Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2006Microsystem technologies for smart golf balls
Wolf, M.J.; Schmitz, S.; Amiri Jam, K.; Semionyk, P.; Grosser, V.; Lang, K.-D.
Journal Article
20053D-PCB-Packaging Technology for Electric and Fluidic Applications
Schindler-Saefkow, F.; Schramm, H.; Amiri Jam, K.; Gaßmann, S.
Presentation
2005Application of 3D-stacking technology for sensor integration and miniaturization
Amiri Jam, K.; Großer, V.; Lang, K.-D.; Reichl, H.
Conference Paper
2005Hochintegrierte 3D-Packages in PCB Technologie
Schindler-Saefkow, F.; Schramm, H.; Amiri Jam, K.; Meier, P.
Journal Article
2005Industrially compatible PCB stacking technology for miniaturized sensor systems
Lang, K.D.; Großer, V.; Amiri Jam, K.; Wolf, J.; Semionyk, P.; Schmitz, S.; Rochlitzer, R.; Prietzsch, D.; Reichl, H.
Conference Paper
2004A 3D-package technology for fluidic applications based on match-X
Schindler-Saefkow, F.; Amiri Jam, K.; Großer, V.; Reichl, H.
Conference Paper
2004Modular 3D Packages in PCB Technology
Schindler-Saefkow, F.; Amiri Jam, K.; Hillmann, V.; Großer, V.
Book Article
2004Test und Integration von MEMS in fluidisch-elektrischen 3D-Packages aus FR4
Amiri Jam, K.; Schindler-Saefkow, F.; Großer, V.; Reichl, H.
Conference Paper
2002A modular fluidic demonstrator for the Match-X framework
Schindler-Saefkow, F.; Amiri Jam, K.; Luczak, F.; Großer, V.; Michel, B.; Günther, G.
Conference Paper
2000Mechatronic solutions for modular MEMS
Amiri Jam, K.; Hillmann, V.; Braun, T.; Becker, K.-F.; Ansorge, F.; Großer, V.; Reichl, H.
Conference Paper
1998The Design methodology of 3D-HDI
Amiri Jam, K.; Leutenbauer, R.; Großer, V.; Simsek, A.; Reichl, H.
Conference Paper
1998The development of a modular 32 Bit microcontroller MCM in top bottom BGA (TB-BGA) technique
Leutenbauer, R.; Amiri Jam, K.; Reichl, H.
Conference Paper
1998Modulare Mikrosysteme aus dem Baukasten
Großer, V.; Schünemann, M.; Amiri Jam, K.; Leutenbauer, R.
Conference Paper