Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Analysis of structured wire wafering processes to predict optimized process settings by varying particle size and wire diameter
Koepge, R.; Buehler, K.; Kaule, F.; Zeh, J.; Schoenfelder, S.; Anspach, O.
Conference Paper
2018Inline Characterization of Diamond Wire Sawn Multicrystalline Silicon Wafers
Haunschild, J.; Bergmann, N.; Hammer, T.; Krieg, K.; Kaden, T.; Anspach, O.; Schremmer, H.; Rein, S.
Conference Paper
2018Slurry Sawing of Multicrystalline Silicon with Low-Viscosity Carrier Liquid
Kaden, T.; Look, C.; Ischenko, V.; Gröschel, M.; Anspach, O.
Conference Paper
2016Inline quality rating of multi-crystalline wafers based on photoluminescence images
Demant, M.; Rein, S.; Haunschild, J.; Strauch, T.; Höffler, H.; Broisch, J.; Wasmer, S.; Sunder, K.; Anspach, O.; Brox, T.
Journal Article, Conference Paper
2014Loss of wire tension in the wire web during the slurry based multi wire sawing process
Meißner, D.; Schoenfelder, S.; Hurka, B.; Zeh, J.; Sunder, K.; Koepge, R.; Wagner, T.; Grün, A.; Hagel, H.-J.; Moeller, H.J.; Schwabe, H.; Anspach, O.
Journal Article
2012Enrichment of metal ions in virgin Si-surfaces
Meißner, D.; Meyer, S.; Anspach, O.
Conference Paper, Journal Article
2012Loss of wire tension in the wire web: Towards stable cutting conditions for all wafers
Meißner, D.; Hurka, B.; Zeh, J.; Sunder, K.; Koepge, R.; Wagner, T.; Moeller, H.-J.; Schoenfelder, S.; Anspach, O.
Conference Paper