, M.
Conference Paper
1998Untersuchungen zum subkritischen Rißwachstum gebondeter Siliziumwafer
Bagdahn, J.; Katzer, D.; Petzold, M.
Conference Paper
1997Characterisation of directly bonded silicon wafers by means of the double cantilever crack opening method
Bagdahn, J.; Petzold, M.; Reiche, M.; Gutjahr, K.
Conference Paper
1997The influence of sharp notches on the strength of directly bonded components
Bagdahn, J.; Katzer, D.; Petzold, M.; Wiemer, M.
Conference Paper
1997Mechanical reliability tests for bonded wafers
Bagdahn, J.; Petzold, M.; Reiche, M.; Wiemer, M.
Conference Paper
1995Einfluß von Prüfbedingungen und Strukturierungen auf die Zugfestigkeit gebondeter Siliziumwafer
Bagdahn, J.
Thesis
1995Investigations of the interface strength of bonded silicon wafers
Bagdahn, J.; Heinzelmann, M.; Petzold, M.; Reiche, M.
Conference Paper