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| 2018 | The Evolution of Panel Level Packaging
Aschenbrenner, R.; Töpper, M.; Braun, T.; Ostmann, A. | Conference Paper |
| 2018 | Fan-out wafer level packaging for 5G and mm-Wave applications
Braun, Tanja; Becker, K.-F.; Hoelck, O.; Kahle, R.; Woehrmann, M.; Toepper, M.; Ndip, I.; Maass, U.; Tschoban, C.; Aschenbrenner, R.; Voges, S.; Lang, K.-D. | Conference Paper |
| 2018 | Panel Level Packaging: A View Along the Process Chain
Braun, T.; Becker, K.-F.; Hölck, O.; Kahle, R.; Wöhrmann, M.; Böttcher, L.; Topper, M.; Stobbe, L.; Zedel, H.; Aschenbrenner, R.; Voges, S.; Schneider-Ramelow, M.; Lang, K.-D. | Conference Paper |
| 2017 | Development of a multi-project fan-out wafer level packaging platform
Braun, T.; Raatz, S.; Maass, U.; Dijk, M. van; Walter, H.; Hölck, O.; Becker, K.-F.; Töpper, M.; Aschenbrenner, R.; Wöhrmann, M.; Voges, S.; Huhn, M.; Lang, K.-D.; Wietstruck, M.; Scholz, R.F.; Mai, A.; Kaynak, M. | Conference Paper |
| 2017 | Embedding technologies for heterogeneous integration of components in PCBs-an innovative modularisation approach with environmental impact
Manessis, Dionysios; Pawlikowski, Jakub; Ostmann, Andreas; Schischke, Karsten; Aschenbrenner, Rolf; Schneider-Ramelow, Martin; Krivec, Thomas; Podhradsky, Gerhard; Lang, Klaus-Dieter | Conference Paper |
| 2017 | Forschung für die Elektroniksysteme von morgen
Aschenbrenner, Rolf | Presentation |
| 2017 | Materials and Concepts for Textile Sensor Systems
Aschenbrenner, Rolf; Kallmayer, Christine | Presentation |
| 2017 | Panel Level Embedding for Power and Sensor Applications
Aschenbrenner, Rolf | Presentation |
| 2017 | Panel Level Packaging for Power Applications
Aschenbrenner, Rolf | Presentation |
| 2017 | Panel processing for high volume/high mix manufacturing
Aschenbrenner, Rolf; Ostmann, Andreas | Conference Paper |
| 2017 | Trends in fan-out wafer and panel level packaging
Braun, T.; Becker, K.-F.; Wöhrmann, M.; Töpper, M.; Böttcher, L.; Aschenbrenner, R.; Lang, K.-D. | Conference Paper |
| 2016 | Chip embedding - The key for efficient power electronics solutions
Aschenbrenner, Rolf | Presentation |
| 2016 | Foldable fan-out wafer level packaging
Braun, T.; Becker, K.-F.; Raatz, S.; Minkus, M.; Bader, V.; Bauer, J.; Aschenbrenner, R.; Kahle, R.; Georgi, L.; Voges, S.; Wöhrmann, M.; Lang, K.-D. | Conference Paper |
| 2016 | Integration Technologies for Smart Textiles
Aschenbrenner, Rolf | Presentation |
| 2016 | Opportunities of fan-out wafer level packaging (FOWLP) for RF applications
Braun, T.; Töpper, M.; Becker, K.-F.; Wilke, M.; Huhn, M.; Maass, U.; Ndip, I.; Aschenbrenner, R.; Lang, K.-D. | Conference Paper |
| 2016 | Panel Level Embedding for Power and Sensor Applications
Aschenbrenner, Rolf | Presentation |
| 2016 | Potential and challenges of fan-out panel level packaging
Braun, T.; Becker, K.-F.; Kahle, R.; Raatz, S.; Töpper, M.; Aschenbrenner, R.; Voges, S.; Wöhrmann, M.; Lang, K.-D. | Conference Paper |
| 2015 | From fan-out wafer to fan-out panel level packaging
Braun, Tanja; Becker, Karl-Friedrich; Raatz, Stefan; Bader, Volker; Bauer, Jochen; Aschenbrenner, Rolf; Voges, Steve; Thomas, Tina; Kahle, Ruben; Lang, Klaus-Dieter | Conference Paper |
| 2015 | Influence of humidity on reliability of plastic packages
Braun, Tanja; Bauer, Jörg; Becker, Karl-Friedrich; Hölck, Ole; Walter, Hans; Dijk, M. van; Aschenbrenner, Rolf; Lang, Klaus-Dieter | Conference Paper |
| 2015 | Large area compression molding for Fan-out Panel Level Packing
Braun, Tanja; Raatz, Stefan; Voges, Steve; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Becker, Karl-Friedrich; Thomas, Tina; Aschenbrenner, Rolf; Lang, Klaus-Dieter | Conference Paper |
| 2015 | Material and process trends for moving from FOWLP to FOPLP
Braun, Tanja; Voges, S.; Töpper, Michael; Wilke, Martin; Wöhrmann, M.; Maaß, Uwe; Huhn, Max; Becker, Karl-Friedrich; Raatz, Stefan; Kim, J.-U.; Aschenbrenner, Rolf; Lang, Klaus-Dieter; O'Connor, C.; Barr, R.; Calvert, J.; Gallagher, M.; Iagodkine, E.; Aoude, T.; Politis, A. | Conference Paper |
| 2015 | Microelectronic Packaging in the 21st Century
: Aschenbrenner, Rolf; Schneider-Ramelow, Martin | Book |
| 2014 | A "microSD" sized RF transceiver manufactured as an embedded system-in-package
Manessis, D.; Karaszkiewicz, S.; Kierdorf, J.; Ostmann, A.; Aschenbrenner, R.; Lang, K.-D. | Conference Paper |
| 2014 | 24"×18" fan-out panel level packing
Braun, Tanja; Becker, Karl-Friedrich; Voges, Steve; Bauer, Jörg; Kahle, Ruben; Bader, V.; Thomas, Tina; Aschenbrenner, Rolf; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Adhesive-based self-alignment mechanisms for modular stacked microsystems
Braun, T.; Jagodzinska, Jagoda; Becker, Karl-Friedrich; Bauer, Jörg; Georgi, Leopold; Ostmann, Andreas; Aschenbrenner, Rolf; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Challenges and opportunities for Fan-out Panel Level Packaging (FOPLP)
Braun, Tanja; Becker, Karl-Friedrich; Voges, Steve; Thomas, Tina; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Fan-out wafer level packaging for MEMS and sensor applications
Braun, Tanja; Becker, Karl-Friedrich; Jung, Erik; Voges, Steve; Thomas, Tina; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Precision jetting of solder paste - a versatile tool for small volume production
Becker, K.-F.; Koch, M.; Voges, S.; Thomas, T.; Fliess, M.; Bauer, J.; Braun, T.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D. | Conference Paper |
| 2013 | From wafer level to panel level mold embedding
Braun, Tanja; Becker, K.-F.; Voges, S.; Thomas, T.; Kahle, R.; Bauer, J.; Aschenbrenner, R.; Lang, K.-D. | Conference Paper |
| 2013 | Large-scale manufacturing of embedded subsystems-in-substrates and a 3D-stacking approach for a miniaturised medical system integration
Manessis, Dionysios; Podlasly, Andreas; Karaszkiewicz, Stefan; Ostmann, Andreas; Aschenbrenner, Rolf; Lang, Klaus-Dieter | Conference Paper |
| 2013 | Panel level packaging - a manufacturing solution for cost-effective systems
Aschenbrenner, Rolf; Becker, Karl-Friedrich; Braun, Tanja; Ostmann, Andreas | Conference Paper |
| 2013 | Panel level packaging for LED lighting
Braun, T.; Bauer, J.; Becker, K.-F.; Kahle, R.; Bader, V.; Voges, S.; Jordan, R.; Aschenbrenner, R.; Lang, K.D. | Conference Paper |
| 2013 | Precision jetting of glob top materials - A methodology for process optimization
Becker, K.-F.; Koch, M.; Bauer, J.; Braun, T.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D. | Conference Paper |
| 2013 | Smart power module molding advances: Evaluating high temperature suitability of molding compounds
Becker, K.-F.; Thomas, T.; Bauer, J.; Kahle, R.; Braun, T.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D. | Conference Paper |
| 2013 | Transfer molding compounds for power electronic applications - a qualification methodology for HT capable materials
Braun, Tanja; Becker, K.-F.; Koch, M.; Thomas, T.; Amende, T.; Schreier-Alt, T.; Bader, V.; Bauer, J.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D. | Conference Paper |
| 2012 | Enhancement of barrier properties of encapsulants for harsh environment applications
Braun, T.; Bauer, J.; Georgi, L.; Becker, K.F.; Koch, M.; Aschenbrenner, R.; Lang, K.D. | Conference Paper |
| 2012 | Enhancement of Humidity Barrier Properties of Polymers with Micro- and Nano-sized Filler Particles
Braun, Tanja; Bauer, Jörg; Georgi, Leopold; Becker, Karl-Friedrich; Koch, Mathias; Aschenbrenner, Rolf; Lang, Klaus-Dieter | Conference Paper |
| 2012 | Heterogenous integration - packaging on and in organic substrates
Becker, Karl-Friedrich; Braun, T.; Bauer, J.; Böttcher, L.; Ostmann, A.; Pahl, B.; Haberland, J.; Kallmayer, C.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D. | Conference Paper |
| 2012 | Innovation driver of the next decade: Heterogeneous integration
Lang, Klaus-Dieter; Pötter, Harald; Aschenbrenner, Rolf; Becker, Karl-Friedrich; Boettcher, Lars; Ehrmann, Oswin; Wilke, Martin; Toepper, Michael | Journal Article |
| 2012 | Innovation Driver of the Next Decade: Technology Follows Application
Lang, K.-D.; Pötter, H.; Aschenbrenner, R.; Becker, K.-F.; Boettcher, L.; Ehrmann, O.; Wilke, M.; Toepper, M. | Book Article |
| 2012 | Large area mold embedding technology with PCB based redistribution
Braun, T.; Becker, K.-F.; Böttcher, L.; Ostmann, A.; Jung, E.; Voges, S.; Thomas, T.; Kahle, R.; Bader, V.; Bauer, J.; Aschenbrenner, R.; Schneider Ramelow, M.; Lang, K.-D. | Conference Paper |
| 2012 | Manufacturing of miniaturised microsystems for low power wireless body-area-networks (BAN) medical applications-technological challenges and achievements
Manessis, D.; Podlasly, A.; Ostmann, A.; Aschenbrenner, R.; Lang, K.-D. | Conference Paper |
| 2012 | Through mold via technology for multi-sensor stacking
Braun, T.; Brundel, M.; Becker, K.-F.; Kahle, R.; Piefke, K.; Scholz, U.; Haag, F.; Bader, V.; Voges, S.; Thomas, T.; Aschenbrenner, R.; Lang, K.-D. | Conference Paper |
| 2012 | Transfer molding technology for smart power electronics modules - materials and processes
Becker, K.-F.; Joklitschke, D.; Braun, T.; Koch, M.; Schreier-Alt, T.; Bader, V.; Bauer, J.; Nowak, T.; Aschenbrenner, R.; Schneider-Ramelow, M.; Thomas, T.; Bochow-Ness, O.; Lang, K.-D. | Conference Paper |
| 2012 | Transfer molding technology for smart power electronics modules: Materials and processes
Becker, K.-F.; Joklitschke, D.; Braun, T.; Koch, M.; Thomas, T.; Schreier-Alt, T.; Bader, V.; Bauer, J.; Nowak, T.; Bochow-Ness, O.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D. | Journal Article |
| 2011 | 3D stacking approaches for mold embedded packages
Braun, Tanja; Becker, Karl-F.; Voges, Steve; Thomas, Tina; Töpper, Michael; Fischer, Thorsten; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Lang, Klaus-Dieter | Conference Paper |
| 2011 | Chip embedding technology developments leading to the emergence of miniaturized system-in-packages
Manessis, D.; Böttcher, L.; Karaszkiewicz, S.; Ostmann, A.; Aschenbrenner, R.; Lang, K.-D. | Conference Paper |
| 2011 | NCA flip-chip bonding with thermoplastic elastomer adhesives
Foerster, Philipp; Linz, Torsten; Krshiwoblozki, Malte von; Walter, Hans; Kallmayer, Christine; Aschenbrenner, Rolf | Conference Paper |
| 2011 | Novel approach for integrating electronics into textiles at room temperature using a force-fit interconnection
Simon, Erik; Kallmayer, Christine; Aschenbrenner, Rolf; Klaus-Dieter, Lang | Conference Paper |
| 2011 | Potential of large area mold embedded packages with pcb based redistribution
Braun, Tanja; Becker, Karl-Friedrich; Böttcher, Lars; Ostmann, Andreas; Jung, Erik; Voges, Steve; Thomas, Tina; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Schneider-Ramelow, Martin; Lang, Klaus-Dieter | Conference Paper |
| 2011 | System Packaging by Embedding: Technologies, Examples and Perspectives
Löher, Thomas; Böttcher, Lars; Schütze, David; Karaszkiewicz, Stefan; Ostmann, Andreas; Aschenbrenner, Rolf | Conference Paper |
| 2011 | Through mold vias for stacking of mold embedded packages
Braun, T.; Becker, K.-F.; Voges, S.; Thomas, T.; Kahle, R.; Bader, V.; Bauer, J.; Piefke, K.; Krüger, R.; Aschenbrenner, R.; Lang, K.-D. | Conference Paper |
| 2010 | Chip embedding technology developments leading to the emergence of miniaturized system-in-packages
Manessis, D.; Boettcher, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2010 | Contactless handling and precision positioning of smallest components for assembly of microelectronics
Braun, T.; Bauer, J.; Becker, K.-F.; Kahle, R.; Jung, E.; Koch, M.; Mollath, G.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2010 | Implementation of chip embedding processes for the creation of miniaturized system-in-packages
Böttcher, Lars; Manessis, Dionysios; Ostmann, Andreas; Karaszkiewicz, Stefan; Aschenbrenner, Rolf; Lang, Klaus-Dieter | Conference Paper |
| 2010 | Investigation on thermo-mechanical reliability of flip-chip assemblies using anisotropic conductive adhesive
Kallmayer, C.; Walter, H.; Aschenbrenner, R.; Michel, B. | Conference Paper |
| 2010 | Large area embedding for heterogeneous system integration
Braun, T.; Becker, K.-F.; Böttcher, L.; Bauer, J.; Thomas, T.; Koch, M.; Kahle, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.; Bründel, M.; Haag, J.F.; Scholz, U. | Conference Paper |
| 2010 | Module miniaturization by ultra thin package stacking
Löher, T.; Schütze, D.; Ostmann, A.; Aschenbrenner, R. | Conference Paper |
| 2010 | Nano- und micro sized filler particles for improved humidity resistance of encapsulants
Braun, T.; Bauer, J.; Georgi, L.; Becker, K.-F.; Koch, M.; Thomas, T.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2010 | New packaging and interconnect technologies for ultra thin chips
Kallmayer, C.; Aschenbrenner, R.; Haberland, J.; Reichl, H. | Conference Paper |
| 2010 | Ultrathin 3D ACA flipchip-in-flex technology
Haberland, J.; Becker, M.; Lutke-Notarp, D.; Kallmayer, Ch.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2010 | Water diffusion in micro- and nano-particle filled encapsulants
Braun, T.; Georgi, L.; Bauer, J.; Koch, M.; Becker, K.-F.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2009 | Biocompatible lab-on-substrate technology platform
Braun, T.; Böttcher, L.; Bauer, J.; Bocchi, M.; Faenza, A.; Guerrieri, R.; Gambari, R.; Becker, K.-F.; Jung, E.; Ostmann, A.; Koch, M.; Kahle, R.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2009 | Heterogeneous Integration
Reichl, H.; Aschenbrenner, R.; Töpper, M.; Pötter, H. | Book Article |
| 2009 | Innovative approaches for realisation of embedded chip packages - technological challenges and achievements
Manessis, D.; Böttcher, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2009 | Lab-on-substrate technology platform
Braun, T.; Böttcher, L.; Bauer, J.; Jung, E.; Becker, K.-F.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Journal Article, Conference Paper |
| 2009 | A new package for textile integrated RFID tags
Vieroth, R.; Kallmayer, C.; Aschenbrenner, R.; Herbert, R. | Conference Paper |
| 2009 | Plastic packaging for high temperature applications
Braun, T.; Becker, K.-F.; Bauer, J.; Koch, M.; Bader, V.; Kahle, R.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2009 | Smart sensor systems - packaging technologies for multi-sensory consumer applications
Jung, E.; Becker, K.-F.; Braun, T.; Aschenbrenner, R. | Conference Paper |
| 2009 | Stretchable electronic systems: Realization and applications
Löher, T.; Seckel, M.; Vieroth, R.; Dils, C.; Kallmayer, C.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2009 | Verfahren zur Erzeugung metallisch kristalliner Oberflaechenstrukturen im Wege einer galvanischen Metallabscheidung
Schmidt, R.; Zwanzig, M.; Fiedler, S.; Ostmann, A.; Aschenbrenner, R. | Patent |
| 2008 | Contactless component handling on PCB using EWOD principles
Braun, T.; Becker, K.-F.; Koch, M.; Lienemann, J.; Kahle, R.; Bauer, J.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2008 | Evaluation of innovative nano-coated stencils in ultra-fine-pitch flip chip bumping processes
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2008 | Flex Technology for Foldable Medical Flip Chip Devices
Pahl, B.; Löher, T.; Burkhard, H.; Link, J.; Aschenbrenner, R. | Conference Paper |
| 2008 | Latest developments in bumping technologies for flip chip and WLCSP packaging
Manessis, D.; Aschenbrenner, R.; Ostmann, A.; Reichl, H. | Conference Paper |
| 2008 | Low Temperature Au-Au Flip Chip Interconnections
Pahl, B.; Zwanzig, M.; Fiedler, S.; Kallmayer, C.; Töpper, M.; Schmidt, R.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2008 | Micro to nano - scaling packaging technologies for future microsystems
Braun, T.; Becker, K.-F.; Bauer, J.; Hausel, F.; Pahl, B.; Wittler, O.; Mrossko, R.; Jung, E.; Ostmann, A.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2008 | More than moore, hetero system integration and smart system integration
Reichl, H.; Aschenbrenner, R.; Pötter, H.; Schmitz, S. | Book Article |
| 2008 | Nano-particle enhanced encapsulants for improved humidity resistance
Braun, T.; Hausel, F.; Bauer, J.; Wittler, O.; Mrossko, R.; Bouazza, M.; Becker, K.-F.; Oestermann, U.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2008 | Nano-Particle Filled Epoxy Resins with Improved Diffusion Barrier Functionality
Braun, T.; Hausel, F.; Bauer, J.; Wittler, O.; Mrossko, R.; Bouazza, M.; Becker, K.-F.; Oestermann, U.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H. | Journal Article, Conference Paper |
| 2008 | Reliable Encapsulation of Microsystems for Automotive Use
Becker, K.-F.; Braun, T.; Koch, M.; Bauer, J.; Wunderle, B.; Sommer, J.-P.; Aschenbrenner, R.; Reichl, H. | Conference Paper, Journal Article |
| 2008 | System-in-package solutions with embedded active and passive components
Aschenbrenner, R. | Conference Paper |
| 2007 | Heterogeneous integration: The bridge between micro/nanoelectronics and application
Aschenbrenner, R. | Conference Paper |
| 2007 | Lamination process studies for realisation of chip embedding technologies-current applications and technical challenges
Manessis, D.; Ostmann, A.; Yen, S.-F.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2007 | Microtechnology for realization of dielectrophoresis enhanced microwells for biomedical applications
Braun, T.; Böttcher, L.; Bauer, J.; Manessis, D.; Jung, E.; Ostmann, A.; Becker, K.-F.; Aschenbrenner, R.; Reichl, H.; Guerrieri, R.; Gambari, R. | Conference Paper |
| 2007 | New sensor packaging concept for avionic application
Aschenbrenner, R.; Jung, E.; Braun, T.; Oestermann, U.; Bauer, J.; Becker, K.-F.; Reichl, H. | Conference Paper |
| 2007 | Overmolded FC-SiP for miniaturized devices
Jung, E.; Koch, M.; Becker, K.-F.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2007 | Technical understanding of resin-coated-copper (RCC) lamination processes for realization of reliable chip embedding technologies
Manessis, D.; Yen, S.F.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2006 | Assembly and reliability of ultrathin flip chips on flexible substrates
Pahl, B.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2006 | A cost-effective alternative technology for wafer bumping - Electroless Ni/Au UBM deposition and ultra fine pitch printing of solder paste
Boettcher, L.; Ostmann, A.; Manessis, D.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2006 | Development of a nano-structure based interconnection technology
Aschenbrenner, R.; Fiedler, S.; Löher, T.; Pahl, B.; Becker, K.-F.; Reichl, H. | Presentation |
| 2006 | First results of the European project hiding dies
Aschenbrenner, R.; Ostmann, A. | Presentation |
| 2006 | Fully integrated EKG shirt based on embroidered electrical interconnections with conductive yarn and miniaturized flexible electronics
Linz, Torsten; Kallmayer, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2006 | High-temperature reliability of flip chip assemblies
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2006 | Improved reliability of leadfree flip chip assemblies using direct underfilling by transfer molding
Braun, T.; Wunderle, B.; Becker, K.-F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2006 | Innovative substrate technologies for new products
Aschenbrenner, R.; Löher, T.; Ostmann, A.; Kallmayer, C.; Scheel, W.; Reichl, H. | Conference Paper |
| 2006 | Lamination technology of Resin-Coated-Copper (RCC) films for chip and component embedding in printed circuit boards
Manessis, D.; Yen, S.-F.; Newmann, A.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2006 | Latest Technological Advancements in Stencil Printing Processes for Ultra-Fine-Pitch Flip Chip Bumping up to 60µm Pitch
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2006 | Nano-structured interconnects for system integration
Aschenbrenner, R.; Fiedler, S.; Löher, T.; Pahl, B.; Becker, K.-F.; Reichl, H. | Conference Paper |
| 2006 | Qualitative evaluation of flip chip solder bumps produced by stencil printing of solder paste on various electroless nickel/gold metallizations
Manessis, D.; Böttcher, L.; Patzelt, R.; Ostmann, A.; Schild, B.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2006 | Rapid tooling for high reliability transfer molded devices
Becker, K.-F.; Koch, M.; Gramckow, J.; Braun, T.; Bader, V.; Jung, E.; Lang, K.-D.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2006 | Super Thin Flip Chip Assemblies on Flex Substrates - Adhesive Bonding and Soldering Technology - Reliability Investigations and Applications
Haberland, J.; Pahl, B.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | The 2004 International Electronics Manufacturing Initiative (iNEMI) Technology Roadmaps
Aschenbrenner, R.; Pfahl, R.C.; Bird, J.M. | Conference Paper |
| 2005 | Chip in duromer technology for system in package realization
Becker, K.-F.; Braun, T.; Neumann, A.; Ostmann, A.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | Development of a scalelable interconnection technology for nano packaging
Becker, K.-F.; Löher, T.; Pahl, B.; Wittler, O.; Jordan, R.; Bauer, J.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | Duromer MID technology for system-in-package generation
Becker, K.-F.; Braun, T.; Neumann, A.; Ostmann, A.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.; Jung, E. | Journal Article |
| 2005 | Einbettung aktiver und passiver Komponenten in die Leiterplatte
Löher, T.; Pahl, B.; Haberland, J.; Vieroth, R.; Kallmeyer, C.; Neumann, A.; Böttcher, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2005 | Failure analysis of Sub-50 µm lead-free solder bumps on electroless Ni-P UBM for flip chip interconnects
Manessis, D.; Liang, M.; Loeher, T.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | Film coating - large area encapsulation process for electronics packaging
Becker, K.-F.; Braun, T.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | Film coatings as an encapsulation process for polymer electronics
Becker, K.-F.; Braun, T.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | Hetero System Integration - enabling technology for future products
Reichl, H.; Aschenbrenner, R.; Pötter, H. | Book Article |
| 2005 | High temperature potential of flip chip assemblies for automotive applications
Braun, T.; Becker, K.-F.; Sommer, J.-P.; Löher, T.; Schottenloher, K.; Kohl, R.; Pufall, R.; Bader, V.; Koch, M.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | Implementation of advanced ball printing technology for high yield bumping of wafer chip scale packages
Manessis, D.; Whitmore, M.; Staddon, M.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | Mikrosystemtechnik: Die klassischen Systemgrenzen lösen sich auf
Aschenbrenner, R.; Jung, E. | Journal Article |
| 2005 | A new wafer level packaging approach: Encapsulation, metallization and laser structuring for advanced system in package manufacturing
Becker, K.-F.; Braun, T.; Neumann, A.; Ostmann, A.; Coko, E.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2005 | Reliability potential of epoxy based encapsulants for automotive applications
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper, Journal Article |
| 2005 | Smart PCBs manufacturing technologies
Löher, T.; Neumann, A.; Böttcher, L.; Pahl, B.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | System integration technologies for smart textiles
Kallmayer, Christine; Linz, Torsten; Aschenbrenner, Rolf; Reichl, Herbert | Journal Article |
| 2005 | Technological advancements in lead-free wafer bumping using stencil printing technology
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | Ultrathin assemblies on flexible substrates
Pahl, B.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2004 | Area array contacts to assemble a 3D transfomer for a miniaturized voltage converter
Jung, E.; Kolesnik, I.; Becker, K.F.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2004 | Evolution of WLP: From Redristribution to 3-D Packaging and MEMS Packaging
Töpper, M.; Glaw, V.; Zoschke, K.; Jung, E.; Becker, K.-F.; Ehrmann, O.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2004 | From packaging to system integration – the paradigm shift in microelectronics
Wolf, M.J.; Reichl, H.; Adams, J.; Aschenbrenner, R. | Book Article |
| 2004 | Long-time reliability study of soldered flip chips on flexible substrates
Pahl, B.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2004 | Novel MEMS CSP to bridge the gap between development and manufacturing
Jung, E.; Wiemer, M.; Aschenbrenner, R.; Färber, A. | Conference Paper |
| 2004 | Process flow and manufacturing concept for embedded active devices
Aschenbrenner, R.; Ostmann, A.; Neumann, A.; Reich, H. | Conference Paper |
| 2004 | Stackable system-on-packages with integrated components
Becker, K.-F.; Jung, E.; Ostmann, A.; Braun, T.; Neumann, A.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2004 | Technical challenges of stencil printing technology for ultra-fine pitch flip-chip bumping
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2004 | Ultrathin soldered flip chip interconnections on flexible substrates
Pahl, B.; Loeher, T.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2004 | Verfahren zum Auftragen von Material auf einen Bereich eines elektrischen Bauteils
Manke, I.; Becker, K.; Ostmann, A.; Aschenbrenner, R.; Loeher, T. | Patent |
| 2004 | The world of electronic packaging and system integration
: Michel, B.; Aschenbrenner, R. | Book |
| 2003 | Chip in polymer: 3D integration of active circuitry in polymeric substrate
Jung, E.; Wojakowski, D.; Neumann, A.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2003 | Flip chip technology for high temperature automotive applications
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2003 | Gehaeustes Bauelement und Verfahren zu dessen Herstellung
Reichl, H.; Aschenbrenner, R.; Ansorge, F.; Becker, K.; Ehrlich, R.; Oppermann, H.; Azdasht, G. | Patent |
| 2003 | Innovative packaging concepts for ultrathin ICs
Klink, G.; Feil, M.; Ansorge, F.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2003 | Manufacturing Issues for 3D Integrated Active Circuits into Organic Laminate Substrates
Jung, E.; Wojakowski, D.; Neumann, A.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2003 | New assembly technologies for textile transponder systems
Kallmayer, C.; Pisarek, R.; Neudeck, A.; Cichos, S.; Gimpel, S.; Aschenbrenner, R.; Reichlt, H. | Conference Paper |
| 2003 | Packaging of an electronic-microfluidic hybrid sensor
Jung, E.; Assmann, R.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2003 | Reliability of integrated passive components
Haberland, J.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2003 | Stackable packages with integrated components
Ostmann, A.; Neumann, A.; Jung, E.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2003 | Stencil printing technology for 100 mum flip chip bumping
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2003 | Ultra thin chips for miniaturized products
Jung, E.; Ostmann, A.; Wojakowski, D.; Landesberger, C.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2003 | Wafer level encapsulation for system in package generation
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Manessis, D.; Neumann, A.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2002 | Bump formation for flip chip and CSP by solder paste printing
Kloeser, J.; Coskina, P.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2002 | Calculation of shape and experimental creation of AuSn solder bumps for flip chip applications
Hutter, M.; Oppermann, H.; Engelmann, G.; Wolf, J.; Ehrmann, O.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2002 | Development of an assembly process and reliability investigations for flip chip LEDs using AuSn soldering
Elger, G.; Hutter, M.; Oppermann, H.H.; Aschenbrenner, R.; Reichl, H.; Jäger, E. | Journal Article, Conference Paper |
| 2002 | Encapsulant characterization - valuable tools for process setup and failure analysis
Becker, K.F.; Braun, T.; Koch, M.; Vogel, D.; Aschenbrenner, R.; Reichl, H.; Hagedorn, H.W.; Neumann Rodekirch, J. | Conference Paper |
| 2002 | Flip chip molding - highly reliable flip chip encapsulation
Braun, T.; Becker, K.F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2002 | Flip chip molding - Recent progress in flip chip encapsulation
Braun, T.; Becker, K.F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2002 | Long time reliability of flip chip interconnections on flexible substrates
Pahl, B.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2002 | Modular systems for sensor integration
Klein, M.; Oppermann, H.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2002 | Packaging technologies for flexible systems
Kallmayer, C.; Bock, K.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2002 | Reliability investigations of hard core solder bumps using mechanical palladium bumps and SnPb solder
Oppermann, H.; Kalicki, R.; Anhöck, S.; Kallmayer, C.; Klein, M.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2002 | Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping
Manessis, D.; Patzelt, R.; Nieland, S.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2002 | Verfahren zum Bilden einer strukturierten Metallisierung auf einem Halbleiterwafer
Aschenbrenner, R.; Azdasht, G.; Zakel, E.; Ostmann, A.; Motulla, G. | Patent |
| 2002 | Wafer level encapsulation - a transfer molding approach to system in package generation
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Oystermann, U.; Manessis, D.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2001 | Advanced flip chip encapsulation: Transfer molding process for simultaneous underfiling and postencapsulation
Becker, K.-F.; Braun, T.; Koch, M.; Ansorge, F.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2001 | Fundamental studies of isotropic conductive adhesives focused on the current loadability of ICA for flip chip applications
Haberland, J.; Kallmeyer, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2001 | Innovative packaging concepts for ultra thin integrated circuits
Klink, G.; Feil, M.; Ansorge, F.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2001 | Integration of micro-mechatronics in automotive applications
Ansorge, F.; Becker, K.F.; Michel, B.; Leutenbauer, R.; Großer, V.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2001 | Lead free alloys for flip chip bumping
Jung, E.; Aschenbrenner, R.; Kallmayer, C.; Coskina, P.; Reichl, H. | Conference Paper |
| 2001 | Maßgeschneiderte Systemlösungen durch Packaging
Aschenbrenner, R.; Ostmann, A.; Becker, K.-F.; Jung, E.; Kallmeyer, C. | Journal Article |
| 2001 | New dicing and thinning concept improves mechanical reliability of ultra thin silicon
Landesberger, C.; Klink, G.; Schwinn, R.; Aschenbrenner, R. | Conference Paper |
| 2001 | Processing design rules for reliable reflowable underfill application
Kallmayer, C.; Becker, K.-F.; Jung, E.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2001 | A thermode bonding process for fine pitch flip chip applications down to 40 micron
Pahl, B.; Nieland, S.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2001 | Ultra thin chips for miniaturized applications
Jung, E.; Ostmann, A.; Wojakowski, D.; Landesberger, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2001 | Ultra thin chips for miniaturized products
Jung, E.; Ostmann, A.; Wojakowski, D.; Landesberger, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2001 | Verfahren und Vorrichtung zum Erzeugen einer leitfaehigen Struktur auf einem Substrat
Nieland, C.; Kallmayer, C.; Miessner, R.; Aschenbrenner, R.; Ostmann, A. | Patent |
| 2001 | Verfahren zur Herstellung kontaktloser Chipkarten und kontaktlose Chipkarte
Aschenbrenner, R.; Ansorge, F.; Zakel, E.; Kasulke, P. | Patent |
| 2001 | Wafer Level Burn-In (WLBI) for flip chip applications
Jung, E.; Aschenbrenner, R.; Wojakowski, D.; Reichl, H. | Conference Paper |
| 2000 | Advanced flip chip technologies in RF, microwave and MEMS applications
Oppermann, H.H.; Kallmayer, C.; Klein, M.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2000 | Avanzadas Tecnologias "Flip Chip"
Oppermann, H.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2000 | BGA packaging technology for rapid prototyping supported by advanced analytics
Becker, K.-F.; Ansorge, F.; Aschenbrenner, R.; Krause, F.; Kämpfe, B.; Reichl, H. | Conference Paper |
| 2000 | Comparison of flip chip technologies on rigid polyimide with respect to reliability and manufacturing costs
Mießner, R.; Aschenbrenner, R.; Reichl, H.; Ling, S.; Le, B.; Lew, A.; Benson, R.; Nhan, E. | Conference Paper |
| 2000 | Concepts for ultra thin packaging technologies
Aschenbrenner, R.; Ansorge, F.; Feil, M.; Landesberger, C.; Jung, E.; Ostmann, A.; Reichl, H. | Conference Paper |
| 2000 | Evaluation of flip chip bonding using ACA on polyester substrates
Mießner, R.; Nieland, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2000 | Immersion soldering - a new way for ultra fine pitch bumping
Nieland, S.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2000 | Integration of micro-mechatronics in automotive applications
Ansorge, F.; Becker, K.-F.; Michel, B.; Leutenbauer, R.; Großer, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2000 | Integration of micro-mechatronics in automotive applications using environmentally accepted materials
Ansorge, F.; Becker, K.-F.; Michel, B.; Leutenbauer, R.; Großer, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2000 | Lead free solders for area array packaging
Klöser, J.; Kallmayer, C.; Jung, E.; Coskina, P.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2000 | Lead free solders for area array packaging
Jung, E.; Klöser, J.; Kallmayer, C.; Coskina, P.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2000 | Low cost bumping by stencil printing
Kloeser, J.; Heinricht, K.; Jung, E.; Lauter, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2000 | A new approach for system integrated packaging
Aschenbrenner, R.; Jung, E.; Ostmann, A.; Landesberger, C.; Reichl, H. | Conference Paper |
| 2000 | Qualification of the system electroless nickel bumps and PbSn5 for high temperature applications
Anhöck, S.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2000 | Reliability of soldered nickel bumps for high temperature application
Anhöck, S.; Auerswald, E.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2000 | Study on reflowable underfill materials for different flip chip processes
Kallmayer, C.; Becker, K.-F.; Jung, E.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1999 | Advanced flip chip technologies
Oppermann, H.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1999 | Electroless plating on semiconductor wafers
Aschenbrenner, R.; Ostmann, A.; Reischl, H. | Conference Paper |
| 1999 | Reliability investigations of flip-chip solder bumps on palladium
Kallmayer, C.; Oppermann, H.; Kalicki, R.; Klein, M.; Anhöck, S.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1999 | Reliability of electroless nickel for high temperature applications
Anhöck, S.; Ostmann, A.; Oppermann, H.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1999 | Single chip bumping and reliability for flip chip processes
Klein, M.; Oppermann, H.; Kalicki, R.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 1999 | Verfahren zum Testen von mit einer Leiterbahnstruktur versehenen Substraten
Zakel, E.; Ansorge, F.; Kasulke, P.; Ostmann, A.; Aschenbrenner, R.; Dietrich, L. | Patent |
| 1999 | Verfahren zur Herstellung kontaktloser Chipkarten und kontaktlose Chipkarte
Aschenbrenner, R.; Ansorge, F.; Zakel, E.; Kasulke, P. | Patent |
| 1998 | Alternative solders for flip chip applications in the automotive environment
Jung, E.; Heinricht, K.; Klöser, J.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1998 | Characterization of adhesive materials for high circuit density applications
Aschenbrenner, R.; Mießner, R.; Becker, K.-F.; Reichl, H. | Conference Paper |
| 1998 | Chipanordnung und Verfahren zur Herstellung einer Chipanordnung
Reichl, H.; Auersperg, J.; Simon, J.; Aschenbrenner, R.; Kloeser, J.; Jung, E. | Patent |
| 1998 | Chipkarte
Aschenbrenner, R.; Zakel, E. | Patent |
| 1998 | Correlation of thermo-mechanical properties of adhesives with reliability of FC interconnections
Mießner, R.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1998 | Implementation of flip chip technology into volume manufacturing demonstration of processes
Jung, E.; Heinricht, K.; Kutzner, K.; Klöser, J.; Aschenbrenner, R.; Reichl, H.; Brommelhaus, A. | Conference Paper |
| 1998 | Influences of flip chip layout on the underfilling process
Becker, K.-F.; Schaub, M.; Mießner, R.; Ansorge, F.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1998 | Integration of flip chip assembly in the SMT process: manufacturing and productivity issues
Jung, E.; Klöser, J.; Heinricht, K.; Lauter, L.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1998 | Low cost bumping by stencil printing. Process qualification for 200 mu m pitch
Klöser, J.; Heinricht, K.; Jung, E.; Lauter, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1998 | Reliability aspects of molded BGA's related to material properties
Ehrlich, R.; Becker, K.-F.; Badri Ghavifekr, H.; Ansorge, F.; Aschenbrenner, R.; Reichl, H.; Sawai, K.; Tanaka, A.; Kumano, K.; Tenya, Y.; Chichon, M.; Hosokawa, H. | Conference Paper |
| 1998 | Reliability investigations for flip chip on flex using different solder materials
Kallmayer, C.; Oppermann, H.; Anhöck, S.; Azadeh, R.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1998 | Verfahren zum Herstellen von Palladiumkontaktbumps auf Halbleiterschaltungstraegern
Meyer, H.; Mahlkow, H.; Aschenbrenner, R. | Patent |
| 1997 | Adhesive flip chip bonding on flexible substrates
Aschenbrenner, R.; Mießner, R.; Reichl, H. | Journal Article, Conference Paper |
| 1997 | Adhesive flip chip bonding on flexible substrates
Aschenbrenner, R.; Mießner, R.; Reichl, H. | Journal Article, Conference Paper |
| 1997 | Chipkontaktierungsverfahren, damit hergestellte elektronische Schaltung und Traegersubstrat zur Kontaktierung von Chips
Aschenbrenner, R.; Zakel, E.; Oppermann, H.H.; Azdasht, G. | Patent |
| 1997 | Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps
Aschenbrenner, R.; Ostmann, A.; Motulla, G.; Zakel, E.; Reichl, H. | Journal Article |
| 1997 | Flip chip technology for multi chip modules
Jung, E.; Aschenbrenner, R.; Busse, E.; Reichl, H. | Conference Paper |
| 1997 | Flip-Chip-Verbindung mit nichtleitendem Klebmittel
Aschenbrenner, R.; Gwiasda, J.; Zakel, E.; Eldring, J. | Patent |
| 1997 | Herstellung galvanisch abgeformter Kontakthoecker
Aschenbrenner, R.; Ostmann, A.; Zakel, E.; Kasulke, P. | Patent |
| 1997 | Herstellung galvanisch/stromlos gestalteter Kontakthoecker
Aschenbrenner, R.; Ostmann, A.; Zakel, E.; Kasulke, P. | Patent |
| 1997 | Low cost flip chip technologies on chemical nickel bumping and solder printing
Kloeser, J.; Gwiasda, J.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.; Bechtold, F. | Journal Article |
| 1997 | A new production line for low cost flip chip assembly
Kutzner, K.; Kloeser, J.; Kappeler, U.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1997 | Recent progress in encapsulation technology and reliability investigation of mechatronic, CSP and BGA packages using flip chip interconnection technology
Ansorge, F.; Becker, K.-F.; Azdasht, G.; Ehrlich, R.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1997 | Recent progress in flexible molding and reliability investigation of CSP and BGA-packages using advanced interconnection technology
Becker, K.-F.; Ansorge, F.; Ehrlich, R.; Azdasht, G.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1996 | Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps
Aschenbrenner, R.; Ostmann, A.; Motulla, G.; Zakel, E.; Reichl, H. | Conference Paper |
| 1996 | Fluxless flip chip bonding on flexible substrates
Zakel, E.; Aschenbrenner, R.; Azdasht, G.; Klöser, J.; Reichl, H. | Journal Article |
| 1996 | Implementation of flip chip technology for BGA packages
Aschenbrenner, R.; Jung, E.; Becker, K.F.; Zakel, E.; Reichl, H. | Conference Paper |
| 1995 | Electroless Nickel/Copper plating as a new bump metallization
Aschenbrenner, R.; Ostmann, A.; Beutler, U.; Simon, J.; Reichl, H. | Journal Article |
| 1995 | Flip chip attachment using non-conductive adhesives and gold ball bumps
Aschenbrenner, R.; Gwiasda, J.; Eldring, J.; Zakel, E.; Reichl, H. | Journal Article |
| 1995 | Flip chip interconnection to organic substrates. A comparison between adhesive bonding and soldering
Jung, E.; Aschenbrenner, R.; Zakel, E.; Reichl, H. | Conference Paper |
| 1995 | Flip-Chip-Montage mit nichtleitenden Kunststoffolien und Gold-Ball-Bumps
Aschenbrenner, R.; Gwiasda, J.; Eldring, J.; Zakel, E.; Reichl, H. | Journal Article |
| 1995 | Fluxless flip chip bonding on flexible substrates
Aschenbrenner, R.; Zakel, E.; Azdasht, G.; Klöser, J.; Reichl, H. | Conference Paper |
| 1995 | Fluxless flip chip bonding on flexible substrates
Zakel, E.; Aschenbrenner, R.; Gwiasda, J.; Azdasht, G.; Ostmann, A.; Eldring, J.; Reichl, H.; Klöser, J. | Conference Paper |
| 1995 | Klebtechnologien für die Flip Chip Montage
Aschenbrenner, R.; Ostmann, A.; Zakel, E.; Reichl, H. | Conference Paper |
| 1995 | Lothoecker fuer die Flip-Chip-Montage und Verfahren zu dessen Herstellung
Aschenbrenner, R.; Zakel, E. | Patent |
| 1995 | Mechanical bumping for flipchip application
Jung, E.; Nave, J.; Aschenbrenner, R.; Reichl, H.; Zakel, E. | Conference Paper |
| 1995 | Mechanisches Bumping für die Flipchip Technologie
Eldring, J.; Jung, E.; Aschenbrenner, R.; Reichl, H.; Zakel, E. | Conference Paper |
| 1994 | Electroless Nickel/Copper plating as a new bump metallization
Aschenbrenner, R.; Ostmann, A.; Beutler, U.; Simon, J.; Reichl, H. | Conference Paper |
| 1994 | Flip Chip attachment using nonconductive adhesives and gold ball bumps
Aschenbrenner, R.; Gwiasda, J.; Eldring, J.; Zakel, E.; Reichl, H. | Conference Paper |
| 1994 | Gold ball bumps for adhesive flip chip assembly
Aschenbrenner, R.; Gwiasda, J.; Eldring, J.; Zakel, E.; Reichl, H. | Conference Paper |