Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2013Reliability of embedding concepts for discrete passive components in organic circuit boards
Schwerz, R.; Boehme, B.; Roellig, M.; Wolter, K.-J.; Meyendorf, N.
Conference Paper
2012Capability study of embedded ultrasonic transducer microsystems for SHM applications in airplane composite structures
Röllig, M.; Schubert, F.; Lautenschläger, G.; Franke, M.; Böhme, B.; Meyendorf, N.
Conference Paper
2012Einbettung von Ultraschallwandler- und Elektroniksystemen in CFK-Strukturen für die sensorische Strukturüberwachung
Böhme, B.; Röllig, M.; Lautenschläger, G.; Franke, M.; Schulz, J.; Wolter, K.-J.
Conference Paper
2012Reliability and functionality investigation of CFRP embedded ultrasonic transducers supported by FEM and EFIT simulations
Roellig, M.; Schubert, F.; Lautenschlaeger, G.; Franke, M.; Boehme, B.; Meyendorf, N.
Conference Paper
2012Technology, functionality and reliability of integrated ultrasonic microsystems for SHM in CFRP airplane structures
Röllig, M.; Schubert, F.; Lautenschläger, G.; Franke, M.; Böhme, B.; Münch, S.; Meyendorf, N.
Conference Paper
2011Determination of thermal and mechanical properties of packaging materials for the use in FEM-simulations
Röllig, M.; Böhme, B.; Meier, K.; Metasch, R.
Conference Paper
2010CNTs - A comparable study of CNT-filled adhesives with common materials
Heimann, M.; Böhme, B.; Scheffler, S.; Wirts-Rütters, M.; Wolter, K.-J.
Conference Paper
2010FEM assisted development of a SHM-piezo-package for damage evaluation in airplane components
Roellig, M.; Schubert, L.; Lieske, U.; Boehme, B.; Frankenstein, B.; Meyendorf, N.
Conference Paper
2010Measurement of viscoelastic material properties of adhesives for SHM sensors under harsh environmental conditions
Boehme, B.; Roellig, M.; Wolter, K.-J.
Conference Paper
2010Moisture induced change of the viscoelastic material properties of adhesives for SHM sensor applications
Boehme, B.; Röllig, M.; Wolter, K.-J.
Conference Paper
2009Application of carbon nanotubes as conductive filler of epoxy adhesives in microsystems
Heimann, M.; Rieske, R.; Wirts-Rütters, M.; Telychkina, O.; Böhme, B.; Wolter, K.-J.
Conference Paper
2009CNTs - A comparable study of CNT-filled adhesives with common materials
Matthias, H.; Boehme, B.; Sebastian, S.; Wirts-Ruetters, M.; Wolter, K.-J.
Conference Paper
2009Comprehensive material characterization of organic packaging materials
Boehme, B.; Jansen, K.M.B.; Rzepka, S.; Wolter, K.J.
Conference Paper
2009Thermo mechanical characterization of packaging polymers
Boehme, B.; Jansen, K.M.B.; Rzepka, S.; Wolter, K.J.
Conference Paper
2008Investigations of carbon nanotubes epoxy composites for electronics packaging
Heimann, M.; Wirts-Ruetters, M.; Boehme, B.; Wolter, K.-J.
Conference Paper
2008Polsterelement und Verfahren zur Herstellung desselben
Drossel, W.-G.; Bucht, A.; Knüpfer, H.; Heinrich, H.-J.; Böhme, B.; Köhler, C.
Patent
2008Untersuchungen zu CNT-Epoxidharz-Kompositen für die Anwendung als Klebstoff in der Aufbau- und Verbindungstechnik
Heimann, M.; Böhme, B.; Wirts-Rütters, M.
Journal Article
2007Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept
Roellig, M.; Dudek, R.; Wiese, S.; Boehme, B.; Wunderle, B.; Wolter, K.-J.; Michel, B.
Journal Article
2005Haltbarkeit von Pralinen - One-Shot-Verfahren und konventionelles Schleudern im Vergleich
Ziegleder, G.; Böhme, B.; Rohm, H.
Journal Article
2004Fettreifreduzierung. Qualität und Lagerstabilität kaltgeformter Schokoladenhülsen und Pralinen
Rohm, H.; Böhme, B.; Ziegleder, G.
Journal Article
2004Optimale Bedingungen beim Kaltformen
Ziegleder, G.; Böhme, B.; Linke, L.
Journal Article