Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor
Auersperg, J.; Auerswald, E.; Collet, C.; Dean, T.; Vogel, D.; Winkler, T.; Rzepka, S.
Journal Article
2018Multiscale residual stress analysis in thin film layers
Weißbach, M.; Auerswald, E.; Hildebrandt, M.; Rzepka, S.
Conference Paper
2017Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
Auersperg, J.; Auerswald, E.; Collet, C.; Dean, T.; Vogel, D.; Winkler, T.; Rzepka, S.
Conference Paper
2016Best practice approaches for stress measurements on thin layer stacks
Auerswald, E.; Vogel, D.; Sebastiani, M.; Lord, J.; Rzepka, S.
Conference Paper
2016Fast and trusted intrinsic stress measurement to facilitate improved reliability assessments
Vogel, D.; Auerswald, E.; Gadhiya, G.; Rzepka, S.
Journal Article
2016Intrinsic stress measurement by FIB ion milling becomes an industrial-strength method
Vogel, D.; Auerswald, E.; Gadhiya, G.; Auersperg, J.; Sebastiani, M.; Rzepka, S.
Conference Paper
2016Investigating fracture strength of poly-silicon membranes using microscopic loading tests and numerical simulation
Brueckner, J.; Dehé, A.; Auerswald, E.; Dudek, R.; Vogel, D.; Michel, B.; Rzepka, S.
Journal Article
2015Mechanical characterization of poly-silicon membranes by efficient experimental tests and numerical simulations
Brückner, J.; Auerswald, E.; Vogel, D.; Dudek, R.; Rzepka, S.; Dehe, A.
Conference Paper
2015Miniaturisierte On-Chip Teststrukturen zur Festigkeitsüberwachung von Poly-Silizium
Brückner, J.; Auerswald, E.; Hildebrandt, M.; Vogel, D.; Rzepka, S.; Glacer, C.; Dehe, A.
Conference Paper
2015Stress measurements on TSVs and BEoL structures with high spatial resolution
Vogel, D.; Auerswald, E.; Auersperg, J.; Rzepka, S.
Conference Paper
2014Design for reliability of BEoL and 3-D TSV structures - a joint effort of FEA and innovative experimental techniques
Auersperg, J.; Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B.
Conference Paper
2014Determination of residual stress with high spatial resolution at TSVs for 3D integration: Comparison between HR-XRD, Raman spectroscopy and fibDAC
Vogel, D.; Zschenderlein, U.; Auerswald, E.; Hölck, O.; Ramm, P.; Wunderle, B.; Pufall, R.
Conference Paper
2014Determination of residual stresses by fib-DAC methodology
Auerswald, E.; Vogel, D.; Michel, B.; Rzepka, S.
Book Article
2014Experimental testing of silicon die strength depending on the processing history
Brueckner, J.; Dudek, R.; Auerswald, E.; Rzepka, S.; Michel, B.
Book Article
2014Integrated investigation approach for determining mechanical properties of poly-silicon membranes
Brueckner, J.; Dehe, A.; Auerswald, E.; Dudek, R.; Michel, B.; Rzepka, S.
Journal Article, Conference Paper
2014On the crack and delamination risk optimization towards 3D-IC-integration
Auersperg, J.; Auerswald, E.; Oswald, S.; Machani, K.V.; Rzepka, S.; Michel, B.
Book Article
2014Residual stress investigations at TSVs in 3D micro structures by HR-XRD, Raman spectroscopy and fibDAC
Zschenderlein, U.; Vogel, D.; Auerswald, E.; Hölck, O.; Rajendran, H.; Ramm, P.; Pufall, R.; Wunderle, B.
Conference Paper
2014Statistical Strength Investigation of Poly-Silicon Membranes using Microscopic Loading Tests and Numerical Simulation
Brueckner, J.; Auerswald, E.; Dudek, R.; Wunderle, B.; Michel, B.; Rzepka, S.; Dehe, A.
Conference Paper
2014Stress analyses of high spatial Resolution on TSV and BEoL structures
Vogel, D.; Auerswald, E.; Auersperg, J.; Bayat, P.; Rodriguez, R.D.; Zahn, D.R.T.; Rzepka, S.; Michel, B.
Conference Paper, Journal Article
2014Stress measurements at through silicon vias
Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B.
Book Article
2013Experimental Analysis of Mechanical Stresses and Material Properties in Multi-Layer Interconnect Systems by fibDAC
Vogel, D.; Auerswald, E.; Michel, B.; Rzepka, S.
Conference Paper
2013Measuring techniques for deformation and stress analysis in micro-dimensions
Vogel, D.; Auerswald, E.; Auersperg, J.; Rzepka, S.; Michel, B.
Conference Paper
2013Review of experimental strength testing methods for Silicon dies
Brueckner, J.; Auerswald, E.; Dudek, R.; Rzepka, S.; Michel, B.
Conference Paper
2013Strain and Stress Measurement for Reliability Analyses in Small Material Volumes. Invited plenary presentation
Vogel, D.; Auerswald, E.; Auersperg, J.; Rzepka, S.; Michel, B.
Conference Paper
2013Stress Measurement in Thin Multilayer Systems by Stress Relief
Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B.
Conference Paper
2012FIB/SEM analysis for smart systems integration
Waechtler, T.; Auerswald, E.; Hoebelt, I.; Nowack, M.; Noack, E.; Gollhardt, A.; Vogel, D.; Michel, B.; Schulz, S.E.; Gessner, T.
Conference Paper
2012Local deformation and stress analysis in the micro-nano interface regions
Vogel, D.; Auerswald, E.; Dudek, R.; Auersperg, J.; Rzepka, S.; Michel, B.
Conference Paper
2012Nonlinear copper behavior of TSV and the cracking risks during BEoL-built-up for 3D-IC-integration
Auersperg, J.; Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B.
Conference Paper
2012Quantitative determination of the mechanical stresses in BEoL films and structures on Si wafers with sub-micron spatial resolution by fibDAC
Rzepka, S.; Vogel, D.; Auerswald, E.; Michel, B.
Conference Paper
2011Nonlinear copper behavior of TSV for 3D-IC-integration and cracking risks during BEoL-built-up
Auersperg, J.; Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B.
Conference Paper
2011Thermal fatigue analysis
Dudek, R.; Auerswald, E.
Book Article
2010Einfluss der Materialeigenschaften auf das Ausfallverhalten von Leiterplatten-Durchkontaktierungen
Halser, K.; Huang, L.; Auerswald, E.; Schmidt, R.
Conference Paper
2010Simulationsgestützte Zuverlässigkeitsbewertung im Mikro-Nano Übergangsbereich
Wittler, O.; Huber, S.; Mroßko, R.; Walter, H.; Auerswald, E.; Michel, B.
Conference Paper
2008Approaches of local stress measurement on microsystem devices
Vogel, D.; Auerswald, E.; Gollhardt, A.; Luczak, F.; Sabate, N.; Michel, B.
Conference Paper
2008Materials Characterisation by EBSD
Auerswald, E.; Kukuk-Schmid, H.; Walter, H.
Journal Article, Conference Paper
2007Experimental characterization of thin Copper foils
Auerswald, E.; Walter, H.; Wittler, O.; Gollhardt, A.; Michel, B.
Conference Paper
2007A test system for ensuring material reliability in micro- and nanoelectronics
Wittler, O.; Auerswald, E.; Dermitzaki, E.; Gollhardt, A.; May, D.; Schmitz, S.; Wunderle, B.; Michel, B.
Conference Paper, Journal Article
2006Accelerated active high-temperature cycling test for power MOSFETs
Schacht, R.; Wunderle, B.; Auerswald, E.; Michel, B.; Reichl, H.
Conference Paper
2006Evaluation of Metallic Nano-Lawn Structures for Application in Microelectronic Packaging
Fiedler, S.; Zwanzig, M.; Schmidt, R.; Auerswald, E.; Klein, M.; Scheel, W.; Reichl, H.
Conference Paper
2006FibDAC - residual stress determination by combination of focused ion beam technique and digital image correlation
Keller, J.; Gollhardt, A.; Vogel, D.; Auerswald, E.; Sabate, N.; Auersperg, J.; Michel, B.
Conference Paper
2005Accelerated failure test for high temperature applications of power MOSFETs by power cycling
Schacht, R.; Auerswald, E.; Sommer, J.-P.; Wunderle, B.; Michel, B.; Reichl, H.
Conference Paper
2005Investigation of Intrinsic Stress in Diamond Films using Raman Spectroscopy and X-ray Diffraction
Krawietz, R.; Kämpfe, B.; Auerswald, E.; Brücher, M.
Conference Paper
2005Optimierung der mechanischen und tribologischen Eigenschaften keramischer Schichten - Nutzen für die Kniegelenk-Endoprothetik
Rahm, J.; Glien, W.; Kieselstein, E.; Kreyßig, K.; Sommer, J.-P.; Auerswald, E.; Kremling, U.
Journal Article
2005Optimierung der mechanischen und tribologischen Eigenschaften keramischer Schichten Nutzen für die Kniegelenk-Endoprothetik
Rahm, J.; Glien, W.; Kieselstein, E.; Kreyßig, K.; Sommer, J.-P.; Auerswald, E.; Kremling, U.
Journal Article
2005Raman spectroscopic and x-ray investigation of stressed states in diamond-like carbon films
Krawietz, R.; Kämpfe, B.; Auerswald, E.; Brücher, M.
Journal Article
2004Optimierung der mechanischen und tribologischen Eigenschaften keramischer Schichten für die Knie-Gelenkendoprothetik
Glien, W.; Rahm, J.; Kieselstein, E.; Kreyßig, K.; Sommer, J.-P.; Auerswald, E.; Kremling, U.
Conference Paper
2003Optimierung der mechanischen und tribologischen Eigenschaften keramischer Schichten - Nutzen für die Kniegelenk-Endoprothetik
Rahm, J.; Glien, W.; Kieselstein, E.; Kreyßig, K.; Sommer, J.-P.; Auerswald, E.; Kremling, U.
Journal Article, Conference Paper
2003Reliability Evaluations of Lead Free Soldered Packages
Walter, H.; Auerswald, E.; Schubert, A.; Dudek, R.; Michel, B.
Conference Paper
2002Lead-free solder interconnects - characterization, testing and reliability
Schubert, A.; Dudek, R.; Walter, H.; Auerswald, E.; Gollhardt, A.; Michel, B.; Schuch, B.
Conference Paper
2002Thermo-mechanical reliability of lead-free solder interconnects
Schubert, A.; Dudek, R.; Döring, R.; Walter, H.; Auerswald, E.; Gollhardt, A.; Michel, B.
Conference Paper
2000Determination of Residual Stresses in Microsystems Using X-Ray Diffraction
Kämpfe, B.; Auerswald, E.
Conference Paper
2000Evaluation of GlobTop materials for COB applications
Walter, H.; Schubert, A.; Schneider, W.; Kieselstein, E.; Auerswald, E.; Michel, B.
Conference Paper
2000Experimental and numerical investigations of microelectroplated sensors
Vogel, J.; Sommer, J.-P.; Noack, E.; Kieselstein, E.; Auerswald, E.; Gentzsch, S.; Großer, V.; Winkler, T.; Michel, B.
Conference Paper
2000Influence of microstructure of electroless deposited Ni used as under bump metallization for high temperature solders
Anhöck, S.; Ostmann, A.; Nieland, C.; Auerswald, E.; Reichl, H.
Conference Paper
2000Reliability of soldered nickel bumps for high temperature application
Anhöck, S.; Auerswald, E.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2000Residual stress determination in microsystems using X-ray diffraction
Kämpfe, B.; Kämpfe, A.; Auerswald, E.; Kassem, M.E.
Conference Paper
2000X-ray diffraction at elevated temperatures in microsystem technology
Auerswald, E.; Anhöck, S.; Kieselstein, E.; Vogel, J.; Michel, B.
Conference Paper
1999Charakterisierung galvanisch abgeschiedener Sensorstrukturen
Auerswald, E.; Sommer, J.-P.; Michel, B.; Kieselstein, E.; Brämer, B.
Conference Paper
1999A review about fifteen years of x-ray analysis of our department
Auerswald, E.; Schubert, A.; Kämpfe, B.
Book Article
1998Characterization of surface metallization for printed circuit boards
Auerswald, E.; Hannemann, M.; Kämpfe, B.; Schmidt, R.
Conference Paper
1997Characterization of packages for laser diodes
Auerswald, E.; Döring, R.; Nechansky, H.; Kämpfe, B.; Michel, B.
Conference Paper
1996Zuverlässigkeitsuntersuchungen an AlN-Cu-Verbunden
Auerswald, E.; Kämpfe, B.; Dudek, R.; Faust, W.
Book Article
1995Röntgenographische Spannungsanalyse mit dem Flächendetektor
Kämpfe, B.; Schubert, A.; Krause, F.; Goldenbogen, S.; Auerswald, E.
Book Article
1995Zuverlässigkeitsuntersuchungen an AlN-Verbunden, angewendet auf die Mikrosystem-Modultechniken
Auerswald, E.; Dudek, R.; Faust, W.; Kämpfe, B.
Conference Paper
1994Use of an x-ray imaging plate for stress analysis
Schubert, A.; Kämpfe, B.; Ermrich, M.; Auerswald, E.; Tränkner, K.
Conference Paper
1993Analysis of stress distributions in the crack tip surrounding
Auerswald, E.; Schubert, A.; Auersperg, J.; Kämpfe, B.
Book Article
1993X-ray analysis of residual stress gradients and textures in thin coatings
Schubert, A.; Kämpfe, B.; Auerswald, E.; Michel, B.
Conference Paper
1993X-ray analysis of residual stress gradients and textures in thin coatings
Schubert, A.; Kämpfe, B.; Auerswald, E.
Conference Paper
1992Vorrichtung zur Aufnahme eines Prueflings in einem stationaeren Diffraktometer
Kaempfe, B.; Hirsch, T.; Auerswald, E.; Koertel, G.
Patent