Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2017Embedding technologies for heterogeneous integration of components in PCBs-an innovative modularisation approach with environmental impact
Manessis, Dionysios; Pawlikowski, Jakub; Ostmann, Andreas; Schischke, Karsten; Aschenbrenner, Rolf; Schneider-Ramelow, Martin; Krivec, Thomas; Podhradsky, Gerhard; Lang, Klaus-Dieter
Conference Paper
2017Forschung für die Elektroniksysteme von morgen
Aschenbrenner, Rolf
Presentation
2017Materials and Concepts for Textile Sensor Systems
Aschenbrenner, Rolf; Kallmayer, Christine
Presentation
2017Panel Level Embedding for Power and Sensor Applications
Aschenbrenner, Rolf
Presentation
2017Panel Level Packaging for Power Applications
Aschenbrenner, Rolf
Presentation
2017Panel processing for high volume/high mix manufacturing
Aschenbrenner, Rolf; Ostmann, Andreas
Conference Paper
2016Chip embedding - The key for efficient power electronics solutions
Aschenbrenner, Rolf
Presentation
2016Integration Technologies for Smart Textiles
Aschenbrenner, Rolf
Presentation
2016Panel Level Embedding for Power and Sensor Applications
Aschenbrenner, Rolf
Presentation
2015From fan-out wafer to fan-out panel level packaging
Braun, Tanja; Becker, Karl-Friedrich; Raatz, Stefan; Bader, Volker; Bauer, Jochen; Aschenbrenner, Rolf; Voges, Steve; Thomas, Tina; Kahle, Ruben; Lang, Klaus-Dieter
Conference Paper
2015Influence of humidity on reliability of plastic packages
Braun, Tanja; Bauer, Jörg; Becker, Karl-Friedrich; Hölck, Ole; Walter, Hans; Dijk, M. van; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2015Large area compression molding for Fan-out Panel Level Packing
Braun, Tanja; Raatz, Stefan; Voges, Steve; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Becker, Karl-Friedrich; Thomas, Tina; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2015Material and process trends for moving from FOWLP to FOPLP
Braun, Tanja; Voges, S.; Töpper, Michael; Wilke, Martin; Wöhrmann, M.; Maaß, Uwe; Huhn, Max; Becker, Karl-Friedrich; Raatz, Stefan; Kim, J.-U.; Aschenbrenner, Rolf; Lang, Klaus-Dieter; O'Connor, C.; Barr, R.; Calvert, J.; Gallagher, M.; Iagodkine, E.; Aoude, T.; Politis, A.
Conference Paper
2015Microelectronic Packaging in the 21st Century
: Aschenbrenner, Rolf; Schneider-Ramelow, Martin
Book
201424"×18" fan-out panel level packing
Braun, Tanja; Becker, Karl-Friedrich; Voges, Steve; Bauer, Jörg; Kahle, Ruben; Bader, V.; Thomas, Tina; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2014Adhesive-based self-alignment mechanisms for modular stacked microsystems
Braun, T.; Jagodzinska, Jagoda; Becker, Karl-Friedrich; Bauer, Jörg; Georgi, Leopold; Ostmann, Andreas; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2014Challenges and opportunities for Fan-out Panel Level Packaging (FOPLP)
Braun, Tanja; Becker, Karl-Friedrich; Voges, Steve; Thomas, Tina; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2014Fan-out wafer level packaging for MEMS and sensor applications
Braun, Tanja; Becker, Karl-Friedrich; Jung, Erik; Voges, Steve; Thomas, Tina; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2013Large-scale manufacturing of embedded subsystems-in-substrates and a 3D-stacking approach for a miniaturised medical system integration
Manessis, Dionysios; Podlasly, Andreas; Karaszkiewicz, Stefan; Ostmann, Andreas; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2013Panel level packaging - a manufacturing solution for cost-effective systems
Aschenbrenner, Rolf; Becker, Karl-Friedrich; Braun, Tanja; Ostmann, Andreas
Conference Paper
2012Enhancement of Humidity Barrier Properties of Polymers with Micro- and Nano-sized Filler Particles
Braun, Tanja; Bauer, Jörg; Georgi, Leopold; Becker, Karl-Friedrich; Koch, Mathias; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2012Innovation driver of the next decade: Heterogeneous integration
Lang, Klaus-Dieter; Pötter, Harald; Aschenbrenner, Rolf; Becker, Karl-Friedrich; Boettcher, Lars; Ehrmann, Oswin; Wilke, Martin; Toepper, Michael
Journal Article
20113D stacking approaches for mold embedded packages
Braun, Tanja; Becker, Karl-F.; Voges, Steve; Thomas, Tina; Töpper, Michael; Fischer, Thorsten; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2011NCA flip-chip bonding with thermoplastic elastomer adhesives
Foerster, Philipp; Linz, Torsten; Krshiwoblozki, Malte von; Walter, Hans; Kallmayer, Christine; Aschenbrenner, Rolf
Conference Paper
2011Novel approach for integrating electronics into textiles at room temperature using a force-fit interconnection
Simon, Erik; Kallmayer, Christine; Aschenbrenner, Rolf; Klaus-Dieter, Lang
Conference Paper
2011Potential of large area mold embedded packages with pcb based redistribution
Braun, Tanja; Becker, Karl-Friedrich; Böttcher, Lars; Ostmann, Andreas; Jung, Erik; Voges, Steve; Thomas, Tina; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Conference Paper
2011System Packaging by Embedding: Technologies, Examples and Perspectives
Löher, Thomas; Böttcher, Lars; Schütze, David; Karaszkiewicz, Stefan; Ostmann, Andreas; Aschenbrenner, Rolf
Conference Paper
2010Implementation of chip embedding processes for the creation of miniaturized system-in-packages
Böttcher, Lars; Manessis, Dionysios; Ostmann, Andreas; Karaszkiewicz, Stefan; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2005System integration technologies for smart textiles
Kallmayer, Christine; Linz, Torsten; Aschenbrenner, Rolf; Reichl, Herbert
Journal Article