Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Au-Pd@Meso-Co3O4: A Promising Material for New Generation Pellistor with Low Working Temperature
Lyu, Xuemeng; Gao, Haitao; Diehle, Patrick; Altmann, Frank; Tarantik, Karina; Schmitt, Katrin; Wöllenstein, Jürgen
Conference Paper
2019Non-invasive soft breakdown localisation in low k dielectrics using photon emission microscopy and thermal laser stimulation
Herfurth, N.; Wu, C.; Beyreuther, A.; Nakamura, T.; Wolf, I. de; Simon-Najasek, M.; Altmann, F.; Croes, K.; Boit, C.
Journal Article
2018Failure Analysis Techniques for 3D Packages
Altmann, F.; Brand, S.; Petzold, M.
Conference Paper
2018Failure Analysis Techniques for 3D Packages
Altmann, F.; Brand, S.; Petzold, M.
Conference Paper
2018Fast and Distributed Thermal Model for Thermal Modeling of GaN Power Devices
Sodan, V.; Stoffels, S.; Oprins, H.; Decoutere, S.; Altmann, F.; Baelmans, M.; De Wolf, I.
Journal Article
2018Lock-In-Thermography, Photoemission, and Time-Resolved GHz Acoustic Microscopy Techniques for Nondestructive Defect Localization in TSV
Brand, S.; Altmann, F.
Journal Article
2018Non-destructive Assessment of the Porosity in Silver (Ag) Sinter Joints Using Acoustic Waves
Brand, S.; Böttge, B.; Kögel, M.; Naumann, F.; Zijl, J.; Kersjes, S.; Behrens, T.; Altmann, F.
Conference Paper
2018Physical failure analysis methods for wide band gap semiconductor devices
Graff, A.; Simon-Najasek, M.; Poppitz, D.; Altmann, F.
Conference Paper
20173D Localization of liner breakdown's within Cu filled TSV's by backside LIT and PEM defocusing series
Altmann, F.; Grosse, C.; Wolf, I. de; Brand, S.
Conference Paper
2017Acoustic and photoacoustic inspection of through-silicon vias in the GHz-frequency band
Brand, S.; Kögel, M.; Khaled, A.; DeWolf, I.; Moore, M.J.; Strohm, E.M.; Kolios, M.C.; Altmann, F.
Conference Paper
2017Exploring the thermal limit of GaN power devices under extreme overload conditions
Pribahsnik, F.P.; Nelhiebel, M.; Mataln, M.; Bernardoni, M.; Prechtl, G.; Altmann, F.; Poppitz, D.; Lindemann, A.
Journal Article
2017High resolution physical analysis of ohmic contact formation at GaN-HEMT devices
Graff, A.; Simon-Najasek, M.; Altmann, F.; Kuzmik, J.; Gregušová, D.; Haščík, Š.; Jung, H.; Baur, T.; Grünenpütt, J.; Blanck, H.
Journal Article
2017Interfacial void segregation of Cl in Cu-Sn micro-connects
Ross, G.; Tao, X.; Broas, M.; Mäntyoja, N.; Vuorinen, V.; Graff, A.; Altmann, F.; Petzold, M.; Paulasto-Kröckel, M.
Journal Article
2017On reproducing the copper extrusion of through-silicon-vias from the atomic scale
Liu, J.; Huang, Z.; Conway, P.P.; Altmann, F.; Petzold, M.; Naumann, F.
Conference Paper
2016Correlation of gate leakage and local strain distribution in GaN/AlGaN HEMT structures
Broas, M.; Graff, A.; Simon-Najasek, M.; Poppitz, D.; Altmann, F.; Jung, H.; Blanck, H.
Journal Article
2016Detection and analysis of stress-induced voiding in Al-power lines by acoustic GHz-microscopy
Brand, S.; Simon-Najasek, M.; Kögel, M.; Jatzkowski, J.; Portius, R.; Altmann, F.
Journal Article
2016HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature
Vogt, Holger; Altmann, Frank; Braun, Sebastian; Celik, Yusuf; Dietrich, Lothar; Dietz, Dorothee; Dijk, Marius van; Dreiner, Stefan; Döring, Ralf; Gabler, Felix; Goehlich, Andreas; Hutter, Matthias; Ihle, Martin; Kappert, Holger; Kordas, Norbert; Kokozinski, Rainer; Naumann, Falk; Nowak, Torsten; Oppermann, Hermann; Partsch, Uwe; Petzold, Matthias; Roscher, Frank; Rzepka, Sven; Schubert, Ralph; Weber, Constanze; Wiemer, Maik; Wittler, Olaf; Ziesche, Steffen
Conference Paper
2016Innovative failure analysis techniques for 3-D packaging developments
Altmann, F.; Petzold, M.
Journal Article
2016Magnetic field and current density imaging using off-line lock-in analysis
Kögel, M.; Altmann, F.; Tismer, S.; Brand, S.
Journal Article
2016Novel failure mode of chip corrosion at automotive HALL sensor devices under multiple stress conditions
Simon-Najasek, M.; Lorenz, G.; Lindner, A.; Altmann, F.
Journal Article
2016Reliability evaluation of Si-dies due to assembly issues
Naumann, F.; Gottschalk, V.; Burchard, B.; Altmann, F.
Journal Article
2015Acoustic GHz-microscopy and its potential applications in 3D-integration technologies
Brand, S.; Appenroth, T.; Naumann, F.; Steller, W.; Wolf, M.J.; Czurratis, P.; Altmann, F.; Petzold, M.
Conference Paper
2015Detailed functional characterization of glycosylated and nonglycosylated variants of malaria vaccine candidate PfAMA1 produced in Nicotiana benthamiana and analysis of growth inhibitory responses in rabbits
Boes, A.; Spiegel, H.; Edgue, G.; Kapelski, S.; Scheuermayer, M.; Fendel, R.; Remarque, E.; Altmann, F.; Maresch, D.; Reimann, A.; Pradel, G.; Schillberg, S.; Fischer, R.
Journal Article
2015Failure analysis strategies for multistacked memory devices with TSV interconnects
Altmann, F.; Grosse, C.; Naumann, F.; Beyersdorfer, J.; Veches, T.
Conference Paper
2015Regulatory approval and a first-in-human phase I clinical trial of a monoclonal antibody produced in transgenic tobacco plants
Ma, J.K.-C.; Drossard, J.; Lewis, D.; Altmann, F.; Boyle, J.; Christou, P.; Cole, T.; Dale, P.; van Dolleweerd, C.J.; Isitt, V.; Katinger, D.; Lobedan, M.; Mertens, H.; Paul, M.J.; Rademacher, T.; Sack, M.; Hundleby, P.A.C.; Stiegler, G.; Stoger, E.; Twyman, R.M.; Vcelar, B.; Fischer, R.
Journal Article
2015With electroluminescence microcopy towards more reliable AlGaN/GaN transistors
Baeumler, M.; Dammann, M.; Wespel, M.; George, R.; Konstanzer, H.; Maroldt, S.; Polyakov, V.M.; Müller, S.; Bronner, W.; Brueckner, P.; Benkhelifa, F.; Waltereit, P.; Quay, R.; Mikulla, M.; Wagner, J.; Ambacher, O.; Graff, A.; Altmann, F.; Simon-Najasek, M.; Lorenzini, M.; Fagerlind, M.; Wel, P. van der; Roedle, T.
Conference Paper
2014Advanced FIB sample preparation techniques for high resolution TEM investigations of HEMT structures
Simon-Najasek, M.; Huebner, S.; Altmann, F.; Graff, A.
Journal Article
2014Analytical ETL/EML layer investigation of blue OLEDs
Graff, A.; Altmann, F.; Dzwilewski, A.; Freitag, B.
Journal Article
2014Efficient nondestructive 3D defect localization by lock-in thermography utilizing multi-harmonics analysis
Naumann, F.; Altmann, F.; Grosse, C.; Herold, R.
Conference Paper
2014Innovative Material Diagnostics Methods for Through Silicon Via 266 Technologies
Altmann, F.; Brand, S.; Höche, T.; Krause, M.; Petzold, M
Book Article
2014Localization of weak points in thin dielectric layers by Electron Beam Absorbed Current (EBAC) imaging
Jatzkowski, J.; Simon-Najasek, M.; Altmann, F.
Conference Paper
2014Novel failure diagnostic methods for smart card systems
Klengel, S.; Brand, S.; Große, C.; Altmann, F.; Petzold, M.
Conference Paper
2014Site-specific metrology, inspection, and failure analysis of three-dimensional interconnects using focused ion beam technology
Altmann, F.; Young, R.J.
Journal Article
2013Aberration corrected TEM and Super-X STEM-EDXS characterization of high electron mobility transistor structures
Graff, A; Simon-Najasek, M.; Altmann, F.; Dammann, M.
Conference Paper
2013Defect analysis using high throughput plasma FIB in packaging reliability investigations
Altmann, F.; Klengel, S.; Schischka, J.; Petzold, M.
Conference Paper
2013Multiscale microstructures and microstructural effects on the reliability of microbumps in three-dimensional integration
Huang, Zhiheng; Xiong, Hua; Wu, Zhiyong; Conway, Paul; Altmann, Frank
Journal Article
2013Plant species and organ influence the structure and subcellular localization of recombinant glycoproteins
Arcalis, E.; Stadlmann, J.; Rademacher, T.; Marcel, S.; Sack, M.; Altmann, F.; Stoger, E.
Journal Article
2013Sample preparation strategies for fast and effective failure analysis of 3D devices
Kwakman, L.; Straw, M.; Coustillier, G.; Sentis, M.; Beyersdorfer, J.; Schischka, J.; Naumann, F.; Altmann, F.
Conference Paper
2012Application of lock-in thermography for failure analysis in integrated circuits using quantitative phase shift analysis
Schmidt, C.; Altmann, F.; Breitenstein, O.
Journal Article
2012Cross section analysis of Cu filled TSVs based on high throughput plasma-FIB milling
Altmann, F.; Beyersdorfer, J.; Schischka, J.; Krause, M.; Franz, G.; Kwakman, L.
Conference Paper
2012Emerging techniques for 3-D integrated system-in-package failure diagnostics
Altmann, F.; Petzold, M.
Journal Article
2012Enhanced comparison of lock-in thermography and magnetic microscopy for 3D defect localization of system in packages
Schmidt, C.; Altmann, F.; Vallett, D.P.
Conference Paper
2012Enhanced failure analysis on open TSV interconnects
Altmann, F.; Schmidt, C.; Beyersdorfer, J.; Simon-Najasek, M.; Große, C.; Schrank, F.; Kraft, J.
Conference Paper
2012Failure analysis using scanning acoustic microscopy for diagnostics of electronic devices and 3D system integration technologies
Czurratis, P.; Hoffrogge, P.; Brand, S.; Altmann, F.; Petzold, M.
Conference Paper
2012Microscopic degradation analysis of RF-stressed AlGaN/GaN HEMTs
Gütle, F.; Baeumler, M.; Dammann, M.; Cäsar, M.; Walcher, H.; Waltereit, P.; Bronner, W.; Müller, S.; Kiefer, R.; Quay, R.; Mikulla, M.; Ambacher, O.; Graff, A.; Altmann, F.; Simon, M.
Conference Paper
2012A new technique for non-invasive short-localisation in thin dielectric layers by electron beam absorbed current (EBAC) imaging
Simon-Najasek, M.; Jatzkowski, J.; Große, C.; Altmann, F.
Conference Paper
2012Novel techniques for dopant contrast analysis on real IC structures
Jatzkowski, J.; Simon-Najasek, M.; Altmann, F.
Journal Article, Conference Paper
2012Thermal investigations on CMOS integrated micro-hot-plates using IR thermography
Schmidt, C.; Altmann, F.; Mutinati, G.C.; Brunet, E.; Steinhauer, S.; Koeck, A.; Siegele, M.; Gamauf, C.; Nemecek, A.; Teva, J.; Kraft, J.; Siegert, J.; Schrank, F.; Kruschke, H.
Conference Paper
20113D Sensor application with open through silicon via technology
Kraft, J.; Schrank, F.; Teva, J.; Siegert, J.; Koppitsch, G.; Cassidy, C.; Wachmann, E.; Altmann, F.; Brand, S.; Schmidt, C.; Petzold, M.
Conference Paper
2011Characterization and failure analysis of TSV interconnects: From non-destructive defect localization to material analysis with nanometer resolution
Krause, M.; Altmann, F.; Schmidt, C.; Petzold, M.; Malta, D.; Temple, D.
Conference Paper
2011Characterization of thermo-mechanical stress and reliability issues for Cu-filled TSVs
Malta, D.; Gregory, C.; Lueck, M.; Temple, D.; Krause, M.; Altmann, F.; Petzold, M.; Weatherspoon, M.; Miller, J.
Conference Paper
2011Characterization of wafer-bonded joins using high-resolution transmission electron microscopy
Höche, T.; Graff, A.; Altmann, F.; Petzold, M.
Conference Paper, Journal Article
2011Failure diagnostics for 3D system integration technologies in microelectronics
Altmann, F.; Schmidt, C.; Brand, S.; Czurratis, P.; Petzold, M.
Conference Paper
2011From recombinant proteins to plant-made-pharmaceuticals
Stoger, E.; Rademacher, T.; Arcalis, E.; Sack, M.; Stiegler, G.; Altmann, F.; Fischer, R.
Journal Article
2011Quantitative phase shift analysis for 3D defect localization using lock-in thermography
Schmidt, C.; Altmann, F.
Conference Paper
2011Reliability and degradation mechanism of 0.25 µm AlGaN/GaN HEMTs under RF stress conditions
Dammann, M.; Baeumler, M.; Gütle, F.; Cäsar, M.; Walcher, H.; Waltereit, P.; Bronner, W.; Müller, S.; Kiefer, R.; Quay, R.; Mikulla, M.; Ambacher, O.; Graff, A.; Altmann, F.; Simon, M.
Conference Paper
2011Use of lock-in thermography for non-destructive 3D defect localization on system in package and stacked-die technology
Schlangen, R.; Motegi, S.; Nagatomo, T.; Schmidt, C.; Altmann, F.; Murakami, H.; Hollingshead, S.
Conference Paper
2010Application of lock-in thermography for backside failure localization using solid immersion lenses
Schmidt, C.; Große, C.; Altmann, F.; Schulz, J.; Seibt, A.
Conference Paper
2010The changing fate of a secretory glycoprotein in developing maize endosperm
Arcalis, E.; Stadlmann, J.; Marcel, S.; Drakakaki, G.; Winter, V.; Rodriguez, J.; Fischer, R.; Altmann, F.; Stoger, E.
Journal Article
2010Characterization and failure analysis of 3D integrated semiconductor devices-novel tools for fault isolation, target preparation and high resolution material analysis
Altmann, F.; Petzold, M.; Schmidt, C.; Salzer, R.; Cassidy, C.; Tesch, P.; Smith, N.
Conference Paper
2010Combined electron beam induced current imaging (EBIC) and focused ion beam (FIB) techniques for thin film solar cell characterization
Altmann, F.; Schischka, J.; Ngo, V. van; Stone, S.; Kwakman, L.F.T.; Lehmann, R.
Conference Paper
2010Dynamic lock-in thermography for operation mode-dependent thermally active fault localization
Schlangen, R.; Deslandes, H.; Lundquist, T.; Schmidt, C.; Altmann, F.; Yu, K.; Andreasyan, A.; Li, S.
Conference Paper, Journal Article
2010Failure diagnostics for 3D system integration technologies in microelectronics
Altmann, F.; Schmidt, C.; Brand, S.; Czurratis, P.; Petzold, M.
Conference Paper
2010Fehlermechanismen an Leiterplattenmetallisierungen für bleifrei gelötete Packageaufbauten
Bennemann, S.; Simon, M.; Petzold, M.; Altmann, F.
Conference Paper
2010Hochauflösende Metrologie für die Mikro-Nanointegration
Krause, M.; Klengel, R.; Cismak, A.; Petzold, M.; Altmann, F.
Conference Paper
2010Localization of electrical defects in system in package devices using lock-in thermography
Schmidt, C.; Grosse, C.; Altmann, F.
Conference Paper
2010Micro structure analysis for system in package components - novel tools for fault isolation, target preparation, and high-resolution material diagnostics
Petzold, M.; Altmann, F.; Krause, M.; Salzer, R.; Schmidt, C.; Martens, S.; Mack, W.; Dömer, H.; Nowodzinski, A.
Conference Paper
2010Non-destructive defect depth determination at fully packaged and stacked die devices using Lock-in Thermography
Schmidt, C.; Altmann, F.; Schlangen, R.; Deslandes, H.
Conference Paper
2010Optimal nitrogen supply as a key to increased and sustained production of a monoclonal full-size antibody in BY-2 suspension culture
Holland, T.; Sack, M.; Rademacher, T.; Schmale, K.; Altmann, F.; Stadlmann, J.; Fischer, R.; Hellwig, S.
Journal Article
2010Quantitative assessment of TEM-sample warping caused by FIB preparation
Salzer, R.; Graff, A.; Simon, M.; Altmann, F.
Abstract
2010Strain determination using electron backscatter diffraction
Krause, M.; Graff, A.; Altmann, F.
Conference Paper
2009Application of He ion microscopy for material analysis
Altmann, F.; Simon, M.; Klengel, R.
Conference Paper
2009Failure analysis of stacked-die devices by combining non-destructive localization and target preparation methods
Schmidt, C.; Simon, M.; Altmann, F.; Nowodzinski, A.
Conference Paper
2009Reliability characterization and process optimization of Ni-based microinsert interconnections for flip chip die on wafer attachment
Boutry, H.; Brun, J.; Nowodzinski, A.; Sillon, N.; Depoutot, F.; Dubois-Bonvalot, B.; Schmidt, C.; Simon, M.; Altmann, F.
Conference Paper
2009Standard free thickness determination of thin TEM samples via backscatter electron image correlation
Salzer, R.; Graff, A.; Simon, M.; Altmann, F.
Conference Paper
2009Standard free thickness determination of thin TEM samples via backscatter electron image correlation
Salzer, R.; Graff, A.; Simon, M.; Altmann, F.
Conference Paper, Journal Article
2009Surface amorphization, sputter rate, and intrinsic stresses of silicon during low energy Ga+ focused-ion beam milling
Pastewka, L.; Salzer, R.; Graff, A.; Altmann, F.; Moseler, M.
Conference Paper, Journal Article
2009Thermal simulation of defect localisation using lock-in thermography in complex and fully packaged devices
Schmidt, C.; Naumann, F.; Altmann, F.; Martens, S.; Wilde, J.
Conference Paper
2008Application of lock-in-thermography for 3D defect localisation in complex devices
Schmidt, C.; Altmann, F.; Grosse, C.; Naumann, F.; Lindner, A.
Conference Paper
2008Lock-in-thermography for 3- dimensional localization of electrical defects inside complex packaged devices
Schmidt, C.; Altmann, F.; Grosse, C.; Lindner, A.; Gottschalk, V.
Conference Paper
2008Reducing of ion beam induced surface damaging using »low voltage«
Salzer, R.; Simon, M.; Graff, A.; Altmann, F.; Pastewka, L.; Moseler, M.
Conference Paper
2007Investigation of cell-sensor hybrid structures by Focused Ion Beam (FIB) technology
Heilmann, A.; Altmann, F.; Cismak, A.; Baumann, W.; Lehmann, M.
Conference Paper
2007Long-term stability of composite cathode at high current densities
Kusnezoff, M.; Trofimenko, N.; Mosch, S.; Beckert, W.; Graff, A.; Altmann, F.
Conference Paper, Journal Article
2007Verfahren zur Detektion von durch Unterbrechungen charakterisierbare Fehlstellen in Leitbahnnetzwerken
Altmann, F.; Riediger, T.
Patent
2006Analyseverfahren, zerstörende Analyse und hochauflösende Diagnostik
Petzold, M.; Altmann, F.; Wilde, J.; Schneider-Ramelow, M.
Book Article
2006Influence of intermetallic phases on reliability in thermosonic Au-Al wire bonding
Müller, T.; Schräpler, L.; Altmann, F.; Knoll, H.; Petzold, M.
Conference Paper
2006The intracellular fate of a recombinant protein is tissue-dependent
Drakakaki, G.; Marcel, S.; Arcalis, E.; Altmann, F.; Gonzalez-Melendi, P.; Fischer, R.; Christou, P.; Stoger, E.
Journal Article
2006Inversion of microscopic lock-in thermograms in the presence of emissivity contrast
Breitenstein, O.; Altmann, F.
Journal Article
2006Lock-in infrared microscopy with 1.4. µm resolution by using a solid immersion lens
Breitenstein, O.; Altmann, F.; Riediger, T.; Karg, D.
Journal Article
2006Lock-in thermal IR imaging using a solid immersion lens
Breitenstein, O.; Altmann, F.; Riediger, T.; Karg, D.; Gottschalk, V.
Conference Paper, Journal Article
2006Mikrogreifer
Große, C.; Altmann, F.; Simon, M.; Hoffmeister, H.; Riemer, D.
Patent
2006TEM-Präparation mittels "low-voltage-FIB"
Altmann, F.; Graff, A.; Simon, M.; Hoffmeister, H.; Gnauck, P.
Journal Article
2006Use of a solid immersion lens for thermal IR imaging
Breitenstein, O.; Altmann, F.; Riediger, T.; Karg, D.; Gottschalk, V.
Conference Paper
2005TEM-Zielpräparation unter REM-Beobachtung mittels Zweistrahl-FIB
Altmann, F.
Journal Article
2004New developments in IR lock-in thermography
Breitenstein, O.; Rakotoniaina, J.P.; Al Rifai, M.H.; Gradhand, M.; Altmann, F.; Riediger, T.
Conference Paper
2004Unexpected deposition patterns of recombinant proteins in post-endoplasmic reticulum compartments of wheat endosperm
Arcalis, E.; Marcel, S.; Altmann, F.; Kolarich, D.; Drakakaki, G.; Fischer, R.; Christou, P.; Stoger, E.
Journal Article
2004Zielgenaue Präparation von Proben für die Transmissionselektronenmikroskopie
Altmann, F.; Katzer, D.
Journal Article
2003FIB-pinpointed preparation of TEM samples by a needle based manipulator (lift-out) technique
Altmann, F.
Journal Article
2003FIB-Zielpräparation von TEM-Proben mittels Nadelmanipulationstechnik
Altmann, F.
Journal Article
2002Fault localization and functional testing of ICs by lock-in thermography
Breitenstein, O.; Rakotoniaina, J.P.; Altmann, F.; Schulz, J.; Linse, G.
Conference Paper
2002Lock-In IR-Thermography - A Novel Tool for Material and Device Characterization
Huth, S.; Breitenstein, O.; Huber, A.; Danz, D.; Lambert, U.; Altmann, F.
Journal Article
2002Verfahren und Vorrichtung zur Untersuchung von Waermequellen innerhalb einer elektrisch leitendes Material aufweisenden Probe
Altmann, F.
Patent
2000Microscopic lock-in thermography investigation of leakage sites in integrated circuits
Breitenstein, O.; Langenkamp, M.; Altmann, F.; Katzer, D.; Lindner, A.; Eggers, H.
Journal Article
1999Cross-sectional specimen preparation from ICs downside for SEM and TEM-failure analysis using focused ion beam etching
Altmann, F.; Katzer, D.
Journal Article
1999Determination of the pore size and the vertical structure of nanoporous aluminium oxide membranes
Heilmann, A.; Altmann, F.; Katzer, D.; Müller, F.; Sawitowski, T.; Schmid, G.
Journal Article
1999Einsatz von Elektronen- und Ionenstrahltechniken für die Diagnose an glasartigen Systemen
Füting, M.; Altmann, F.; Berthold, L.; Petzold, M.
Conference Paper
1997Strain measurement by means of convergent beam electron diffraction in submicron volumes
Langer, E.; Altmann, F.; Katzer, D.; Neumann, W.
Conference Paper
1996Messung mechanischer Spannungen in Mikrokomponenten mittels konvergenter Beugung (CBED) im TEM
Altmann, F.
Thesis