Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor
Auersperg, J.; Auerswald, E.; Collet, C.; Dean, T.; Vogel, D.; Winkler, T.; Rzepka, S.
Journal Article
2018Method for assessing the delamination risk in BEoL stacks around copper TSV applying nanoindentation and finite element simulation
Albrecht, J.; Weissbach, M.; Auersperg, J.; Rzepka, S.
Conference Paper
2018On the TSV delamination risk dependence on TSV distance and silicon crystal orientation
Auersperg, J.; Albrecht, J.; Rzepka, S.
Conference Paper
2017Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
Auersperg, J.; Auerswald, E.; Collet, C.; Dean, T.; Vogel, D.; Winkler, T.; Rzepka, S.
Conference Paper
2016Brittle fracture and damage in bond pad stacks - a study of parameter influences in coupled XFEM and delamination simulation of nanoindentation
Albrecht, J.; Auersperg, J.; Reuther, G.M.; Kudella, P.W.; Brueckner, J.; Rzepka, S.; Pufall, R.
Conference Paper
2016Brittle fracture and damage in bond pad stacks: Novel approaches for simulation-based risk assessment
Reuther, G.M.; Kudella, P.W.; Albrecht, J.; Brueckner, J.; Auersperg, J.; Rzepka, S.; Pufall, R.
Conference Paper
2016Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
Auersperg, J.; Collet, C.; Dean, T.; Vogel, D.; Winkler, T.
Journal Article
2016Intrinsic stress measurement by FIB ion milling becomes an industrial-strength method
Vogel, D.; Auerswald, E.; Gadhiya, G.; Auersperg, J.; Sebastiani, M.; Rzepka, S.
Conference Paper
2016Risk assessment of bond pad stacks: Combined utilization of nanoindentation and FE-modeling
Albrecht, J.; Reuther, G.M.; Brueckner, J.; Auersperg, J.; Rzepka, S.; Pufall, R.
Conference Paper
2015Evaluation of pattern scale stress effects of 28nm technology during wire bond and Cu pillar flip chip assembly
Kaulfersch, E.; Auersperg, J.; Breuer, D.; Brämer, B.; Rzepka, S.
Conference Paper
2015FEA study of damage and cracking risks in BEoL structures under copper wirebonding impact
Auersperg, J.; Breuer, D.; Machani, K.V; Rzepka, S.; Michel, B.
Conference Paper
2015FEA to Tackle Damage and Cracking Risks in BEoL Structures under Copper Wire Bonding Impact
Auersperg, J.; Breuer, D.; Machani, K.V.; Rzepka, S.; Michel, B.
Conference Paper
2015Stress measurements on TSVs and BEoL structures with high spatial resolution
Vogel, D.; Auerswald, E.; Auersperg, J.; Rzepka, S.
Conference Paper
2015Thermal and mechanical behaviour of an RFID based smart system embedded in a transmission belt determined by FEM simulations for Industry 4.0 applications
Albrecht, J.; Dudek, R.; Auersperg, J.; Pantou, R.; Rzepka, S.
Conference Paper
2014Analysis of interface delamination by combined theoretical and experimental means
Dudek, R.; Braemer, B.; Auersperg, J.
Book Article
2014Design for reliability of BEoL and 3-D TSV structures - a joint effort of FEA and innovative experimental techniques
Auersperg, J.; Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B.
Conference Paper
2014On the crack and delamination risk optimization of a Si-interposer for LED packaging
Auersperg, J.; Dudek, R.; Jordan, R.; Bochow-Neß, O.; Rzepka, S.; Michel, B.
Journal Article, Conference Paper
2014On the crack and delamination risk optimization towards 3D-IC-integration
Auersperg, J.; Auerswald, E.; Oswald, S.; Machani, K.V.; Rzepka, S.; Michel, B.
Book Article
2014Stress analyses of high spatial Resolution on TSV and BEoL structures
Vogel, D.; Auerswald, E.; Auersperg, J.; Bayat, P.; Rodriguez, R.D.; Zahn, D.R.T.; Rzepka, S.; Michel, B.
Conference Paper, Journal Article
2013Advantage and current limitations of advanced fracture mechanics for 3D-integration and BEoL under CPI aspects
Auersperg, J.; Dudek, R.; Rzepka, S.; Michel, B.
Conference Paper
2013Measuring techniques for deformation and stress analysis in micro-dimensions
Vogel, D.; Auerswald, E.; Auersperg, J.; Rzepka, S.; Michel, B.
Conference Paper
2013On the crack and delamination risk optimization of a Si-interposer for LED packaging
Auersperg, J.; Dudek, R.; Jordan, R.; Bochow-Neß, O.; Rzepka, S.; Michel, B.
Conference Paper
2013Strain and Stress Measurement for Reliability Analyses in Small Material Volumes. Invited plenary presentation
Vogel, D.; Auerswald, E.; Auersperg, J.; Rzepka, S.; Michel, B.
Conference Paper
2013Unterstützung von Haftfestigkeitsuntersuchungen am Interface zwischen Barriere und Dielektrikum – FE-Simulation des 4-Punkt-Biegeversuches
Braemer, B.; Hartwig, I.; Auersperg, J.; Hecker, M.; Rzepka, S.; Michel, B.
Conference Paper
2012Capturing interface toughness parameters from shear testing using different fracture mechanics approaches
Auersperg, J.; Dudek, R.; Brämer, B.; Pufall, R.; Seiler, B.; Michel, B.
Conference Paper
2012Determination of interface fracture parameters by shear testing using different theoretical approaches
Dudek, R.; Brämer, B.; Auersperg, J.; Pufall, R.; Walter, H.; Seiler, B.; Wunderle, B.
Conference Paper
2012Experimental and numerical methods for evaluation of interface cracks in electronics systems
Keller, J.; Schulz, M.; Wunderle, B.; Auersperg, J.; Michel, B.
Conference Paper
2012Local deformation and stress analysis in the micro-nano interface regions
Vogel, D.; Auerswald, E.; Dudek, R.; Auersperg, J.; Rzepka, S.; Michel, B.
Conference Paper
2012Nonlinear copper behavior of TSV and the cracking risks during BEoL-built-up for 3D-IC-integration
Auersperg, J.; Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B.
Conference Paper
2011Aspects of chip/package interaction and 3-D integration assessed by the investigation of crack and damage phenomena in low-k BEoL stacks
Auersperg, J.; Rzepka, S.; Michel, B.
Conference Paper
2011Interaction integral and mode separation for BEoL-cracking and -delamination investigations under 3D-IC integration aspects
Auersperg, J.; Dudek, R.; Oswald, J.; Michel, B.
Conference Paper
2011Nonlinear copper behavior of TSV for 3D-IC-integration and cracking risks during BEoL-built-up
Auersperg, J.; Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B.
Conference Paper
2010Crack and damage evaluation in low-k BEoL stacks under assembly and CPI aspects
Auersperg, J.; Vogel, D.; Lehr, M.U.; Grillberger, M.; Michel, B.
Conference Paper
2010Crack and damage in low-k BEoL stacks under assembly and CPI aspects
Auersperg, J.; Vogel, D.; Lehr, M.D.; Grillberger, M.; Michel, B.
Conference Paper
2010VCCT and integral concepts of Bi-material interface fracture in low-K structures - going to understand relation
Auersperg, J.; Dudek, R.; Michel, B.
Conference Paper
2009Advanced experimental and simulation approaches to meet reliability challenges of new electronics systems
Vogel, D.; Auersperg, J.; Michel, B.
Journal Article
2009Application of interfacial fracture mechanics approach for obtaining design rules for flip chip interconnections
Dressler, M.; Becker, K.-F.; Wunderle, B.; Auersperg, J.; Reichl, H.
Conference Paper, Journal Article
2009Crack and damage evaluation in low-k BEoL stacks under chip package interaction aspects
Auersperg, J.; Vogel, D.; Lehr, M.U.; Grillberger, M.; Michel, B.
Conference Paper
2009Crack and damage evaluation in low-k BEoL structures under CPI aspects
Auersperg, J.; Vogel, D.; Lehr, M.U.; Grillberger, M.; Michel, B.
Conference Paper
2009Crack and delamination risk evaluation in low-k BEoL stacks under chip package interaction aspects
Auersperg, J.; Vogel, D.; Lehr, M.U.; Grillberger, M.; Michel, B.
Conference Paper
2009Micro- and nanoreliability research in the micro materials center Chemnitz of Fraunhofer ENAS
Michel, B.; Dudek, R.; Auersperg, J.; Winkler, T.
Journal Article
2009Numerical approach to extraction of elasto-plastic material models and corresponding properties of thin layers through nanoindentation technique
Wymyslowski, A.; Wittler, O.; Mrossko, R.; Dudek, R.; Auersperg, J.; Dowhan, L.
Conference Paper
2008Challenges for multi-scale modeling of multiple failure modes in microelectronics
Auersperg, J.; Wunderle, B.; Dudek, R.; Walter, H.; Michel, B.
Conference Paper
2008Challenges for multi-scale modeling of multiple failure modes in microelectronics packaging
Auersperg, J.; Dudek, R.; Vogel, D.; Michel, B.
Conference Paper
2008Characterization of dual-stage moisture diffusion, residual moisture content and hygroscopic swelling of epoxy molding compounds
Shirangi, H.; Auersperg, J.; Koyuncu, M.; Walter, H.; Müller, W.H.; Michel, B.
Conference Paper
2008Incorporating Advanced Fatigue and Fracture Mechanics Based Failure Analysis into Design-Optimization of Electronics Components
Auersperg, J.; Michel, B.
Conference Paper
2007Fracture, delamination and fatigue evaluation within RSM/DOE concepts of enhanced smart systems
Auersperg, J.; Michel, B.
Conference Paper
2007Nanoreliability - Reliability Concepts for Micro-Nano Interface Regions
Michel, B.; Winkler, T.; Wunderle, B.; Auersperg, J.
Conference Paper, Journal Article
2007Nanoreliability - Zuverlässigkeitskonzepte für den Mikro-Nano-Übergangsbereich
Michel, B.; Winkler, T.; Wunderle, B.; Auersperg, J.
Conference Paper, Journal Article
2007Numerical Analysis for Thermo-Mechanical Reliability of Polymers in Electronic Packaging
Dudek, R.; Walter, H.; Auersperg, J.; Michel, B.
Conference Paper
2007Optimization and robust design of electronics assemblies under fracture, delamination and fatigue aspects
Auersperg, J.; Klein, M.; Michel, B.
Conference Paper
2007Optimization of Electronics Assemblies towards Robust Design under Fracture, Delamination and Fatigue Aspects
Auersperg, J.; Klein, M.; Michel, B.
Conference Paper
2007Reliability analysis for smart systems on the way from micro to nano
Michel, B.; Auersperg, J.; Vogel, D.
Conference Paper
2007Towards a robust design of electronics assemblies under fracture, delamination and fatigue aspects
Auersperg, J.; Michel, B.
Conference Paper
2006Capabilities of Incorporating Bulk Fracture, Bimaterial Interface Fracture and Fatigue Evaluation into RSM/DOE Concepts of Enhanced Microelectronics Applications
Auersperg, J.; Michel, B.
Conference Paper
2006Combined fracture, delamination risk and fatigue evaluation of advanced microelectronics applications towards RSM/DOE concepts
Auersperg, J.; Dudek, R.; Michel, B.
Conference Paper
2006FIB based measurement of local residual stresses on microsystems
Vogel, D.; Sabate, N.; Gollhardt, A.; Keller, J.; Auersperg, J.; Michel, B.
Conference Paper
2006FibDAC - residual stress determination by combination of focused ion beam technique and digital image correlation
Keller, J.; Gollhardt, A.; Vogel, D.; Auerswald, E.; Sabate, N.; Auersperg, J.; Michel, B.
Conference Paper
2006Identifying the reliability affecting parameters of SBB flip chip interconnections for automotive applications
Dreßler, M.; Rohde, H.; Liebing, G.; Becker, K.-F.; Wunderle, B.; Auersperg, J.; Reichl, H.
Conference Paper
2006Interface-Risse in Komponenten der Mikro- und Nanoelektronik
Auersperg, J.; Michel, B.; Walter, H.
Conference Paper
2006Parametric approach to numerical design for optimization of stacked packages
Dowhán, L.; Wymyslowski, A.; Dudek, R.; Auersperg, J.
Conference Paper
2006Simulation of Interface Cracks in Microelectronic Packaging
Auersperg, J.; Seiler, B.; Cadalen, E.; Dudek, R.; Michel, B.
Conference Paper
2006Verfahren zur Erfassung von lokalen Eigenspannungen in Festkoerperobjekten mit einer Ionenstrahltechnik
Auersperg, J.; Lieske, D.; Keller, J.; Vogel, D.; Michel, B.; Gollhardt, A.; Dost, M.
Patent
2005Crack and delamination risk evaluation of thin silicon based microelectronics devices
Auersperg, J.; Vogel, D.; Michel, B.
Conference Paper
2005fibDAC - A new Approach of Material Characterization for the Transition from Micro to Nano Scale
Vogel, D.; Sabaté, N.; Keller, J.; Auersperg, J.; Michel, B.
Conference Paper
2005Fracture Mechanics Based Crack and Delamination Risk Evaluation and RSM/DOE Concepts for Advanced Microelectronics Applications
Auersperg, J.; Seiler, B.; Cadalen, E.; Dudek, R.; Michel, B.
Conference Paper
2005Quantitative Analysis of the Adhesive Strength as Tool for the Reliability-focused Design of Micro-technical Structures
Seiler, B.; Auersperg, J.; Noack, E.; Lampke, T.; Dost, M.
Conference Paper
2005Thermo-mechanical Reliability Analysis of Magneto-resistive Current Sensors
Vogel, J.; Kaulfersch, E.; Schmitt, J.; Auersperg, J.; Döring, R.; Jost, F.; Kreyßig, K.; Walter, H.; Hölzl, J.
Conference Paper
2005Vibration measurements on smart electronic structures by means of laser techniques
Ruemmler, N.; Schnitzer, R.; Michel, B.; Auersperg, J.; Kaulfersch, E.
Conference Paper
2005Werkstoffcharakterisierung und FE-Analyse zur Beanspruchbarkeit von naturfaserverstärkten Verbundwerkstoffen
Walter, H.; Seeger, S.; Pohl, G.; Auersperg, J.; Keller, J.; Vogel, J.
Conference Paper
2004Crack and delamination risk evaluation of thin silicon applications based on fracture mechanics approaches
Auersperg, J.; Vogel, D.; Michel, B.
Conference Paper
2004Mikrospiegelanwendungen im Automobil
Wolter, J.; Alt, T.; Hanisch, H.; Ansorge, F.; Auersperg, J.; Rümmler, N.
Conference Paper
2004Modular parametric finite element modelling for reliability-studies in electronic and MEMS packaging
Wunderle, B.; Auersperg, J.; Grosser, V.; Kaulfersch, E.; Wittler, O.; Michel, B.
Journal Article
2004Vibration and Deformation Measurements of smart Electronic Structures by means of Laser Techniques
Rümmler, N.; Schnitzer, R.; Michel, B.; Auersperg, J.; Kaulfersch, E.
Book Article
2004Zuverlässigkeitsaspekte in Chip-in-Polymer-Applikationen
Auersperg, J.; Vogel, D.; Michel, B.
Conference Paper
2003Micromirror applications in automobile
Wolter, J.; Auersperg, J.; Erdl, H.; Rümmler, N.; Ansorge, F.; Reichl, H.
Abstract
2003Thermo-mechanical reliability aspects and finite element simulation in packaging
Dudek, R.; Auersperg, J.; Michel, B.; Reichl, H.
Conference Paper
2003Zuverlässigkeitsbewertung von MEMS-Komponenten im Mikro-Nano-Übergangsbereich
Michel, B.; Winkler, T.; Auersperg, J.
Conference Paper
2002Delamination risk evaluation for plastic packages based on mixed mode fracture mechanics approaches
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B.
Journal Article
2001Characterization of electronic packaging materials and components by image correlation methods
Vogel, D.; Auersperg, J.; Michel, B.
Conference Paper
2001Deformations- und Bruchverhalten von Mikrobauteilen aus Polymerverbunden
Michel, B.; Vogel, D.; Auersperg, J.
Conference Paper
2001Fracture mechanical analysis of cracks in polymer encapsulated metal structures
Wittler, O.; Sprafke, P.; Auersperg, J.; Michel, B.; Reichl, H.
Journal Article, Conference Paper
2001Gains and challenges of parameterized finite element modeling of microelectronics packages
Auersperg, J.; Döring, R.; Michel, B.
Journal Article, Conference Paper
2001Interface cracks and reliability in microsystems
Michel, B.; Auersperg, J.; Schubert, A.; Kühnert, R.
Conference Paper
2001Interfacial fracture toughness tests suited for reliability enhancements of advanced plastic packages
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B.
Conference Paper
2001Mixed mode interfacial fracture toughness evaluation for flip chip assemblies and CSP based on fracture mechanics approaches
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B.
Conference Paper
2001Mixed Mode Interfacial Fracture Toughness Evaluation for Flip-Chip Assemblies and CSP Based on Fracture Mechanics Approaches
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B.
Conference Paper
2000Characterization of Micro Materials and Micro Components by Combination of the Micro-Bending Test and UNIDAC
Michel, B.; Seiler, B.; Dost, M.; Wielage, B.; Kieselstein, E.; Winkler, T.; Dudek, R.; Auersperg, J.; Schubert, A.; Schneider, W.
Conference Paper
2000Fab integrated packaging (FIP): A new concept for high reliability wafer-level chip size packaging
Töpper, M.; Auersperg, J.; Glaw, V.; Kaskoun, K.; Prack, E.; Keser, B.; Coskina, P.; Jäger, D.; Petter, D.; Ehrmann, O.; Samulewicz, K.; Meinherz, C.; Fehlberg, S.; Karduck, C.; Reichl, H.
Conference Paper
2000Interface fracture investigations on micro components
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B.
Conference Paper
2000Interfacial Crack Evaluation by Means of FE-Compatible Image Matching
Kühnert, R.; Franke, H.; Meyer, R.; Schubert, A.; Auersperg, J.
Conference Paper
2000Investigation of interface cracking in electronic packages
Kieselstein, E.; Seiler, B.; Winkler, T.; Auersperg, J.; Dudek, R.; Schubert, A.; Schneider, W.; Michel, B.
Conference Paper
2000Mixed mode interfacial fracture toughness investigations for thermo-mechanical reliability enhancement of plastic packages
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B.
Conference Paper
2000Parameterization in finite element modeling of microelectronics packages
Auersperg, J.; Döring, R.; Dudek, R.; Michel, B.
Book Article
2000Simulation for fatigue, crack and delamination
Dudek, R.; Auersperg, J.; Michel, B.
Conference Paper
2000Simulation for fatigue, cracks and delamination
Dudek, R.; Auersperg, J.; Michel, B.
Conference Paper
2000Thermo-mechanical reliability enhancement of microelectronics
Auersperg, J.; Vogel, D.; Michel, B.
Conference Paper
2000Usage of Fracture Mechanical Integral Concept T* in Microelectronic Packaging Technique
Badri Ghavifekr, H.; Auersperg, J.; Michel, B.
Conference Paper
2000Wafer level package using double balls
Töpper, M.; Glaw, V.; Coskina, P.; Auersperg, J.; Samulewicz, K.; Lange, M.; Karduck, C.; Fehlberg, S.; Ehrmann, O.; Reichl, H.
Conference Paper
1999Analysis of field coupling effects in fracture by combining infrared thermography and FE-calculation
Vogel, J.; Dost, M.; Auersperg, J.; Faust, W.; Michel, B.
Journal Article
1999Damage and fracture evaluation in microelectronics assemblies by FEA and experimental investigations
Auersperg, J.; Winkler, T.; Michel, B.
Book Article
1999Entwicklung eines CSP auf Waferebene
Simon, J.; Auersperg, J.; Becker, K.-F.; Busse, E.; Heinricht, K.; Kallmayer, C.; Schütt, J.; Töpper, M.; Reichl, H.
Book Article
1999Fracture and damage evaluation in microelectronic assemblies by FEA
Auersperg, J.; Michel, B.
Conference Paper
1999Investigation of thermomechanical field coupling effects near crack tips by combining thermal emission analysis and FE-simulation
Vogel, J.; Auersperg, J.; Dost, M.; Faust, W.; Michel, B.
Book Article
1999Microscopic deformation field measurement supporting FEA based reliability analysis in electronic packaging
Vogel, D.; Gollhardt, A.; Kühnert, R.; Auersperg, J.; Michel, B.
Conference Paper
1998Chipanordnung und Verfahren zur Herstellung einer Chipanordnung
Reichl, H.; Auersperg, J.; Simon, J.; Aschenbrenner, R.; Kloeser, J.; Jung, E.
Patent
1998Damage and fracture evaluation in microelectronic assemblies by FEA and experimental investigations
Auersperg, J.; Winkler, T.; Vogel, D.; Michel, B.
Conference Paper
1998Nonlinear FEA for thermo-mechanical reliability. Estimation of advanced electronic packages
Auersperg, J.; Döring, R.; Dudek, R.; Michel, B.
Conference Paper
1998Thermomechanische Untersuchungen zur Zuverlässigkeitserhöhung von Mikrosystemen
Michel, B.; Faust, W.; Auersperg, J.
Conference Paper
1997Advanced deformation and failure analysis on flip chip assemblies
Vogel, D.; Caers, J.; Auersperg, J.; Schubert, A.; Michel, B.
Conference Paper
1997Comparison of different CSP approaches by means of numerical simulations
Auersperg, J.; Simon, J.; Schubert, A.; Michel, B.
Conference Paper
1997A critical review of chip scale packaging
Simon, J.; Auersperg, J.; Reichl, H.
Conference Paper
1997Deformation analysis on flip chip solder interconnects by MicroDAC
Vogel, D.; Auersperg, J.; Schubert, A.; Michel, B.; Reichl, H.
Conference Paper
1997Fracture and damage evaluation in chip scale packages and flip chip assemblies by FEA and MicroDAC
Auersperg, J.; Schubert, A.; Vogel, D.; Michel, B.; Reichl, H.
Conference Paper
1997Investigation of crack temperature fields by means of infrared thermography and FE calculations
Vogel, J.; Auersperg, J.; Dost, M.; Michel, B.
Conference Paper
1997Mechanical reliability study of FCOB and CSP assemblies by FEA and MicroDAC
Schubert, A.; Dudek, R.; Vogel, D.; Auersperg, J.; Michel, B.; Reichl, H.
Conference Paper
1997MicroDAC deformation measurement in packaging components
Vogel, D.; Langheinrich, M.; Auersperg, J.; Schubert, A.; Michel, B.
Conference Paper
1997The microDAC method. A powerful means for microdeformation analysis in electronic packaging
Michel, B.; Vogel, D.; Schubert, A.; Auersperg, J.; Reichl, H.
Conference Paper
1997Reliability evaluation of chip scale packages by FEA and MicroDAC
Auersperg, J.; Vogel, D.; Simon, J.; Schubert, A.; Michel, B.
Conference Paper
1997Thermo-mechanical reliability analysis of flip chip assemblies by combined MicroDAC and the Finite Element Method
Schubert, A.; Dudek, R.; Auersperg, J.; Vogel, D.; Michel, B.; Reichl, H.
Conference Paper
1997Thermo-mechanical reliability issues of flip chip structures used in DCA and CSP
Schubert, A.; Dudek, R.; Auersperg, J.; Vogel, D.; Michel, B.; Reichl, H.
Conference Paper
1995Bewertung der mechanischen Zuverlässigkeit mikrotechnischer Aufbauten mittels in-situ-Verformungsexperimenten im REM
Kühnert, R.; Tränkner, K.; Auersperg, J.; Michel, B.
Conference Paper
1995FEM-Anwendungen auf mechanisch-thermische Probleme in der Mikrotechnik
Auersperg, J.; Kaulfersch, E.; Dudek, R.; Michel, B.
Conference Paper
1994Experimental and numerical deformation analysis on components of microsystem technology
Michel, B.; Kühnert, R.; Auersperg, J.; Tränkner, K.
Conference Paper
1994Experimentelle und numerische Deformationsanalyse an Komponenten der Mikrosystemtechnik
Michel, B.; Kühnert, R.; Auersperg, J.; Tränkner, K.
Conference Paper
1994Mikroskopische Deformationsmessungen mittels Laserinterferometrie
Großer, V.; Bombach, C.; Auersperg, J.; Michel, B.
Conference Paper
1993Analysis of stress distributions in the crack tip surrounding
Auerswald, E.; Schubert, A.; Auersperg, J.; Kämpfe, B.
Book Article