Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
20193D system integration on 300 mm wafer level
Kilige, S.; Bartusseck, I.; Junige, M.; Neumann, V.; Reif, J.; Wenzel, C.; Böttcher, M.; Albert, M.; Wolf, M.J.; Bartha, J.W.
Journal Article
2019Plattformkonzept zum Aufbau von hochintegrierten Multisensorknoten
Becker, Karl-Friedrich; Böttcher, Mathias; Schiffer, Michael; Pötter, Harald; Brockmann, Carsten; Freimund, Damian; Tschoban, Christian; Windrich, Frank; Braun, Tanja; Hopsch, Fabian; Heinig, Andy; Voigt, Sven; Baum, Mario; Hofmann, Lutz; Lang, Klaus-Dieter
Conference Paper
2019Very-Thin System-in-Package Technology for Structural Analysis
Hopsch, Fabian; Heinig, Andy; Böttcher, Mathias
Conference Paper
2018In-line metrology for Cu pillar applications in interposer based packages for 2.5D integration
Panchenko, I.; Böttcher, M.; Wolf, J.M.; Kunz, M.; Lehmann, L.; Atanasova, T.; Wieland, M.
Conference Paper
2017Fabrication and characterization of precise integrated titanium nitride thin film resistors for 2.5D interposer
Singh, R.; Boettcher, M.; Panchenko, I.; Fiedler, C.; Schwarz, A.; Wolf, J.
Conference Paper
2017Interposer-based smartcard system with active wireless communication
Hopsch, Fabian; Heinig, Andy; Böttcher, Mathias
Conference Paper
2016High frequency characterization of silicon substrate and through silicon vias
Duan, X.; Boettcher, M.; Dahl, D.; Schuster, C.; Tschoban, C.; Ndip, I.; Lang, K.-D.
Conference Paper
2015Challenges of TSV backside process integration
Rudolph, C.; Wachsmuth, H.; Boettcher, M.; Steller, W.; Wolf, M.J.
Conference Paper
2015Comparison of passivation materials for high frequency 3D packaging application up to 110 GHz
Duan, X.; Böttcher, M.; Dobritz, S.; Dahl, D.; Schuster, C.; Ndip, I.; Lang, K.-D.
Conference Paper
2015μ-Raman spectroscopy and FE-modeling for TSV-Stress-characterization
Saettler, P.; Hecker, M.; Boettcher, M.; Rudolph, C.; Wolter, K.J.
Journal Article, Conference Paper
2015Optimierte Personalplanung - Unternehmerische Entscheidungsfindung durch mathematische Modelle und Algorithmen
Böttcher, Michael; John, Ole
Presentation
2015Ultra-Thin high density capacitors for advanced packaging solutions
Seidel, K.; Böttcher, M.; Dobritz, S.; Czernohorsky, M.; Riedel, S.; Weinreich, W.
Conference Paper
20143D IC/stacked device fault isolation using 3D magnetic field imaging
Orozco, A.; Gagliolo, N.E.; Rowlett, C.; Wong, E.; Moghe, A.; Gaudestad, J.; Talanov, V.; Jeffers, A.; Torkashvan, K.; Wellstood, F.C.; Dobritz, S.; Boettcher, M.; Cawthorne, A.B.; Infante, F.
Conference Paper
2014Development of process and design criteria for stress management in through silicon vias
Hölck, Ole; Nuss, Max; Grams, Arian; Prewitz, Tobias; John, Peggy; Fiedler, Conny; Böttcher, Matthias; Walter, Hans; Wolf, M. Jürgen; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper
2014TSV-annealing: A thermo-mechanical assessment
Saettler, P.; Hecker, M.; Boettcher, M.; Rudolph, C.; Wolter, K.J.
Conference Paper
2013µ-Raman spectroscopy and FE-analysis of thermo-mechanical stresses in TSV periphery
Saettler, P.; Boettcher, M.; Wolter, K.J.
Conference Paper
20133D integration of standard integrated circuits
Puschmann, R.; Böttcher, M.; Bartusseck, I.; Windrich, F.; Fiedler, C.; John, P.; Manier, C.; Zoschke, K.; Grafe, J.; Oppermann, H.; Wolf, M.J.; Lang, K.D.; Ziesmann, M.
Conference Paper
20133D TSV - Influence of electrolyte composites and anneal temperatures to copper protrusion and planarization
Rudolph, C.; Wachsmuth, H.; Bartusseck, I.; Parthenopoulos, M.; Goerner, L.; Boettcher, M.; Grafe, J.; Wolf, J.M.
Conference Paper
2013Bath chemistry and copper overburden as influencing factors of the TSV annealing
Saettler, P.; Boettcher, M.; Rudolph, C.; Wolter, K.-J.
Conference Paper
2013Decision support for the crew scheduling problem in ship management
John, Ole; Böttcher, Michael; Jahn, Carlos
Conference Paper
2013Decision support for the crew scheduling problem in ship management
John, Ole; Böttcher, Michael; Jahn, Carlos
Presentation
2013Investigation of different methods for isolation in through silicon via for 3D integration
Sage, S.; John, P.; Dobritz, S.; Börnge, J.; Vitiello, J.; Böttcher, M.
Journal Article
2013Via-last technology for the interconnection of flash and processor chip for mobile applications
Puschmann, R.; Böttcher, M.; John, P.; Bartussek, I.; Manier, C.; Zoschke, K.; Grafe, J.; Ziesmann, M.
Conference Paper
20123D integration - technology and test strategy
Dobritz, S.; Grafe, J.; Rudolph, C.; Böttcher, M.; Wolf, M.J.; Lang, K.-D.
Conference Paper
2012Anforderungen an die Produktivität und Komponentisierung von Dienstleistungen
Becker, Michael; Böttcher, Martin; Freitag, Mike; Klingner, Stephan; Lamberth, Sabrina; Meiren, Thomas
: Böttcher, Martin (Hrsg.); Meiren, Thomas (Hrsg.)
Study
2012Application and evaluation of a cost apportionment approach for integrating tour planning aspects into applied location planning
Böttcher, Michael; Schneider, Holger; Hackstein, Lars
Journal Article
2012Characterization of the annealing behavior for copper-filled TSVs
Saettler, P.; Boettcher, M.; Wolter, K.-J.
Conference Paper
2012Das Instrument "BIegebalken" als Methode zur Ermittlung chemisch induzierter Eigenspannungen von reaktiven Polymeren
Böttcher, Mareike
: Mayer, Bernd (Gutachter); Rikeit, Horst-Erich (Gutachter)
Bachelor Thesis
2012Thermo-mechanical characterization and modeling of TSV annealing behavior
Saettler, P.; Kovalenko, D.; Meier, K.; Roellig, M.; Boettcher, M.; Wolter, K.J.
Conference Paper
20113D-Mikroelektroden als Werkzeuge fur die Manipulation von Partikeln in Mikrofluidikkanalen
Böttcher, M.; Jäger, M.S.; Duschl, C.; Stuke, M.
Conference Paper
2011Cost-effective lithography for TSV-structures
Vogler, U.; Windrich, F.; Schenke, A.; Völkel, R.; Böttcher, M.; Zoberbier, R.
Conference Paper
2011Filtration at the microfluidic level: Enrichment of nanoparticles by tunable filters
Boettcher, M.; Schmidt, S.; Latz, A.; Jaeger, M.S.; Stuke, M.; Duschl, C.
Journal Article
2011Method of collecting and categorising performance indicators to measure productivity of modular services using an IT tool
Freitag, Mike; Lamberth, Sabrina; Klingner, Stephan; Böttcher, Martin
Conference Paper
2011Systemanalyse, Modellspezifikation und Werkzeugimplementierung zur akteursindividuellen Informationsversorgung bei seltenen Erkrankungen am Beispiel ALS
Böttcher, Martin; Elze, Romy; Klingner, Stephan
Report
2010Environmental effect assessment for sexual endocrine-disrupting chemicals: Fish testing strategy
Knacker, T.; Boettcher, M.; Frische, T.; Rufli, H.; Stolzenberg, H.-C.; Teigeler, M.; Zok, S.; Braunbeck, T.; Schäfers, C.
Journal Article
2009Traveling-wave electrohydrodynamics: A versatile method for collecting nanoscaled objects from fluids
Boettcher, M.; Jaeger, M.S.; Stuke, M.; Duschl, C.
Conference Paper
2008Contact-less handling of metal sub-micron and nanowires for microelectronic packaging applications
Fiedler, S.; Zwanzig, M.; Boettcher, M.; Jaeger, M.S.; Fuhr, G.R.; Reichl, H.
Conference Paper
2008Determination of best focus and optimum dose for variable shaped e-beam systems by applying the isofocal dose method
Keil, Katja; Choi, Kang-Hoon; Hohle, Christoph; Kretz, Johannes; Lutz, Tarek; Bettin, Lutz; Boettcher, Monika; Hahmann, Peter; Kliem, Karl-Heinz; Schnabel, Bernd; Irmscher, Mathias; Sailer, Holger
Conference Paper, Journal Article
2008Dielectrophoresis and microfluidics: Key methods for the manipulation of biological objects ranging from nanoparticles to cells
Jaeger, M.S.; Boettcher, M.; Felten, M.; Kirschbaum, M.; Marschner, C.; Duschl, C.
Conference Paper
2008Ermittlung von Problemfeldern bei der Entwicklung IT-basierter Dienstleistungen
Husen, C. van; Fuchs, B.; Böttcher, M.; Meyer, K.
Book Article
2008Gravitation-driven stress-reduced cell handling
Boettcher, M.; Jaeger, M.; Kirschbaum, M.; Mueller, T.; Schnelle, T.; Duschl, C.
Journal Article
2008Software-Service-Co-Design
Mexer, K.; Böttcher, M.; Husen, C. van
Book Article
2008Touchless component handling - towards converging assembly strategies
Fiedler, S.; Müller, T.; Zwanzig, M.; Jäger, M.S.; Böttcher, M.
Journal Article
2007Resist processes for high resolution mask and direct write applications using the latest vistec VSB electron column
Sailer, H.; Irmscher, M.; Hohle, C.; Keil, K.; Boettcher, M.; Hahmann, P.
Conference Paper
2007Systematic development of e-services through co-design of software and service
Böttcher, M.; Meyer, K.; Husen, C. van
Book Article
2006Lab-on-chip-based cell separation by combining dielectrophoresis and centrifugation
Böttcher, M.; Jäger, M.; Riegger, L.; Ducrée, J.; Zengerle, R.; Duschl, C.
Journal Article
2005Co-Design von Software und Services
: Husen, C. van; Opitz, M.; Böttcher, M.; Meyer, K.
Study
2004Entwicklung IT-basierter Dienstleistungen in der Praxis
: Fähnrich, K.-P.; Husen, C. van; Opitz, M.; Böttcher, M.; Meyer, K.
Study
1996Unifikation disjunktiver Attributterme
Böttcher, M.
Dissertation
1993Disjunctions and inheritance in the context feature structure system
Böttcher, M.
Conference Paper
1993Mikrostrukturierung von Polymerfolien mit UV-Laserstrahlung
Böttcher, M.; Mai, H.; Panzner, M.
Book Article
1992Non-destructive unification of disjunctive feature structures by constraint sharing
Böttcher, M.; Könyves-Toth, M.
Conference Paper